公开(公告)号：US07841086B2

公开(公告)日：2010-11-30

申请号：US12268911

申请日：2008-11-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B21D53/00

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B81B3/0013 ,  B81B2201/052 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49401 ,  Y10T29/49432

Abstract: A method of fabricating an inkjet printhead. The method includes the steps of: (a) forming a plurality of MEMS ink ejection assemblies on an ink-ejection surface of a silicon substrate, each ink ejection assembly being sealed with roof material spanning across the ink ejection assemblies to define a nozzle plate; (b) etching partially into the roof material to form simultaneously a respective nozzle rim for each ink ejection assembly and a plurality of projections patterned across the nozzle plate between nozzle rims; and (c) etching through the roof material to form a respective nozzle aperture for each ink ejection assembly. The projections patterned across the nozzle plate between nozzle rims are useful for reducing stiction between particulates and the nozzle plate.

Abstract translation: 一种制造喷墨打印头的方法。 该方法包括以下步骤：（a）在硅衬底的喷墨表面上形成多个MEMS墨水喷射组件，每个墨水喷射组件用横跨喷墨组件的屋顶材料密封以限定喷嘴板; （b）部分地蚀刻到屋顶材料中以同时形成用于每个喷墨组件的相应喷嘴边缘和在喷嘴边缘之间跨过喷嘴板图案化的多个突起; 和（c）通过屋顶材料蚀刻以形成每个喷墨组件的相应的喷嘴孔。 在喷嘴边缘之间穿过喷嘴板图案的突出物可用于减小颗粒和喷嘴板之间的粘性。

公开(公告)号：US20100231652A1

公开(公告)日：2010-09-16

申请号：US12786268

申请日：2010-05-24

Applicant: Gregory John McAvoy ,  Vincent Patrick Lawlor ,  Kia Silverbrook

Inventor： Gregory John McAvoy ,  Vincent Patrick Lawlor ,  Kia Silverbrook

IPC: B41J2/05

CPC classification number: B41J2/14427 ,  B41J2002/14435 ,  B41J2202/03 ,  B41J2202/15 ,  B81B3/0024 ,  B81B2201/032 ,  B81B2201/052

Abstract: An inkjet nozzle assembly comprises: a nozzle chamber having a nozzle opening and an ink inlet; and a thermal bend actuator for ejecting ink through the nozzle opening. The actuator comprises: an active beam for connection to drive circuitry; a first passive beam fused to the active beam; and a second passive beam fused to the second first passive beam. The first passive beam is sandwiched between the active beam and the second passive beam such that when a current is passed through the active beam, the active beam expands relative to the passive beams, resulting in bending of the actuator and ejection of ink through the nozzle opening.

Abstract translation: 喷墨喷嘴组件包括：具有喷嘴开口和墨入口的喷嘴室; 以及用于通过喷嘴开口喷射墨水的热弯曲致动器。 致动器包括：用于连接到驱动电路的主动梁; 与激活光束融合的第一被动束; 和与第二第一无源光束融合的第二无源光束。 第一无源光束夹在有源光束和第二无源光束之间，使得当电流通过有源光束时，有源光束相对于被动光束扩展，导致致动器弯曲并通过喷嘴喷射墨水 开放

公开(公告)号：US20100219488A1

公开(公告)日：2010-09-02

申请号：US12676826

申请日：2008-09-04

Applicant: Masaya Nakatani ,  Hiroshi Ushio ,  Soichiro Hiraoka ,  Akiyoshi Oshima ,  Makoto Takahashi

Inventor： Masaya Nakatani ,  Hiroshi Ushio ,  Soichiro Hiraoka ,  Akiyoshi Oshima ,  Makoto Takahashi

IPC: H01L29/66 ,  B32B3/02 ,  C23C16/00

CPC classification number: G01N33/48728 ,  B81B2201/0214 ,  B81B2201/052 ,  B81C1/00206 ,  Y10T428/23943

Abstract: A silicon structure of the present invention is provided with a silicon substrate (1) to become a base, and a plurality of fibrous projections (2) made of silicon dioxide and directly joined to a silicon-made surface (1a) of the silicon substrate (1). By arbitrarily constructing an area where these fibrous projections (2) are formed in a predetermined area, it is possible to render the area to have at least either hydrophilicity or water retentivity, so as to provide a silicon structure useful for a variety of devices.

Abstract translation: 本发明的硅结构设置有成为基底的硅基板（1）和由二氧化硅制成的直接接合到硅基板的硅制表面（1a）的多个纤维突起（2） （1）。 通过任意构造这些纤维状突起（2）形成在预定区域的区域，可以使该区域具有至少亲水性或保水性，以提供可用于各种装置的硅结构。

公开(公告)号：US20100165048A1

公开(公告)日：2010-07-01

申请号：US12346698

申请日：2008-12-30

Applicant: Gregory DeBrabander ,  Mark Nepomnishy

Inventor： Gregory DeBrabander ,  Mark Nepomnishy

IPC: B41J2/16 ,  H01L21/302

CPC classification number: B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B81B2201/052 ,  B81C1/00087

Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

Abstract translation: 描述了具有导向直壁的锥形部分的流体喷射嘴。 喷嘴的锥形部分和直壁孔均由半导体层的单侧形成，使得锥形部分和孔彼此对准，即使在模具之间形成喷嘴阵列并且多个模具是 形成在半导体衬底上。

公开(公告)号：US20090032935A1

公开(公告)日：2009-02-05

申请号：US11831699

申请日：2007-07-31

Applicant: Siddhartha Bhowmik ,  Steven E. Kelly

Inventor： Siddhartha Bhowmik ,  Steven E. Kelly

IPC: H01L23/12 ,  B41J2/05 ,  H01L21/02

CPC classification number: B81B3/0072 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642 ,  B81B2201/052

Abstract: Embodiments of a semiconductor device are disclosed.

