公开(公告)号：US6119925A

公开(公告)日：2000-09-19

申请号：US302667

申请日：1999-04-30

Applicant: Nick Lin ,  Jeng-Shiun Liu

Inventor： Nick Lin ,  Jeng-Shiun Liu

IPC: B23K3/06 ,  H01R43/02 ,  H05K3/34 ,  B23K31/00

CPC classification number: H01R43/0256 ,  B23K3/0638 ,  H01R43/0235 ,  H05K3/3436 ,  B23K2201/42 ,  H05K2201/10189 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/043 ,  H05K3/3426 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for soldering an electrical element to a mother board includes the following steps. Firstly, the electrical element is prepared for soldering and deposited on an appropriate machine. Secondly, solder balls are deposited at openings of terminal receiving passageways of the electrical element by means of appropriate tools. Thirdly, the solder balls are heated to a semi-meltdown status and top surfaces of the solder balls are leveled by means of leveling tools. Lastly, the solder balls are mounted onto corresponding electrical contact pads of the mother board and reheated to melting temperature thereby completing the soldering process.

Abstract translation: 将电气元件焊接到母板的方法包括以下步骤。 首先，电气元件准备焊接并沉积在合适的机器上。 其次，通过适当的工具将焊球沉积在电气元件的端子接收通道的开口处。 第三，焊球被加热到半熔化状态，焊球的顶表面通过调平工具进行平整。 最后，将焊球安装到母板的相应电接触垫上，并重新加热到熔化温度，从而完成焊接​​过程。

公开(公告)号：US6053394A

公开(公告)日：2000-04-25

申请号：US6411

申请日：1998-01-13

Applicant: Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

Inventor： Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

IPC: B23K1/00 ,  H01L23/40 ,  H05K1/02 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  H01L23/4093 ,  B23K2201/42 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/10253 ,  H05K1/0203 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

公开(公告)号：US4833301B1

公开(公告)日：2000-04-04

申请号：US3044687

申请日：1987-03-25

Applicant: VITRONICS CORP

Inventor： FURTEK EDWARD J

IPC: B23K1/005 ,  B23K1/008 ,  H05B3/02 ,  B23K31/02 ,  F27B9/36

CPC classification number: B23K1/0053 ,  B23K1/008 ,  B23K2201/42

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.

公开(公告)号：US6027006A

公开(公告)日：2000-02-22

申请号：US103864

申请日：1998-06-24

Applicant: Mark Vincent Pierson

Inventor： Mark Vincent Pierson

IPC: B23K3/06 ,  H05K1/00 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  B23K3/00

CPC classification number: H05K3/3484 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/1225 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/42 ,  H05K1/0393 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/1545 ,  H05K3/0097 ,  H05K3/1216

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

Abstract translation: 公开了一种用于将焊料施加到其上具有预定图案的接收焊盘并且从所施加的焊料形成焊球的衬底的方法和装置。 提供具有支撑构件和连续计量构件的输送机。 计量构件具有与基板上的焊料接收垫相同的预选图案布置的开口。 衬底移动与支撑构件和计量构件接触，计量构件中的开口与衬底的焊料接收衬垫对齐。 提供了一种焊料容器，其向开口提供焊料。 焊料可以是液体形式，或以糊状形式，或以固体焊球的形式。 所施加的焊料，如果以糊状物或固体球的形式熔化。 此后，焊料在焊盘上固化以形成焊球，并且基板从其上的固化的焊球从输送机排出。

公开(公告)号：US6021940A

公开(公告)日：2000-02-08

申请号：US967041

申请日：1997-11-10

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Denis Verbokhaven ,  Gilles Conor

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Denis Verbokhaven ,  Gilles Conor

IPC: B23K1/00 ,  B23K1/012 ,  B23K1/20 ,  B23K35/38 ,  C23G5/00 ,  H05K3/26 ,  H05K3/34 ,  B23K31/00

CPC classification number: B23K1/203 ,  B23K1/012 ,  B23K35/38 ,  B23K35/383 ,  C23G5/00 ,  H05K3/3489 ,  B23K2201/42

