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    Multi-sacrificial layer and method
    151.
    发明授权
    Multi-sacrificial layer and method 有权
    多牺牲层和方法

    公开(公告)号：US08722537B2

    公开(公告)日：2014-05-13

    申请号：US12686878

    申请日：2010-01-13

    Applicant: Yao-Te Huang ,  Chia-Hua Chu ,  Yu-Nu Hsu ,  Chun-Wen Cheng ,  Li-Chung Peng

    Inventor： Yao-Te Huang ,  Chia-Hua Chu ,  Yu-Nu Hsu ,  Chun-Wen Cheng ,  Li-Chung Peng

    IPC: H01L21/44

    CPC classification number: H01G7/06 ,  B81B2201/0221 ,  B81C1/0015 ,  B81C2201/0109 ,  H01G7/00 ,  H01L28/60

    Abstract: MEMS devices and methods for utilizing sacrificial layers are provided. An embodiment comprises forming a first sacrificial layer and a second sacrificial layer over a substrate, wherein the second sacrificial layer acts as an adhesion layer. Once formed, the first sacrificial layer and the second sacrificial layer are patterned such that the second sacrificial layer is undercut to form a step between the first sacrificial layer and the second sacrificial layer. A top capacitor electrode is formed over the second sacrificial layer, and the first sacrificial layer and the second sacrificial layer are removed in order to free the top capacitor electrode.

    Abstract translation: 提供了用于利用牺牲层的MEMS器件和方法。 一个实施例包括在衬底上形成第一牺牲层和第二牺牲层，其中第二牺牲层用作粘附层。 一旦形成，第一牺牲层和第二牺牲层被图案化，使得第二牺牲层被底切以在第一牺牲层和第二牺牲层之间形成台阶。 在第二牺牲层上形成顶部电容器电极，并且去除第一牺牲层和第二牺牲层以便释放顶部电容器电极。

    VARIABLE CAPACITOR
    153.
    发明申请
    VARIABLE CAPACITOR 有权
    可变电容器

    公开(公告)号：US20140055908A1

    公开(公告)日：2014-02-27

    申请号：US14066498

    申请日：2013-10-29

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Shinji MURATA

    IPC: H01G5/16

    CPC classification number: H01G5/16 ,  B81B3/0056 ,  B81B2201/0221 ,  H01G5/18 ,  H01G5/38

    Abstract: A variable capacitor includes a plurality of variable capacitor elements connected in parallel with one another, the variable capacitor elements each including a fixed electrode and a movable electrode facing each other, a beam supporting the movable electrode displaceably, and a drive electrode supplied with a drive voltage to change spacing between the fixed electrode and the movable electrode. The variable capacitor further includes a drive control unit configured to sequentially apply an AC drive voltage to the drive electrodes of the variable capacitor elements with a predetermined phase difference for each element. The sum of capacitances of the variable capacitor elements is an output capacitance.

    Abstract translation: 可变电容器包括彼此并联连接的多个可变电容器元件，每个可变电容器元件包括固定电极和彼此面对的可动电极，可移动地支撑可动电极的光束和提供有驱动器的驱动电极 电压以改变固定电极和可动电极之间的间隔。 可变电容器还包括驱动控制单元，其配置成以对于每个元件具有预定的相位差顺序地将AC驱动电压施加到可变电容器元件的驱动电极。 可变电容器元件的电容之和是输出电容。

    MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME
    155.
    发明申请
    MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    MEMS元件及其制造方法

    公开(公告)号：US20130285163A1

    公开(公告)日：2013-10-31

    申请号：US13802520

    申请日：2013-03-13

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Yuriko KATO ,  Hiroaki YAMAZAKI ,  Etsuji OGAWA ,  Takayuki MASUNAGA

    IPC: B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/0221 ,  H01G5/18

    Abstract: According to one embodiment, a MEMS element comprises a first electrode fixed on a substrate, and a second electrode arranged above the first electrode, facing the first electrode, and vertically movable. The second electrode includes a second opening portion that penetrates from an upper surface to a lower surface of the second electrode. The first electrode includes a first opening portion at a position corresponding to at least a part of the second opening portion, the first opening portion penetrating from an upper surface to a lower surface of the first electrode.