Abstract translation: 公开了半导体器件的实施例。

公开(公告)号：US07464465B2

公开(公告)日：2008-12-16

申请号：US11246682

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B21D51/16 ,  G01D15/00 ,  B41J2/14

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B81B3/0013 ,  B81B2201/052 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49401 ,  Y10T29/49432

Abstract: A method of forming a low-stiction nozzle plate for an inkjet printhead, said nozzle plate having a plurality of nozzle apertures defined therein, each nozzle aperture having a respective nozzle rim, said method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of inkjet nozzle assemblies sealed with roof material; (b) etching partially into said roof material to define simultaneously said nozzle rims and a plurality of stiction-reducing formations; and (c) etching through said roof material to define said nozzle apertures, thereby forming said nozzle plate.

Abstract translation: 一种形成用于喷墨打印头的低粘度喷嘴板的方法，所述喷嘴板具有限定在其中的多个喷嘴孔，每个喷嘴孔具有相应的喷嘴边缘，所述方法包括以下步骤：（a） 制造的打印头包括用屋顶材料密封的多个喷墨喷嘴组件; （b）部分地蚀刻到所述屋顶材料中以同时限定所述喷嘴边缘和多个减少静电的地层; 和（c）通过所述屋顶材料蚀刻以限定所述喷嘴孔，从而形成所述喷嘴板。

公开(公告)号：US07432582B2

公开(公告)日：2008-10-07

申请号：US11012603

申请日：2004-12-14

Applicant: Diane Lai ,  Samson Berhane ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Hubert Vander Plas

Inventor： Diane Lai ,  Samson Berhane ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Hubert Vander Plas

IPC: H01L29/06

CPC classification number: B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2202/18 ,  B81B7/0006 ,  B81B2201/052 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K1/112 ,  H05K2201/09518 ,  H01L2924/00

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract translation: 提供了一种制造微电子器件的方法，其中微电子器件形成在具有前侧和背侧的衬底上。 该方法包括从沉积在基板的前侧上的多个层在基板的前侧形成电路元件，其中多个层包括中间电接触层，以及在形成电接触层之后形成互连结构。 所述互连结构包括形成在所述衬底的背面上的接触焊盘以及与所述接触焊盘电连通的贯穿衬底互连，其中所述贯通衬底互连件从所述衬底的背面延伸到所述电接触层。

公开(公告)号：US07338611B2

公开(公告)日：2008-03-04

申请号：US10793317

申请日：2004-03-03

Applicant: Jeffrey R. Pollard ,  Michael D. Miller

Inventor： Jeffrey R. Pollard ,  Michael D. Miller

IPC: G01D15/00

CPC classification number: B81C1/00087 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B81B2201/052

Abstract: The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.

Abstract translation: 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法形成到衬底的第一表面中的第一槽部分，第一槽部分在第一表面处限定占地面积。 该方法还通过第一槽部分形成第二槽部分; 并且通过所述基板的第二表面形成足以拦截所述第二槽部分以形成通过所述基板的流体处理槽的第三槽部分。

公开(公告)号：US07271104B2

公开(公告)日：2007-09-18

申请号：US11170895

申请日：2005-06-30

Applicant: David L. Bernard ,  John W. Krawczyk ,  Andrew L. McNees

Inventor： David L. Bernard ,  John W. Krawczyk ,  Andrew L. McNees

IPC: H01L21/302 ,  H01L21/462

CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B81B2201/052 ,  B81C1/00087

Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.

公开(公告)号：US20070082422A1

公开(公告)日：2007-04-12

申请号：US11246684

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: H01L21/00

CPC classification number: B81C1/00142 ,  B41J2/1404 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B41J2202/11 ,  B81B2201/052

Abstract: A method of fabricating a suspended beam in a MEMS process, said method comprising the steps of: (a) etching a pit in a substrate, said pit having a base and sidewalls; (b) depositing sacrificial material on a surface of said substrate so as to fill said pit; (c) removing said sacrificial material from a perimeter region within said pit and from said substrate surface surrounding said pit; (d) reflowing remaining sacrificial material within said pit such that said remaining sacrificial material contacts said sidewalls; (e) depositing beam material on said substrate surface and on said reflowed sacrificial material; and (f) removing said reflowed sacrificial material to form said suspended beam.

Abstract translation: 一种在MEMS工艺中制造悬挂梁的方法，所述方法包括以下步骤：（a）蚀刻衬底中的凹坑，所述凹坑具有基底和侧壁; （b）在所述衬底的表面上沉积牺牲材料以填充所述凹坑; （c）从所述凹坑内的周边区域和围绕所述凹坑的所述衬底表面去除所述牺牲材料; （d）在所述凹坑内回流剩余的牺牲材料，使得所述剩余的牺牲材料接触所述侧壁; （e）在所述衬底表面和所述回流牺牲材料上沉积梁材料; 和（f）去除所述回流牺牲材料以形成所述悬挂梁。