公开(公告)号：EP2650984A4

公开(公告)日：2016-03-16

申请号：EP11847473

申请日：2011-11-11

Applicant: HITACHI AUTOMOTIVE SYSTEMS LTD

Inventor： KAJITA DAIKI ,  NAKASU NOBUAKI ,  HAMANO HIROSHI ,  MORI YOSHIMI ,  MATSUO TAKESHI

IPC: H01R43/02 ,  B23K20/10 ,  H02G1/14 ,  H02K3/04

CPC classification number: H02K3/50 ,  B23K20/10 ,  B23K31/02 ,  B23K2201/32 ,  B23K2201/38 ,  B23K2203/12 ,  H01R43/0207 ,  H02K15/0062 ,  H02K15/0075

Abstract: The purpose of the present invention is to provide a connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. In order to achieve this purpose, a twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.

公开(公告)号：EP2981389A1

公开(公告)日：2016-02-10

申请号：EP14710878.1

申请日：2014-03-17

Applicant: Telsonic Holding AG

Inventor： BÜTTIKER, Albert

IPC: B23K26/28 ,  B21C37/12 ,  B23K26/38 ,  B23K31/02 ,  F16L11/16 ,  F16L11/24 ,  B23K20/10 ,  H01L23/00 ,  H01R43/02

CPC classification number: B23K20/106 ,  B23K2201/32 ,  B23K2201/38 ,  H01L2924/00014 ,  H01R43/0207 ,  H01R43/0263 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a device for welding weld material in a compression chamber (2) by means of ultrasound, wherein the compression chamber (2) is enclosed in a welding position by sections of boundary surfaces (4, 6, 8, 17) which are adjacent to each other. The boundary surfaces comprise a welding surface (4), which is designed on a sonotrode (3) transferring ultrasonic oscillations, an anvil surface (17), which is designed on an anvil (16) and is arranged in the welding position as a counter-surface opposite the welding surface (4), a lateral surface (8), which is designed on a lateral boundary element (7), a slide surface (6), which is designed on a slide element (5) and is arranged opposite the lateral surface (8). At least one of the boundary surfaces (6) is movably designed such that an alignment relative to the opposite boundary surface (8), in particular upon transitioning from a loading position to the welding position, is modifiable, wherein preferably the at least one boundary surface (6) is the slide surface (6) and the opposite boundary surface (8) is the lateral surface (8). The invention further relates to a related method for welding weld material (18) by means of ultrasound.

公开(公告)号：EP2643894B1

公开(公告)日：2015-09-23

申请号：EP11842507.3

申请日：2011-07-30

Applicant: CommScope Technologies LLC ,  Van Swearingen, Kendrick

Inventor： VAN SWEARINGEN, KENDRICK

IPC: H01R4/02 ,  H01R43/02 ,  H01R24/40 ,  B23K20/10 ,  H01R9/05 ,  H01R43/20 ,  H01R13/58

CPC classification number: H01R9/0503 ,  B23K20/10 ,  B23K2201/38 ,  B29C65/06 ,  B29C65/565 ,  B29C66/30223 ,  B29C66/526 ,  B29C66/5344 ,  B29L2031/3462 ,  H01R4/029 ,  H01R9/05 ,  H01R9/0524 ,  H01R13/5845 ,  H01R24/40 ,  H01R43/0207 ,  H01R43/20 ,  Y10T29/49123 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49185

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector, the annular flare seat open to the connector end of the connector. An inner conductor cap is provided for interconnection with an inner conductor of the coaxial cable by ultrasonic welding. The ultrasonic welding of each of the inner and outer conductor interconnections may be performed via inner conductor and outer conductor sonotrodes which are coaxial with one another, without requiring the cable and or connector to be removed from their fixture.

