公开(公告)号：US08129023B2

公开(公告)日：2012-03-06

申请号：US11763521

申请日：2007-06-15

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

IPC: B32B27/02 ,  B32B5/16 ,  B05D7/00 ,  H01B1/00

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Abstract translation: 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：US20100080995A1

公开(公告)日：2010-04-01

申请号：US12631210

申请日：2009-12-04

Applicant: Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

Inventor： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

IPC: B32B37/14 ,  B32B37/12 ,  B32B37/06 ,  B32B37/10

CPC classification number: H05K3/323 ,  C08K7/00 ,  C09J9/02 ,  C09J11/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0233 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract translation: 一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性 导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间 和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于 绝缘颗粒。

公开(公告)号：US20090068916A1

公开(公告)日：2009-03-12

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

Inventor： Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

IPC: H01J9/24 ,  B05D5/12 ,  H01B1/20

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US07338710B2

公开(公告)日：2008-03-04

申请号：US10517076

申请日：2003-06-06

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: B32B5/16

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20070138649A1

公开(公告)日：2007-06-21

申请号：US11315138

申请日：2005-12-21

Applicant: John Knights

Inventor： John Knights

IPC: H01L23/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/11332 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2924/09701 ,  H05K3/125 ,  H05K3/245 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/013

Abstract: A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.

Abstract translation: 形成接触结构和接触结构的方法。 接触结构包括接触位置和基本上设置在接触位置上的接触元件，至少一个这样的接触元件包括可变形的中心和覆盖可变形中心的至少一部分的导电层。

公开(公告)号：US20060286721A1

公开(公告)日：2006-12-21

申请号：US11155208

申请日：2005-06-16

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01G7/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

公开(公告)号：US20060033873A1

公开(公告)日：2006-02-16

申请号：US11250426

申请日：2005-10-17

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

公开(公告)号：US20050228144A1

公开(公告)日：2005-10-13

申请号：US10517076

申请日：2003-06-06

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: C08F2/00 ,  C08J3/12 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/32 ,  B32B5/16 ,  C08L67/00

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US06942824B1

公开(公告)日：2005-09-13

申请号：US10155598

申请日：2002-05-22

Applicant: Weijin Li

Inventor： Weijin Li

IPC: G11B17/32 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233

Abstract: An electrically conductive adhesive includes a resin component, a photoinitiator, and metal-coated polymer beads. The beads have an average diameter and a very narrow size distribution around the average diameter. The adhesive is applied between a read/write head and a suspension to attach the two, and the adhesive is cured by exposure to an illumination and/or heat. The beads in the adhesive can form a monolayer between the read/write head and the suspension such that a spacing therebetween is equal to the average diameter of the beads. The metal coating of the beads provide electrical conductivity between the read/write head and the suspension.

Abstract translation: 导电粘合剂包括树脂组分，光引发剂和金属涂覆的聚合物珠粒。 珠具有围绕平均直径的平均直径和非常窄的尺寸分布。 将粘合剂施加在读/写头和悬架之间以附接两者，并且粘合剂通过暴露于照明和/或热而固化。 粘合剂中的珠粒可以在读/写头和悬浮液之间形成单层，使得它们之间的间隔等于珠的平均直径。 珠的金属涂层在读/写头和悬架之间提供导电性。

公开(公告)号：US20050110406A1

公开(公告)日：2005-05-26

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: C09J11/00 ,  C09J201/00 ,  G09F9/00 ,  H01J17/16 ,  H01J17/49 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。