Abstract:
Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.
Abstract:
Electric wires of a double-sided solderless connector are pressure-welded. The method of the pressure-welding includes the steps of: locating a pressure welding blade and support blade on both sides of a double-sided solderless connector, in a face to face relationship, so as to be movable in vertical direction; supporting one side of said double-sided solderless connector with said support blade; and pressure-welding respective electric wires to terminals at the other side of said double-sided solderless connector with said pressure welding blade.
Abstract:
A method for producing an electrical bond between a contact element of an electrical connector and a conductor, the contact element having a portion that is bifurcated such that the conductor is positioned between the furcations, the method comprising the steps of (a) providing a system comprising a power source and a weld head, the weld head having a first input and a second input for connection to a first polarity output and a second polarity output, respectively, of the power source, the system further including first and second electrodes movably attached to the weld head and electrically connected to the first and second inputs, respectively, (b) positioning the electrodes on the weld head to create a space between the electrodes that is sized for receiving both furcations of each contact element, (c) moving the weld head toward the furcations to effect contact between the first electrode and one of the furcations and between the second electrode and the other furcation, the contact being made at a predetermined force that causes the furcations to bend toward each other, and (d) allowing a current of a predetermined magnitude to flow through (i) the first input, (ii) the first electrode, (iii) the furcation in contact with the first electrode, (iv) the conductor, (v) the furcation in contact with the second electrode, (vi) the second electrode and (vii) the second input.
Abstract:
A flexible buss bar adapted for electrical connection with circuitry carried by a glass pane is provided, as well as a method of attaching a flexible buss bar to a glass pane. The flexible buss bar includes a flexible conductor having at least one metallic contact pad affixed thereto. It is also contemplated to have a plurality of such metallic contact pads attached at regular intervals along the length of the flexible conductor. The spacing of the plurality of metallic contact pads is selected to match the locations of corresponding structures formed on the glass pane. Solder cladding is selectively adhered to portions of the at least one metallic contact such that the at least one metallic contact pad may be bonded to the corresponding structure located on the glass pane. The method of connecting a flexible buss bar to an electrical contact pad formed on the surface of a glass pane includes the steps of providing a flexible buss bar, providing at least one metallic contact element, and selectively cladding a portion of the metallic contact element with a solderable material having a relatively low melting point. The metallic contact element is then affixed to the flexible buss bar, and the flexible buss bar is placed against the glass pane with the metallic contact element in physical contact with the contact pad formed on the glass pane. The solder cladding is then re-flowed to bond the metallic contact element attached to the flexible conductor to the electrical contact pad formed on the glass pane.
Abstract:
A method of attaching fine coil wire ends 22, 24 to terminal connectors 16, 18 wherein the terminals are rapidly heated into the red zone by common current flow therethrough from contact electrodes 26, 28 in the presence of a gaseous purge comprising a mixture of hydrogen balance argon, nitrogen, or helium while low melting temperature solder 84 is flowed onto the heated terminal for wire attachment. The gaseous purge from a nozzle 80 is maintained until the terminal has cooled sufficiently to prevent rapid atmosphere oxidation thereof.
Abstract:
Electrically conductive leads (12) are bonded to pre-tinned ends (11) of a thin film, rolled capacitor (10). A dimple (20) is formed in the leads (12) resulting in an indentation (21) therein and a protrusion (22) on the opposite surface thereof. The protrusion (22) is placed in contact with the end (11) and a pulsed laser beam directed into the indentation (21) to heat the lead (12) in the vicinity of the protrusion (22) to reflow a portion of the pre-tinned ends (11) to form a bond therebetween.