Abstract:
도금층으로 둘러싸인 분할된 서브 디지트 라인들을 갖는 자기 램 셀들 및 그 제조방법들이 제공된다. 상기 자기 램 셀들은 반도체기판 상부에 형성된 제1 및 제2 서브 디지트 라인들을 구비한다. 상기 제1 서브 디지트 라인의 하부면 및 상기 제1 서브 디지트 라인의 상기 하부면에 인접하면서 상기 제2 서브 디지트 라인의 반대편에 위치하는 외측벽(outer sidewall)은 제1 도금층 패턴으로 덮여진다. 이와 마찬가지로, 상기 제2 서브 디지트 라인의 하부면 및 상기 제2 서브 디지트 라인의 상기 하부면에 인접하면서 상기 제1 서브 디지트 라인의 반대편에 위치하는 외측벽은 제2 도금층 패턴으로 덮여진다. 상기 제1 및 제2 서브 디지트 라인들 및 상기 제1 및 제2 도금층 패턴들은 층간절연층 내에 그루브를 형성하고, 상기 그루브의 측벽들 및 바닥면을 덮는 도금층 패턴과 아울러서 상기 도금층 패턴에 의해 둘러싸여진 공간을 채우는 디지트 라인을 형성하고, 상기 디지트 라인 및 도금층 패턴을 패터닝함으로써 형성된다.
Abstract:
본 발명은 네트웍 관리 인터페이스 제공 방법에 관한 것으로, 특히 TL-1을 이용한 원격 장비관리에 있어서 통신 네트웍 계층과 무관하게 데이터 송수신이 가능하도록 함으로써 네트웍을 관리할 수 있도록 하는 네트웍 관리 방법에 관한 것이다. 본 발명은 관리정보를 물리적으로 전송하는 하위 전송 계층에 의존적이지 않고, 외부 관리장비에게 올바른 해당 NE 의 관리 정보를 제공하기 위한 메시지를 목적지 NE 의 프락시(proxy)타스크에서 처리하도록 함으로써 효율적으로 NE 를 관리할 수 있도록 하였다. 이에 따라 별개의 통신 시스템에 대해서도 최소의 작업만으로 매니지먼트 인터페이스 적용이 가능하게 되었다.
Abstract:
A method of forming a semiconductor device including landing pads is provided to restrain damage of an interlayer dielectric in a cleaning process by preventing exposure of a wiring contact hole in a process for forming a wiring contact hole. A plurality of parallel gate patterns are formed on a semiconductor substrate(20). Each of the parallel gate patterns includes a lamination of a gate insulating layer(22), a gate electrode(23), and a mask insulating layer(24). A plurality of insulating layer spacers(25) are formed to cover sidewalls of the gate patterns. A first interlayer dielectric(26) is formed on the semiconductor substrate by using a material layer having etch selectivity to the mask insulating layers and the insulating layer spacers. A self-aligned contact hole is formed by patterning the first interlayer dielectric. A landing pad(27a) is formed to fill the self-aligned contact hole. Each upper surface of the mask insulating layers is exposed by etching back the first interlayer dielectric. A second interlayer dielectric(28) is formed on the semiconductor substrate. A wiring contact hole(28a) is formed by patterning the second interlayer dielectric.
Abstract:
PURPOSE: An alarm masking method using a tree-type hierarchical structure and a recorded medium therefor are provided to perform an alarm masking process for a generated alarm, and to stratify an alarm masking hierarchical structure, thereby managing the alarm at a high speed as well as improving system performance. CONSTITUTION: A system moves to a fault node(S1), and decides whether a child node exists(S2). If so, the system moves to another fault node, and decides whether a child node exists in the fault node(S2). If so, the system moves to another fault node(S3). The system decides whether a child node exists in the fault node(S2). If not, the system decides whether the corresponding node is a desirous node(S4). If not, the system decides whether a sibling node exists(S5). If so, the system moves to another fault node(S6). If the sibling node does not exist, the system moves to the fault node which is a parent node(S7).
Abstract:
PURPOSE: A CVD(Chemical Vapor Deposition) equipment having a latch for locking a boat and a method for manufacturing a semiconductor device using the same are provided to be capable of preventing the generation of particles by improving the connecting state between a boat and a boat cap by using a latch. CONSTITUTION: A CVD equipment is provided with cylindrical heater part, an outer tube having a closed upper portion located in the heater part, an inner tube having an opened upper portion located in the outer tube, a boat loaded into the inner tube, and a loader part having a boat cap(100) capable of loading the boat on the upper portion of the boat cap. The boat cap(100) further includes a plurality of fixing pins(110,120) and a latch(112) formed at the fixing pin(110) for completely locking the boat and boat cap. Preferably, the fixing pins are located at the edge portion of the boat cap.
Abstract:
The present invention provide integrated circuit devices and methods of fabricating the same that include a microelectronic substrate and a conductive layer disposed on the microelectronic substrate. An insulating layer is disposed on the conductive layer and the insulating layer includes an overhanging portion that extends beyond the conductive layer. A sidewall insulating region is disposed laterally adjacent to a sidewall of the conductive layer and extends between the overhanging portion of the insulating layer and the microelectronic substrate.
Abstract:
PURPOSE: A method for controlling the availability management of an integrated service digital user part is provided to enable an ASS-7 block to transmit a UPU message in only case that all ASP is abnormal, thereby preventing transmission drop due to the state change of one ASP. CONSTITUTION: An INS(Interconnection Network Subsystem) inquires about the availability of a UPC(User Part Control) block to each ASP(Access Switch Processor)(40). Each ASP responses to the INS(41). It is determined whether each ASP responses(42). If responses, the UPC block of each ASP is normally managed(43). If not response, each ASP is updated(44). The update management state of each ASP is transmitted to an MTP(Message Transfer Part) of an ASS(Access Switch Subsystem)- 7(45). It is determined whether all ASP does not response(46). A UPU(User Part Unavailable) message is transmitted to a remote station through the MTP(47).
Abstract:
Methods are provided for conductively contacting an integrated circuit, including a plurality of spaced apart lines thereon, using a dummy dielectric layer. A dummy dielectric layer is formed between first selected ones of the spaced apart lines. An interdielectric layer is formed between second selected ones of the spaced apart lines that are different from the first selected ones of the lines. The interdielectric layer has a lower etch rate than the dummy dielectric layer with respect to a predetermined etchant. The dummy dielectric layer is etched with the predetermined etchant, to remove at least some of the dummy dielectric layer between the first selected ones of the spaced apart lines. A conductive layer is formed between the first selected ones of the spaced apart lines from which at least some of the dummy dielectric layer has been removed, to electrically contact the integrated circuit between the first selected ones of the spaced apart lines.