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    PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS
    143.
    发明申请
    PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS 有权

    公开(公告)号：US20230130467A1

    公开(公告)日：2023-04-27

    申请号：US17452129

    申请日：2021-10-25

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Nicholas A. Polomoff ,  Thomas Houghton ,  Yusheng Bian

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43

    Abstract: A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.

    PIC DIE WITH OPTICAL DEFLECTOR FOR AMBIENT LIGHT
    144.
    发明申请
    PIC DIE WITH OPTICAL DEFLECTOR FOR AMBIENT LIGHT 有权

    公开(公告)号：US20230113261A1

    公开(公告)日：2023-04-13

    申请号：US17450324

    申请日：2021-10-08

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Roderick Alan Augur ,  Yusheng Bian ,  Robert John Fox, III

    IPC: H01L23/532 ,  H01L23/522 ,  H01L23/552

    Abstract: A photonic integrated circuit (PIC) die includes a silicon nitride optical component over an active region. Multiple interconnect layers are over the silicon nitride optical component, each of the multiple interconnect layers including a metal interconnect therein. At least one optical deflector is over the multiple interconnect layers and over the silicon nitride optical component. The optical deflector(s) may also include a contact passing therethrough to the interconnect layers, but do not include any other electrical interconnects. Each optical deflector may deflect light within an ambient light range of less than 570 nanometers (nm) to protect the silicon nitride optical component from light-induced degradation.

    Optical ring modulator with photonic crystal
    145.
    发明授权
    Optical ring modulator with photonic crystal 有权

    公开(公告)号：US11609475B2

    公开(公告)日：2023-03-21

    申请号：US17119042

    申请日：2020-12-11

    Applicant: GLOBALFOUNDRIES U.S. INC.

    Inventor： Michal Rakowski ,  Yusheng Bian ,  Won Suk Lee ,  Roderick A. Augur

    IPC: G02F1/225

    Abstract: Embodiments of the disclosure provide an optical ring modulator. The optical ring modulator includes waveguide with a first semiconductor material of a first doping type, and a second semiconductor material having a second doping type adjacent the first semiconductor material. A P-N junction is between the first semiconductor material and the second semiconductor material. A plurality of photonic crystal layers, each embedded within the first semiconductor material or the second semiconductor material, has an upper surface that is substantially coplanar with an upper surface of the waveguide structure.

    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH A TAPERED END PORTION OF ONE WAVEGUIDE ADJACENT TO A V-SHAPED END PORTION OF A DIFFERENT WAVEGUIDE
    146.
    发明申请
    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH A TAPERED END PORTION OF ONE WAVEGUIDE ADJACENT TO A V-SHAPED END PORTION OF A DIFFERENT WAVEGUIDE 有权

    公开(公告)号：US20230067304A1

    公开(公告)日：2023-03-02

    申请号：US17411122

    申请日：2021-08-25

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Yusheng Bian ,  Roderick A. Augur

    IPC: G02B6/122 ,  G02B6/125 ,  G02B6/136

    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first waveguide with a first main body and a first end portion, which is tapered; and a second waveguide with a second main body and a second end portion, which has two branch waveguides that are positioned adjacent to opposing sides, respectively, of the first end portion of the first waveguide and that branch out from the second main body, thereby forming a V, U or similar shape. The arrangement of the two branch waveguides of the second end portion of the second waveguide relative to the tapered first end portion of the first waveguide allows for mode matching conditions to be met at multiple locations at the interface between the waveguides, thereby creating multiple signal paths between the waveguides and effectively reducing the light signal power density along any one path to prevent or at least minimize any power-induced damage.

    Photodetectors including a coupling region with multiple tapers
    148.
    发明授权
    Photodetectors including a coupling region with multiple tapers 有权

    公开(公告)号：US11588062B2

    公开(公告)日：2023-02-21

    申请号：US17065839

    申请日：2020-10-08

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Abdelsalam Aboketaf ,  Yusheng Bian

    IPC: H01L31/0352 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/102

    Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. A photodetector includes a photodetector pad coupled to a waveguide core and a light-absorbing layer coupled to the photodetector pad. The light-absorbing layer has a body, a first taper that projects laterally from the body toward the waveguide core, and a second taper that projects laterally from the body toward the waveguide core. The photodetector pad includes a tapered section that is laterally positioned between the first taper and the second taper of the light-absorbing layer.

    Distributed Bragg reflectors including periods with airgaps
    149.
    发明授权
    Distributed Bragg reflectors including periods with airgaps 有权

    公开(公告)号：US11567277B1

    公开(公告)日：2023-01-31

    申请号：US17472846

    申请日：2021-09-13

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Yusheng Bian ,  Mark Levy ,  Siva P. Adusumilli

    IPC: G02B6/43 ,  G02B6/42

    Abstract: Structures that include a distributed Bragg reflector and methods of fabricating a structure that includes a distributed Bragg reflector. The structure includes a substrate, an optical component, and a distributed Bragg reflector positioned between the optical component and the substrate. The distributed Bragg reflector includes airgaps and silicon layers that alternate in a vertical direction with the airgaps to define a plurality of periods.

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