Manufacturing a MEMS element having cantilever and cavity on a substrate
    141.
    发明授权
    Manufacturing a MEMS element having cantilever and cavity on a substrate 有权
    在衬底上制造具有悬臂和空腔的MEMS元件

    公开(公告)号:US08097483B2

    公开(公告)日:2012-01-17

    申请号:US12682000

    申请日:2008-10-15

    Abstract: Method for manufacturing a capacitor on a substrate, the capacitor including a first electrode (5) and a second electrode (12; 25), the first and second electrodes being separated by a cavity (16; 32), the substrate including an insulating surface layer (3), the first electrode (5) being arranged on the insulating surface layer a first metal body (7a; 20) being adjacent to the first electrode and arranged as anchor of the second electrode (12; 25) the second electrode being arranged as a beam-shaped body (12; 25) located on the first metal body and above the first electrode; the cavity (16; 32) being laterally demarcated by a sidewall of the first metal body.

    Abstract translation: 在基板上制造电容器的方法,所述电容器包括第一电极(5)和第二电极(12; 25),所述第一和第二电极由空腔(16; 32)分开,所述基板包括绝缘表面 层(3),所述第一电极(5)在所述绝缘表面层上布置有与所述第一电极相邻并且被布置为所述第二电极(12; 25)的锚定件的第一金属体(7a; 20),所述第二电极为 被布置为位于所述第一金属体上并位于所述第一电极上方的梁状体(12; 25); 空腔(16; 32)由第一金属体的侧壁横向划分。

    MANUFACTURING A MEMS ELEMENT HAVING CANTILEVER AND CAVITY ON A SUBSTRATE
    142.
    发明申请
    MANUFACTURING A MEMS ELEMENT HAVING CANTILEVER AND CAVITY ON A SUBSTRATE 有权
    制造具有基座上的CAN子和腔的MEMS元件

    公开(公告)号:US20100264498A1

    公开(公告)日:2010-10-21

    申请号:US12682000

    申请日:2008-10-15

    Abstract: Method for manufacturing a capacitor on a substrate, the capacitor including a first electrode (5) and a second electrode (12; 25), the first and second electrodes being separated by a cavity (16; 32), the substrate including an insulating surface layer (3), the first electrode (5) being arranged on the insulating surface layer a first metal body (7a; 20) being adjacent to the first electrode and arranged as anchor of the second electrode (12; 25) the second electrode being arranged as a beam-shaped body (12; 25) located on the first metal body and above the first electrode; the cavity (16; 32) being laterally demarcated by a sidewall of the first metal body.

    Abstract translation: 在基板上制造电容器的方法,所述电容器包括第一电极(5)和第二电极(12; 25),所述第一和第二电极由空腔(16; 32)分开,所述基板包括绝缘表面 层(3),所述第一电极(5)在所述绝缘表面层上布置有与所述第一电极相邻并且被布置为所述第二电极(12; 25)的锚定件的第一金属体(7a; 20),所述第二电极为 被布置为位于所述第一金属体上并位于所述第一电极上方的梁状体(12; 25); 空腔(16; 32)由第一金属体的侧壁横向划分。

    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
    143.
    发明申请
    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns 审中-公开
    使用牺牲金属图案模制结构的方法和设备

    公开(公告)号:US20100213068A1

    公开(公告)日:2010-08-26

    申请号:US12706566

    申请日:2010-02-16

    Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

    Abstract translation: 提供了模制结构,制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构(例如通过EFAB TM形成工艺制造)形成,并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要,将层状结构与其他模具部件组合,并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去(例如通过蚀刻)以产生模塑制品。 在一些实施例中,分层结构的部分保留在模制品中,并且在其它实施例中,在部分或完全去除层状结构之后添加另外的模制材料。

    METHOD FOR PRODUCING IMPLANT STRUCTURES FOR CONTACTING OR ELECTROSTIMULATION OF LIVING TISSUE CELLS OR NERVES
    144.
    发明申请
    METHOD FOR PRODUCING IMPLANT STRUCTURES FOR CONTACTING OR ELECTROSTIMULATION OF LIVING TISSUE CELLS OR NERVES 有权
    生产用于生活组织细胞或神经细胞接触或电生理的植入物结构的方法

