公开(公告)号：US11945924B2

公开(公告)日：2024-04-02

申请号：US17766440

申请日：2020-12-17

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Songgang Chai ,  Qianfa Liu ,  Liangpeng Hao ,  Wei Liang

IPC: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/0373 ,  C08J2327/18 ,  C08J2427/18 ,  C08J2471/02 ,  C08K2201/005 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  H05K2201/0209

Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

公开(公告)号：US20230063436A1

公开(公告)日：2023-03-02

申请号：US17788966

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao HUANG ,  Huayong FAN ,  Yongjing XU ,  Jianlong HUANG ,  Naidong SHE

IPC: C08L51/06 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03

Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

公开(公告)号：US20230045848A1

公开(公告)日：2023-02-16

申请号：US17789005

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayong FAN ,  Zengbiao HUANG ,  Yongjing XU

IPC: C08L47/00 ,  C08J5/04 ,  B32B15/20

Abstract: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

公开(公告)号：US20220210914A1

公开(公告)日：2022-06-30

申请号：US17605820

申请日：2020-01-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Yongjing XU ,  Yongming ZHU

IPC: H05K1/03 ,  H05K1/09 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08L9/00 ,  C08L9/06 ,  C08L51/08

Abstract: A copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less than 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than −158 dBc (700 MHz/2600 MHz).

公开(公告)号：US20220153989A1

公开(公告)日：2022-05-19

申请号：US17437555

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang HE ,  Yongnian QI ,  Xianping ZENG ,  Zhongqiang YANG ,  Hualin PAN

IPC: C08L63/04 ,  C08J5/24 ,  C08K3/013 ,  C08K5/00

Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

公开(公告)号：US20220056260A1

公开(公告)日：2022-02-24

申请号：US17415620

申请日：2018-12-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Junqi TANG ,  Zhiguang LI

IPC: C08L63/00 ,  C08G59/62 ,  C08J5/24 ,  C08K3/013

Abstract: An epoxy resin composition, and a prepreg, a laminate, and a metal foil-clad laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-clad laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion. The formulas are:

公开(公告)号：US20220056225A1

公开(公告)日：2022-02-24

申请号：US17417901

申请日：2019-03-06

Applicant: Shengyi Technology Co., Ltd.

Inventor： Zhenwen CHEN

IPC: C08J5/24 ,  C08L45/00 ,  C08L79/04 ,  C08L63/00 ,  H05K1/03 ,  H05K1/05 ,  B32B15/092

Abstract: The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

公开(公告)号：US20210221743A1

公开(公告)日：2021-07-22

申请号：US16770004

申请日：2018-03-23

Applicant: Shengyi Technology Co., Ltd.

Inventor： Zengbiao HUANG

IPC: C04B35/583 ,  C08K5/14 ,  C08L53/02 ,  C08K5/03 ,  C08K3/36 ,  C04B35/63 ,  C08K5/00 ,  C08J5/24 ,  C01B21/064

Abstract: Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.

公开(公告)号：US20200332109A1

公开(公告)日：2020-10-22

申请号：US16849041

申请日：2020-04-15

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Naidong SHE ,  Zengbiao HUANG

IPC: C08L63/00 ,  C09D163/00 ,  C09D7/61 ,  B32B15/20 ,  B32B15/04 ,  B32B7/12 ,  B32B15/18

Abstract: The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.

公开(公告)号：US10696844B2

公开(公告)日：2020-06-30

申请号：US15120549

申请日：2015-02-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Yueshan He ,  Biwu Wang

IPC: B32B27/38 ,  B32B27/20 ,  B32B27/42 ,  B32B15/08 ,  B32B27/28 ,  C08L79/04 ,  C08L63/00 ,  C08J5/24 ,  H05K1/03 ,  C08K5/5399 ,  C08K5/521 ,  B32B27/16 ,  C08L79/08 ,  C08K5/3445 ,  C08K3/36 ,  C08L61/06 ,  C08L61/34 ,  C08K3/22 ,  B32B15/092 ,  B32B27/18

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.