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract translation: 本发明涉及在回流焊接操作之前，期间或之后的干洗或干式助熔金属表面的方法。 干洗或干式助焊剂的金属表面包括（1）金属基材上至少部分金属的电子元件将被安装在其上，（2）焊膏，和（3）电子部件的金属部分 。 该方法包括用包含不稳定或激发的气态物质的气态处理气氛处理金属表面，并且基本上不带电荷的物质。

公开(公告)号：US6010058A

公开(公告)日：2000-01-04

申请号：US25110

申请日：1998-02-17

Applicant: Young-Gon Kim ,  Dong-You Kim

Inventor： Young-Gon Kim ,  Dong-You Kim

IPC: B23K1/00 ,  H05K1/00 ,  H05K3/22 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  H05K3/225 ,  B23K2201/42 ,  H05K1/0293 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2203/0126 ,  H05K3/3484 ,  Y02P70/613

Abstract: In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90.degree. around the dummy balls. When a defect occurs in a solder joint, the package can be easily repaired by finding defective active ball; forming a repair hole by using a cutting means at a predetermined portion of the printed circuit board corresponding to a central position between the dummy ball and the defectively soldered active ball; inserting a solder paste injector into the repair hole to inject solder thereinto; and mutually connecting pad extensions of the dummy ball and the defective active ball with the injected solder. Therefore, the overall process can be simplified and its reliability can be improved.

Abstract translation: 在具有电连接的有源球和电气断开的虚拟球的BGA封装中，活动球围绕虚拟球以90度的间隔沿径向方向定位。 当焊接点发生缺陷时，可以通过发现有缺陷的活动球来容易地修复包装; 在所述印刷电路板的与所述虚拟球和所述缺陷焊接的活性球之间的中心位置对应的预定部分处使用切割装置形成修复孔; 将焊膏注入器插入修复孔中以将焊料注入其中; 以及用注入的焊料将虚拟球和有缺陷的活性球相互连接的焊盘延伸部。 因此，可以简化整体处理，提高其可靠性。

公开(公告)号：US6008476A

公开(公告)日：1999-12-28

申请号：US905667

申请日：1997-08-04

Applicant: Ovidiu Neiconi ,  Christopher Lee Becher ,  Richard Lee Mangold ,  Christopher John Keane

Inventor： Ovidiu Neiconi ,  Christopher Lee Becher ,  Richard Lee Mangold ,  Christopher John Keane

IPC: B23K37/047 ,  B23K1/008 ,  F27D3/12 ,  F27B9/06 ,  B65G43/10

CPC classification number: B23K37/047 ,  B23K2201/42

Abstract: An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source, a plenum (110), and first and second elevators (404, 405). The pallets carry the substrate, while the first and second tracks guide the pallets. The first motor is used for driving a pallet in a first direction on the first track, while the second motor is used for driving a pallet in a direction opposite to the first direction on the second track. The plenum is coupled to the vacuum source and at least one pallet for applying adhering forces to the substrate. The first and second elevators are used for transferring a pallet between the first and second tracks.

Abstract translation: 用于将部件分度和固定到基板的装置（400）包括真空输送机和用于控制装置（400）的操作的控制器（816）。 输送机包括托盘（102），第一和第二轨道（414,416），第一和第二马达（502,503），真空源，增压室（110）以及第一和第二升降机（404,405）。 托盘承载基板，而第一和第二轨道引导托盘。 第一马达用于在第一轨道上沿第一方向驱动托盘，而第二马达用于沿与第二轨道上的第一方向相反的方向驱动托盘。 增压室联接到真空源和至少一个用于向基板施加附着力的托盘。 第一和第二电梯用于在第一和第二轨道之间传送托盘。

