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公开(公告)号：US11988776B2
公开(公告)日：2024-05-21
申请号：US18359477
申请日：2023-07-26
Applicant: STMicroelectronics (Alps) SAS
Inventor： Romain David , Xavier Branca
CPC classification number: G01S7/484 , G01S17/10 , H01S5/0428 , H01S5/062
Abstract: The present disclosure relates to a driver circuit for an optical light emitter of a ranging device, the driver circuit comprising: an inductor having a first of its nodes coupled to a current driver; a first branch comprising a first switch coupled between the second node of the inductor and a first supply voltage rail; a second branch for conducting a current through the optical light emitter, the second branch being coupled between the second node of the inductor and the first supply voltage rail; and a current sensor configured to detect the current passing through the inductor and to provide a feedback signal to the current driver.
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公开(公告)号：US11907156B2
公开(公告)日：2024-02-20
申请号：US17457553
申请日：2021-12-03
Applicant: STMicroelectronics France , STMicroelectronics (Alps) SAS
Inventor： Michael Soulie , Thomas Martin
CPC classification number: G06F15/7807 , G06F1/08 , G06F1/14
Abstract: According to one aspect, provision is made of a system-on-chip comprising a master device, a slave device, a clock configured to clock the operation of the slave device, a clock controller configured to activate or deactivate the clock and/or a power-on controller configured to power on/off the slave device, a control system configured to detect that the clock is deactivated and/or that the slave device is powered off when the master device emits an access request to the slave device, the master device being configured for activating the clock when the control system detects that this clock is deactivated and/or powering on the slave device when the control system detects that the slave device is powered off, then emitting a new access request to the slave device.
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公开(公告)号：US11876732B2
公开(公告)日：2024-01-16
申请号：US17100505
申请日：2020-11-20
Applicant: STMicroelectronics (Rousset) SAS , STMicroelectronics (Alps) SAS , STMicroelectronics (Grand Ouest) SAS
Inventor： Daniel Olson , Loic Pallardy , Nicolas Anquet
IPC: H04L41/0803 , H04L49/109 , G06F21/85
CPC classification number: H04L49/109 , G06F21/85 , H04L41/0803
Abstract: System on a chip, comprising several master pieces of equipment, several slave resources, an interconnection circuit coupled between the master pieces of equipment and the slave resources and capable of routing transactions between master pieces of equipment and slave resources. A first particular slave resource cooperates with an element of the system on a chip, for example a clock signal generator, and the element has the same access rights as those of the corresponding first particular slave resource.
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公开(公告)号：US20230385149A1
公开(公告)日：2023-11-30
申请号：US18313686
申请日：2023-05-08
Applicant: STMicroelectronics (Alps) SAS
Inventor： Jawad Benhammadi
CPC classification number: G06F11/1068 , G06F12/0246 , G06F13/1668
Abstract: In accordance with an embodiment, a method includes: performing a first write operation comprising writing a first data packet to a first portion of a first line of a flash memory; and performing a second write operation comprising writing a second data packet to a second portion of the first line of the flash memory, wherein the first line comprises the first data packet and the second data packet after performing the first write operation and the second write operation.
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公开(公告)号：US20230361528A1
公开(公告)日：2023-11-09
申请号：US18193190
申请日：2023-03-30
Applicant: STMicroelectronics (Alps) SAS
Inventor： Xavier Branca
CPC classification number: H01S5/062 , H01S5/0014 , H01S5/0617 , G01S7/484 , G01S17/10
Abstract: In according with an embodiment, a method for power supplying a laser diode includes: generating a power supply current injected directly into the laser diode; generating a power supply voltage biasing terminals of the laser diode; measuring a temperature in a vicinity of the laser diode; and controlling the power supply current at an adjusted intensity according to the measured temperature or controlling the power supply voltage at an adjusted level according to the measured temperature.
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Patent Agency Ranking
公开(公告)号：US20230327469A1
公开(公告)日：2023-10-12
申请号：US18335690
申请日：2023-06-15
Inventor： Alexandre Pons , Jean Camiolo , Meriem Mersel
IPC: H02J7/00
CPC classification number: H02J7/00712 , H02J7/007192 , H02J2207/20 , H02J2207/30
Abstract: An embodiment of the present disclosure relates to a power supply interface comprising: a converter delivering a first DC voltage; a resistor connected between the converter and an output terminal of the interface delivering a second DC voltage; a first circuit delivering a second signal representative of a difference between the second DC voltage and a voltage threshold when a first signal is in a first state, and at a default value otherwise; a second circuit delivering a third signal representative of a value of a current in first resistor multiplied by a gain of the third circuit, and modifying the gain based on the second signal; and a third circuit configured to deliver a signal for controlling the converter based at least on the third signal.
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公开(公告)号：US20230318171A1
公开(公告)日：2023-10-05
申请号：US18194855
申请日：2023-04-03
Inventor： Olivier Ptak , Ouafa Hajji , Georg Kimmich
Abstract: An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material.
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公开(公告)号：US20230297126A1
公开(公告)日：2023-09-21
申请号：US18119535
申请日：2023-03-09
Inventor： Alexandre TRAMONI , Florent SIBILLE , Patrick ARNOULD
CPC classification number: G05F1/46 , H04B5/0037
Abstract: An electronic device includes a near-field communication module and a powering circuit for delivering a power supply voltage to the near-field communication module. When the near-field communication module is in a low power mode, the powering circuit is configured for an operational mode where it is periodically started to provide the power supply voltage.
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公开(公告)号：US11757477B2
公开(公告)日：2023-09-12
申请号：US17187024
申请日：2021-02-26
Applicant: STMicroelectronics (Alps) SAS
Inventor： Frederic Rivoirard , Felix Gauthier
CPC classification number: H04B1/0096 , H03D7/125 , H04W88/06
Abstract: An embodiment integrated electronic device comprises a mixer module including a voltage/current transconductor stage including first transistors and connected to a mixing stage including second transistors, wherein the mixing stage includes a resistive degeneration circuit connected to the sources of the second transistors and a calibration input connected to the gates of the second transistors and intended to receive an adjustable calibration voltage, and the sources of the first transistors are directly connected to a cold power supply point.
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公开(公告)号：US11756874B2
公开(公告)日：2023-09-12
申请号：US17945822
申请日：2022-09-15
Inventor： David Auchere , Claire Laporte , Deborah Cogoni , Laurent Schwartz
CPC classification number: H01L23/50 , H01L23/315 , H01L23/3128
Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.
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