公开(公告)号：US20170034920A1

公开(公告)日：2017-02-02

申请号：US15039949

申请日：2014-11-28

Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA

Inventor： Kosuke TSUJI ,  Kazunori KOIKE ,  Katsura KAWASHIMA ,  Kenju TSUCHIYA ,  Shinji IMAI

IPC: H05K3/06 ,  H05K1/03 ,  C23F1/20 ,  H05K1/09

CPC classification number: H05K3/067 ,  C23F1/20 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/092 ,  H05K3/061 ,  H05K3/381 ,  H05K2201/017 ,  H05K2203/0384 ,  H05K2203/0502

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

Abstract translation: 本发明涉及一种制造电路板的方法，包括以下步骤：至少在表面上制备含有硅的衬底，将含有铝颗粒的糊料施加到衬底上，通过烧制衬底在基底上形成导体层， 已经施加了糊剂，在导体层上形成具有特定图案的抗蚀剂膜，并且用蚀刻剂除去未形成抗蚀剂膜的部分中的导体层，含有氟化物离子的蚀刻剂和金属离子的蚀刻剂 标准电极电位的值比铝的标准电极电位高的金属M，以及可以用这种方法制造的电路板。

公开(公告)号：US20160172548A1

公开(公告)日：2016-06-16

申请号：US14565798

申请日：2014-12-10

Applicant: Baskaran A/L Govinda Nair ,  MILLENNIUM SUBSTRATES SDN BHD

Inventor： R. Remakantan A/L Ramachandran ,  Vivegananthan Rajangam

IPC: H01L33/48 ,  H01L21/48 ,  H01L33/62

CPC classification number: H01L21/4867 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/053 ,  H05K2201/017 ,  H05K2201/10106 ,  H05K2203/1126 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014

Abstract: A method of manufacturing Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) is provided, characterized in that, the Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) includes a fine-patterned thick film, the method includes the steps of forming a glass based dielectric layer (103, 111) on a metal plate (101, 109), firing the glass based dielectric layer (103,111), applying a metal based conductor (104, 113) over the dielectric layer (103,111), drying the metal based conductor layer (104,113), firing the glass and metal layers (103, 104, 111,113) producing a thick film and positioning LED die (105) into pockets between circuits for Chip-on-Board application and soldering packaged LED (114) onto the circuit, wherein the method allows for consolidation of thick film and bonding to substrate (100, 108).

Abstract translation: 提供一种制造板上衬底LED衬底（100）和表面贴装器件LED衬底（108）的方法，其特征在于，片上衬底LED衬底（100）和表面贴装器件LED衬底（108） 包括精细图案的厚膜，该方法包括以下步骤：在金属板（101,109）上形成玻璃基电介质层（103,111），烧制玻璃基电介质层（103,111），施加金属基导体 （104,113），在所述电介质层（103,111）之上，干燥所述金属基导体层（104,113），烧制产生厚膜的所述玻璃和金属层（103,104,111,113），并将LED管芯（105）定位在 电路板芯片应用和焊接封装的LED（114）到电路上，其中该方法允许厚膜的固结和结合到基板（100,108）。

公开(公告)号：US09277644B2

公开(公告)日：2016-03-01

申请号：US14246788

申请日：2014-04-07

Applicant: INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

公开(公告)号：US09204539B2

公开(公告)日：2015-12-01

申请号：US14560567

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: H03K17/96 ,  H05K1/02 ,  G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

公开(公告)号：US20150334826A1

公开(公告)日：2015-11-19

申请号：US14281631

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/08 ,  H05K3/10 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US20150223317A1

公开(公告)日：2015-08-06

申请号：US14423281

申请日：2013-06-27

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Sotaro Oi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0203 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/017 ,  H01L2924/00

Abstract: To provide a power-module substrate having a multi-layered structure which can meet higher integration by improving a performance of a power-cycle and a performance of a heat cycle: a plurality of circuit-layer metal-plates 4A to 4E, 5A, and 5B made of copper or copper alloy are bonded in a layered state intermediating a first ceramic substrate 2; a metal member 12 connecting both the circuit-layer metal-plates disposed on both surfaces of the first ceramic substrate 2 is inserted into a through hole 11 formed in the first ceramic substrate 2; a second ceramic substrate 3 is bonded on a surface of one side of the circuit-layer metal-plates 4A to 4E, 5A and 5B in the layered state; and a heat-radiation-layer metal-plate 6 made of aluminum or aluminum alloy is bonded on a surface of the second ceramic substrate 3 counter to the circuit-layer metal-plates 4A to 4E, 5A, and 5B.

Abstract translation: 提供具有多层结构的功率模块基板，其可以通过提高功率循环的性能和加热循环的性能来满足更高的集成度：多个电路层金属板4A至4E，5A， 由铜或铜合金制成的5B以中间化第一陶瓷基板2的层状结合; 将设置在第一陶瓷基板2的两面的电路层金属板连接的金属部件12插入到形成在第一陶瓷基板2中的通孔11中; 第二陶瓷基板3以层叠状态接合在电路层金属板4A〜4E，5A，5B的一侧的表面上; 在第二陶瓷基板3的与电路层金属板4A〜4E，5A，5B相反的表面上接合由铝或铝合金构成的散热层金属板6。

公开(公告)号：US20150107879A1

公开(公告)日：2015-04-23

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  C04B41/00 ,  H05K1/14

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US20150083565A1

公开(公告)日：2015-03-26

申请号：US14560528

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： KAI MENG ,  LIEN-HSIN LEE

IPC: H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

公开(公告)号：US20150070238A1

公开(公告)日：2015-03-12

申请号：US14268082

申请日：2014-05-02

Applicant: L. Pierre de Rochemont

Inventor： L. Pierre de Rochemont

IPC: H01Q9/04

CPC classification number: H01Q9/0414 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q15/0086 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T428/12493

Abstract: An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

Abstract translation: 电气部件提供位于电介质基板上或介质基板之间的陶瓷元件，其与一对电导体接触并接触，其中陶瓷元件包括一种或多种具有小于或等于1.5摩尔的金属 - 氧化物组成均匀性波动的金属氧化物 ％整个陶瓷元件。 一种制造电气部件的方法，在衬底上提供或形成与一对电导体接触的陶瓷元件，包括沉积金属有机前体的混合物并引起金属氧化物前体的同时分解以形成陶瓷元件，包括一个 或更多的金属氧化物。

公开(公告)号：US08729910B2

公开(公告)日：2014-05-20

申请号：US12718068

申请日：2010-03-05

Applicant: Kai Meng ,  Lien-Hsin Lee

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G01R27/26

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: The invention discloses a method of fabricating a capacitance touch panel module. The method includes providing a substrate with a touching area and a peripheral area; forming a plurality of first conductive patterns on the substrate along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covers one connecting portion; forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract translation: 本发明公开了一种电容触摸面板模块的制造方法。 该方法包括提供具有接触区域和周边区域的基板; 沿着第一取向在所述基板上形成多个第一导电图案，沿着第二取向形成多个第二导电图案，以及在所述接触区域中形成多个连接部分; 形成多个绝缘突起，其中每个绝缘突起覆盖一个连接部分; 在周边区域形成绝缘框架; 以及在每个绝缘突起上形成桥接构件。