公开(公告)号：US5984166A

公开(公告)日：1999-11-16

申请号：US897211

申请日：1997-07-09

Applicant: Andrew Vincent Holzmann

Inventor： Andrew Vincent Holzmann

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  H05K3/12 ,  H05K3/34 ,  B23K35/12 ,  B23K31/02

CPC classification number: B23K1/0016 ,  B23K3/0638 ,  B23K35/0222 ,  H05K3/1225 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/09727 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0574 ,  H05K2203/058 ,  H05K3/3452

Abstract: A method by which low melting point solder for reflow connection of components is formed on select fine and coarse pitch contacts of a printed circuit board simultaneously. A template with openings to select fine pitch circuit board contacts is placed in contact with fine pitch contacts. The fine and coarse pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. The stencil is removed and a mesh is fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board. Thereafter, according to a preferred practice of the invention, the mesh is removed from the board and the board is subjected to previously practiced depositions of flux and paste in preparation for fine and coarse pitch component placement and ensuing solder reflow. Alternate practices of the invention involve concurrent deposition of fine pitch solder through a template and coarse pitch solder in the conventional manner in the absence of mesh with removal of the stencil prior to solder reflow.

Abstract translation: 同时在印刷电路板的选择的精细和粗略的音调触点上形成用于部件的回流连接的低熔点焊料的方法。 具有选择细间距电路板触点的开口的模板放置成与细间距触点接触。 板的细和粗节距接触通过模板中的孔露出，其特征在于其能够承受焊料回流温度，不能被焊料润湿，并且具有与印刷电路板相对匹配的热膨胀系数。 低温焊膏被屏幕沉积在模板孔中。 去除模板并且将网格固定地定位在板上，由模板图案保持的焊膏被回流以选择性地形成在印刷电路板的下面的触点上。 此后，根据本发明的优选实践，将网格从板上移除，并且对板进行预先实践的焊剂和浆料沉积，以准备精细和粗略的沥青组分放置并随后进行回流焊。 本发明的替代实施方案涉及通过模板和粗间距焊料的同时沉积，在常规方式下，在焊料回流之前没有网状物去除模板。

公开(公告)号：US5971246A

公开(公告)日：1999-10-26

申请号：US851864

申请日：1997-05-06

Applicant: Lam Cheow Patrick Aun ,  Ka Tiek Lim ,  We Kok Nyo

Inventor： Lam Cheow Patrick Aun ,  Ka Tiek Lim ,  We Kok Nyo

IPC: B23K1/008 ,  B23K3/00

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: An oven (100) for reflowing circuit board assemblies (102). Air is pumped into a heating chamber (104) from which the air is then communicated through one or more apertures (112) in a panel (114) to a reflow chamber (106). A conveyor track (108) conveys the assemblies (102) through the reflow chamber (106). In use, the oven turbulates the air sufficient to vibrate components on the assemblies (102) and, thereby, realigns components inadvertently displaced off pads of the assemblies (102).

Abstract translation: 一种用于回流电路板组件（102）的烘箱（100）。 空气被泵送到加热室（104）中，空气然后通过面板（114）中的一个或多个孔（112）连通到回流室（106）。 输送机轨道（108）通过回流室（106）输送组件（102）。 在使用中，烤箱使足够的空气使空气振动，使组件（102）上的部件振动，从而使组件（102）的垫片偏心移开。

公开(公告)号：US5941449A

公开(公告)日：1999-08-24

申请号：US20693

申请日：1998-02-09

Applicant: Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

Inventor： Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

IPC: B23K3/06 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10S269/903 ,  Y10T29/49144 ,  Y10T29/53191

Abstract: A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

Abstract translation: 将一定数量的导电间隔物（例如，球形焊球）定位在下面的基底（例如，FR4印刷电路板或柔性电路构件）的导电焊盘（例如，铜焊盘）上的方法，其中间隔物被强制地 保持在合适的保持器内，并且当与相应的焊盘接合时回流以实现间隔件和焊盘之间的多个正电连接。 这种强制保留允许间隔物从本发明的载体部分延伸，这也是公开的。