公开(公告)号：EP2904668A1

公开(公告)日：2015-08-12

申请号：EP13844133.2

申请日：2013-09-12

Applicant: CommScope Technologies LLC

Inventor： VAN SWEARINGEN, Kendrick ,  VACCARO, Ronald ,  FLEMING, James

IPC: H01R24/38

CPC classification number: H01R4/029 ,  B23K20/129 ,  B23K2201/38 ,  H01R9/05 ,  H01R43/0207 ,  H01R43/20 ,  Y10T29/49 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49123 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49929

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by friction welding is provided with a monolithic connector body with a bore dimensioned for an interference fit with an outer diameter of the outer conductor. A friction groove may be formed around the leading end of the outer conductor by application of a friction weld support against the inner diameter and leading end of the outer conductor. The friction groove may include a material chamber formed between a radial friction protrusion of the bore and a bottom of the friction groove. The friction weld support may be provided with ceramic surfaces contacting the outer conductor, a stop shoulder dimensioned to abut a cable end of the bore and/or an elastic insert seated within an inner conductor bore.

Abstract translation: 用于通过摩擦焊接与具有实心外导体的同轴电缆互连的同轴连接器设置有单体连接器主体，该单体连接器主体具有与所述外导体的外径过盈配合的尺寸。 通过将摩擦焊接支撑件施加在外导体的内径和前端上，可以在外导体的前端周围形成摩擦槽。 摩擦槽可以包括形成在孔的径向摩擦突起与摩擦槽的底部之间的材料室。 摩擦焊接支架可以设置有与外导体接触的陶瓷表面，尺寸设计成邻接孔的电缆端的止动台肩和/或坐落在内导体孔内的弹性插入件。

公开(公告)号：EP2798687A4

公开(公告)日：2015-08-12

申请号：EP12863032

申请日：2012-12-26

Applicant: SHENZHEN BYD AUTO R & D CO LTD ,  BYD CO LTD

Inventor： GONG QING ,  LIN XINPING ,  ZHANG XU ,  LIN YONGZHAO ,  XU SHURONG

IPC: H01M2/30 ,  B23K1/00 ,  C04B37/00 ,  H01G9/20 ,  H01M2/06 ,  H01M2/08

CPC classification number: H01M2/08 ,  B23K1/008 ,  B23K1/19 ,  B23K2201/38 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/52 ,  H01G9/2077 ,  H01M2/065 ,  H01M2/307 ,  Y10T29/4911

公开(公告)号：EP2609655B1

公开(公告)日：2015-08-12

申请号：EP11751822.5

申请日：2011-08-25

Applicant: Audi AG ,  Schäfer Werkzeug- und Sondermaschinenbau GmbH

Inventor： BAUER, Hans ,  SEITZ, Georg ,  FINK, Hans-Peter ,  SCHÄFER, Markus ,  HAAG, Werner

IPC: H01R4/18 ,  H01R43/02 ,  B23K26/22 ,  H01R43/048

CPC classification number: B23K26/21 ,  B23K26/22 ,  B23K2201/38 ,  H01R4/184 ,  H01R4/187 ,  H01R43/0221 ,  H01R43/048 ,  H01R43/058 ,  Y10T29/49185

公开(公告)号：EP2740557A4

公开(公告)日：2015-06-17

申请号：EP12861048

申请日：2012-08-02

Applicant: TANIGUROGUMI CORP

Inventor： TANIGURO KATSUMORI ,  WATANABE GENZO

IPC: B23K1/20 ,  B23K1/19 ,  H05K3/24 ,  H05K3/34

CPC classification number: B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0669 ,  B23K3/082 ,  B23K2201/38 ,  H01L2224/11 ,  H05K3/24 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/122