    Abstract translation: 根据一个实施例，MEMS元件包括固定在基板上的第一电极和布置在第一电极之上的面向第一电极并且可垂直移动的第二电极。 第二电极包括从第二电极的上表面到下表面穿透的第二开口部分。 第一电极包括在对应于第二开口部分的至少一部分的位置处的第一开口部分，第一开口部分从第一电极的上表面穿透到下表面。

    MEMS capacitive device and method of forming same
    157.
    发明授权
    MEMS capacitive device and method of forming same 有权
    MEMS电容器件及其形成方法

    公开(公告)号：US08149564B2

    公开(公告)日：2012-04-03

    申请号：US12391083

    申请日：2009-02-23

    Applicant: Lianjun Liu ,  Melvy F. Miller

    Inventor： Lianjun Liu ,  Melvy F. Miller

    IPC: H01G5/00 ,  H01G7/00

    CPC classification number: H01G5/011 ,  B81B3/0072 ,  B81B2201/0221 ,  H01G5/18 ,  H01L28/40 ,  H01L41/0973 ,  Y10T29/435

    Abstract: A MEMS capacitive device (90) includes a fixed capacitor plate (104) formed on a surface (102) of a substrate (100). A movable capacitor plate (114) is suspended above the fixed capacitor plate (104) by compliant members (116) anchored to the surface (102). A movable element (120) is positioned in spaced apart relationship from the movable capacitor plate (104) and has an actuator (130) formed thereon. Actuation of the actuator (130) causes abutment of a portion of the movable element (120) against a contact surface (136) of the movable plate (114). The abutment moves the movable plate (114) toward the fixed plate (104) to alter a capacitance (112) between the plates (104, 114). Another substrate (118) may be coupled to the substrate (100) such that a surface (126) of the substrate (118) faces the surface (102) of the substrate (100). The movable element (120) may be formed on the surface (126).

    Abstract translation: MEMS电容器件（90）包括形成在衬底（100）的表面（102）上的固定电容器板（104）。 可移动电容器板（114）通过锚固到表面（102）的柔性构件（116）悬置在固定电容器板（104）的上方。 可移动元件（120）与可移动电容器板（104）间隔开并且具有形成在其上的致动器（130）。 致动器（130）的致动导致可移动元件（120）的一部分抵靠可动板（114）的接触表面（136）。 抵靠将可移动板（114）移向固定板（104）以改变板（104,114）之间的电容（112）。 衬底（118）可以耦合到衬底（100），使得衬底（118）的表面（126）面向衬底（100）的表面（102）。 可移动元件（120）可以形成在表面（126）上。

    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    159.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 有权
    使用多个小型MEMS器件来替代大型MEMS器件的方法

    公开(公告)号：US20100116632A1

    公开(公告)日：2010-05-13

    申请号：US12614929

    申请日：2009-11-09

    Applicant: CHARLES GORDON SMITH ,  Richard L. Knipe ,  Vikram Joshi ,  Roberto Gaddi ,  Anartz Unamuno ,  Robertus Petrus Van Kampen

    Inventor： CHARLES GORDON SMITH ,  Richard L. Knipe ,  Vikram Joshi ,  Roberto Gaddi ,  Anartz Unamuno ,  Robertus Petrus Van Kampen

    IPC: H01H57/00 ,  H05K1/16 ,  H01H47/02

    CPC classification number: B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    Abstract translation: 本文公开的实施例通常包括使用大量的小MEMS器件来代替单个更大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件具有与较大器件相同的功能，但是由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺封装在腔中。 通过大量较小器件的信号平均，允许较小器件阵列的精度等同于较大的器件。 通过考虑使用具有惯性响应的集成模数转换的基于MEMS的加速度计开关阵列来举例说明该过程。 还通过考虑使用MEMS器件结构（其中MEMS器件并行地作为数字可变电容器）来使用该过程。

    ELECTRICAL DEVICE
    160.
    发明申请
    ELECTRICAL DEVICE 有权
    电气设备

    公开(公告)号：US20090188709A1

    公开(公告)日：2009-07-30

    申请号：US12358869

    申请日：2009-01-23

    Applicant: Akihiro KOJIMA ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

    Inventor： Akihiro KOJIMA ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

    IPC: H05K1/16 ,  B05D5/12

    CPC classification number: B81B7/0038 ,  B81B2201/0221 ,  B81B2203/04 ,  B81C1/00476

    Abstract: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.

    Abstract translation: 衬底包括功能元件。 绝缘的第一膜形成空腔，其与基板一起存储功能元件，并且包括多个通孔。 绝缘的第二膜覆盖多个通孔，形成在第一膜上，并且具有比第一膜高的透气性。 在第二薄膜上形成绝缘的第三薄膜，其透气度低于第二薄膜。 绝缘的第四膜形成在第三膜上，并且具有大于第三膜的弹性。

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