    公开(公告)号:US20090234425A1

    公开(公告)日:2009-09-17

    申请号:US12296519

    申请日:2007-01-26

    Abstract: The object, to create a method for producing multilayers or multilayer systems wherein the structures generated on a substrate can easily be jointly detached from the substrate and are preserved in a composite, is achieved by the present invention by means of a method for producing implant structures comprising generating a first metal layer on a substrate, generating a second metal layer above the first metal layer, producing a number of multilayered implant structures above the second metal layer, removing the first metal layer between the substrate and the second metal layer, and releasing the implant structures from the substrate in a coherent composite. With the method according to the invention, between the implant structures and the substrate a release layer is generated consisting of two or three metal layers which serve as sacrificial layer in the course of releasing the fully processed multilayers by means of an under-etching process. As a result, a uniform and reliable separation of the finished multilayers from the substrate in a composite is achieved, facilitating the subsequent technology for assembly and interconnection of the implant structures.

    Abstract translation: 本发明的目的是为了产生多层或多层体系的制造方法,其中在衬底上产生的结构可以容易地与衬底共同分离并且被保存在复合材料中,这通过本发明通过生产植入结构的方法来实现 包括在衬底上产生第一金属层,在第一金属层上方产生第二金属层,在第二金属层之上产生多个多层植入结构,去除衬底和第二金属层之间的第一金属层,并释放 在相干复合材料中来自基底的植入物结构。 利用根据本发明的方法,在植入结构和衬底之间,产生剥离层,其由在蚀刻过程中释放完全处理的多层膜的过程中用作牺牲层的两个或三个金属层组成。 结果,实现了在复合材料中完成的多层与基底的均匀可靠的分离,有助于随后的用于植入结构的组装和互连的技术。

    MEMS device and fabrication method thereof
    147.
    发明授权
    MEMS device and fabrication method thereof 失效
    MEMS器件及其制造方法

    公开(公告)号:US07411261B2

    公开(公告)日:2008-08-12

    申请号:US10773312

    申请日:2004-02-09

    Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

    Abstract translation: 一种用于制造具有固定到基板上的固定部件,连接部件,驱动部件,驱动电极和接触部件的MEMS器件的方法,包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口,从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分,使得牺牲层的一部分保留在固定区域中。

    SILICON ON METAL FOR MEMS DEVICES
    148.
    发明申请
    SILICON ON METAL FOR MEMS DEVICES 审中-公开
    用于MEMS器件的金属硅

    公开(公告)号:US20080032501A1

    公开(公告)日:2008-02-07

    申请号:US11459307

    申请日:2006-07-21

    CPC classification number: B81C1/00579 B81C2201/0107 B81C2201/014

    Abstract: Micro-electromechanical systems (MEMS) pre-fabrication products and methods for forming MEMS devices using silicon-on-metal (SOM) wafers. An embodiment of a method may include the steps of bonding a patterned SOM wafer to a cover wafer, thinning the handle layer of the SOM wafer, selectively removing the exposed metal layer, and either continuing with final metallization or cover bonding to the back of the active layer.

    Abstract translation: 微机电系统(MEMS)预制产品和使用金属硅(SOM)晶片形成MEMS器件的方法。 方法的一个实施例可以包括以下步骤:将图案化的SOM晶片结合到覆盖晶片,使SOM晶片的手柄层变薄,选择性地去除暴露的金属层,并且继续进行最后的金属化或覆盖粘合到 活动层

    Process for forming microstructures
    149.
    发明授权
    Process for forming microstructures 有权
    微结构形成工艺

    公开(公告)号:US07271022B2

    公开(公告)日:2007-09-18

    申请号:US11102982

    申请日:2005-04-11

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射,以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂,并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分,然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案,以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域,但不包含整个基板。 相反,它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
    150.
    发明申请
    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns 审中-公开
    使用牺牲金属图案模制结构的方法和设备

    公开(公告)号:US20070199822A1

    公开(公告)日:2007-08-30

    申请号:US11621429

    申请日:2007-01-09

    Inventor: Christopher Bang

    Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

    Abstract translation: 提供了模制结构,制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构(例如通过EFAB TM形成工艺制造)形成,并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要,将层状结构与其他模具部件组合,并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去(例如通过蚀刻)以产生模塑制品。 在一些实施例中,分层结构的部分保留在模制品中,并且在其它实施例中,在部分或完全去除层状结构之后添加另外的模制材料。

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