Abstract: Provided is a method for manufacturing a component having an electrode corrosion preventing layer by performing the low-cost, high-yield and highly reliable soldering, can be provided. The method for manufacturing a component includes: a step of preparing component 10' having electrode 2; a step of contacting first organic fatty acid-containing solution 3a with electrode 2; a step of adhering first molten solder 5a onto electrode 2 by contacting first molten solder 5a with electrode 2; a step of ejecting a gas flow or a liquid flow to adhered first molten solder 5a to remove excess first molten solder 5a in first molten solder 5a adhered onto electrode 2; and a step of cooling electrode 2 from which excess first molten solder 5a has been removed to less than a melting point of first molten solder 5a. First molten solder 5a includes a component forming electrode corrosion preventing layer 4 made of an intermetallic compound layer on a surface of electrode 2 by reacting with a component included in electrode 2, and the contact of first molten solder 5a with electrode 2 is performed by allowing a liquid flow of first molten solder 5a to collide with or spread over electrode 2while moving component 10'.

公开(公告)号：EP2705556B1

公开(公告)日：2015-06-03

申请号：EP12717319.3

申请日：2012-04-27

Applicant: VOLKSWAGEN VARTA Microbattery Forschungsgesellschaft mbH & Co. KG

Inventor： HOLL, Konrad ,  POMPETZKI, Markus ,  SEKLER, Robert ,  STELZIG, Heiner ,  STOCK, Stefan

IPC: B23K26/03 ,  B23K26/08 ,  H01G9/008 ,  H01G11/76 ,  H01M10/04 ,  H01G13/02 ,  B23K26/38 ,  H01M10/0587

CPC classification number: H01M10/0431 ,  B23K26/032 ,  B23K26/0838 ,  B23K26/38 ,  B23K2201/34 ,  B23K2201/38 ,  H01G9/008 ,  H01G11/76 ,  H01G13/02 ,  H01M10/0409 ,  H01M10/0587 ,  Y02E60/13 ,  Y10T29/43 ,  Y10T29/49112 ,  Y10T29/53013

公开(公告)号：EP2629922B1

公开(公告)日：2015-03-25

申请号：EP11764687.7

申请日：2011-10-04

Applicant: Volkswagen Aktiengesellschaft

Inventor： MAKOWSKA, Agnieszka ,  FERKEL, Hans ,  DEMMLER, Mirko ,  HAMMER, Thorge ,  SCHUMANN, Sönke

IPC: B23K26/06 ,  B23K26/38 ,  B23K26/04 ,  H02K1/14 ,  H02K15/02

CPC classification number: B23K26/38 ,  B23K26/046 ,  B23K26/06 ,  B23K2201/16 ,  B23K2201/18 ,  B23K2201/38 ,  B23K2203/04 ,  H02K1/02 ,  H02K15/02

公开(公告)号：EP2839920A1

公开(公告)日：2015-02-25

申请号：EP13778363.5

申请日：2013-04-17

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： NOMURA, Hikaru ,  YOSHIKAWA, Shunsaku

IPC: B23K35/26 ,  B23K1/19 ,  C22C13/00 ,  B23K101/38 ,  B23K103/10

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/282 ,  B23K2201/00 ,  B23K2201/32 ,  B23K2201/38 ,  B23K2203/10 ,  C22C13/00 ,  Y10T403/479

Abstract: To provide Sn-Zn series solder alloy that can decrease the amount of occurred dross, suppress discoloration of the fusion solder alloy and re-oxidation, and suppress the erosion phenomenon of Al and Ni even when the fusion solder alloy exposes the air.
In order to suppress diffusion of Al and/or Ni to the solder alloy by forming an oxide film on a surface of the solder bath prior to Zn, a solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn.

Abstract translation: 为了提供可以减少发生的渣滓量的Sn-Zn系焊料合金，抑制熔融焊料合金的变色和再次氧化，并且即使当熔融焊料合金露出空气时也抑制Al和Ni的腐蚀现象。 为了通过在Zn之前在焊料槽的表面上形成氧化膜来抑制Al和/或Ni对焊料合金的扩散，焊料合金具有含有3〜25质量％的Zn，0.002的Ti的合金组成 通过0.25质量％的Al，0.002〜0.25质量％的Al和余量的Sn。