Abstract:
An across-wafer optical MEMS device (100) includes a protective lid (106) having across-wafer light-transmissive portions (110). The across-wafer optical MEMS device (100) allows light to pass in a direction (104) substantially parallel to a surface on which the optical MEMS device (100) is mounted. The light-transmissive portions (110) in the protective lid (106) allow light to pass from an optical device located on one side of the optical MEMS device (100) to a second device located on another side of the optical MEMS device (100). A plurality of optical MEMS devices (100) can be located on the substrate (102) and enclosed by the same lid (106) without wafer-level encapsulation of each optical MEMS device (100).
Abstract:
An across-wafer optical MEMS device (100) includes a protective lid (106) having across-wafer light-transmissive portions (110). The across-wafer optical MEMS device (100) allows light to pass in a direction (104) substantially parallel to a surface on which the optical MEMS device (100) is mounted. The light-transmissive portions (110) in the protective lid (106) allow light to pass from an optical device located on one side of the optical MEMS device (100) to a second device located on another side of the optical MEMS device (100). A plurality of optical MEMS devices (100) can be located on the substrate (102) and enclosed by the same lid (106) without wafer-level encapsulation of each optical MEMS device (100).
Abstract:
An operating element is disclosed, comprising a body made from an elastomeric material, with an electrode arrangement (3) provided on each of the two opposing limiting surfaces, of which at least one comprises several first electrodes (7) penetrating the limiting surface in a perpendicular direction (6) thereto. The aim of the invention s to improve the dynamics of such an operating element. Said aim is achieved, whereby the electrode arrangement (3) comprises second electrodes (9), several of which are located in spaces (8, 8a, 8b) between neighbouring first electrodes (7) connecting the same, whereby the second electrodes (9, 9') in neighbouring spaces (8a, 8b) are arranged offset from each other.
Abstract:
Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
Abstract:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Abstract:
According to the present invention there is provided an actuator comprising, a movable member, the movable member comprising a support frame which is configured such that it can oscillate about a first oscillation axis and a mirror which is fixed to the support frame such that oscillation of the support frame will effect oscillation of the mirror; an coil, which cooperates with the support frame; one or more boundary portions provided between the support frame and the mirror which reduce the influence of warp transmitted from an edge of the support frame to the mirror, as the support frame oscillates about the first oscillation axis; wherein the support frame further comprises one or more cut-out regions, wherein the one or more cut-out regions are configured to be parallel to at least a portion of the coil, to reduce stress on the coil as the support frame oscillates about the first oscillation axis and/or to reduce the temperature dependence of the properties of the actuator.
Abstract:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Abstract:
An electrostatic actuator having a stationary electrode and a fixedly cantilevered bender is described, wherein the bender includes a cantilever electrode disposed opposite to the stationary electrode in an overlapping area and being deflectable in the direction of the stationary electrode.
Abstract:
A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.
Abstract:
This disclosure provides systems, methods and apparatus for shutter-based EMS light modulators controlled by electrode actuators that include complementary sets of corrugations or teeth along the opposing beams of the actuators. The complementary sets of corrugations substantially engage one another when drawn together via an actuation voltage. By applying the actuation voltage across the opposing beams of such an actuator, the beams are drawn together both by the electromotive force resulting from the electric field acting between the portions of the beams that are substantially perpendicular to the direction of actuation of the actuator, and by fringing fields between the sides of the corrugations, which are substantially parallel to the direction of actuation. The additional fringing fields provide for increased electromotive force for a given input voltage.