Distributed configuration of programmable devices

    公开(公告)号:US12056505B2

    公开(公告)日:2024-08-06

    申请号:US17862257

    申请日:2022-07-11

    Applicant: XILINX, INC.

    CPC classification number: G06F9/44505

    Abstract: Embodiments herein describe a distributed configuration system for a configurable device. Instead of relying solely on a central configuration manager to distribute configuration information to various subsystems in the device, the embodiments herein include configuration interface managers (CIM) that are distributed in different regions of the device, whether those regions are in one integrated circuit or include multiple integrated circuits. The embodiments can still use a central configuration manager to distribute configuration information in a device image to the plurality of CIMs, which can then forward the configuration information to their assigned regions.

    Single event upset tolerant memory device

    公开(公告)号:US12045469B2

    公开(公告)日:2024-07-23

    申请号:US18082223

    申请日:2022-12-15

    Applicant: XILINX, INC.

    CPC classification number: G06F3/0619 G06F3/0629 G06F3/0673

    Abstract: A memory device is disclosed herein that leverages high ratio column MUXES to improve SEU resistance. The memory device may be utilized in an integrated circuit die and chip packages having the same. In one example, as semiconductor memory device is provided that includes first and second arrays of semiconductor memory cells, a plurality of sense amplifiers configured to read data states from the first and second arrays of memory cells, and a first plurality of high ratio MUXES connecting the first and second arrays of memory cells to the plurality of sense amplifiers.

    PROGRAMMABLE HYBRID MEMORY AND CAPACITIVE DEVICE IN A DRAM PROCESS

    公开(公告)号:US20240224542A1

    公开(公告)日:2024-07-04

    申请号:US18090216

    申请日:2022-12-28

    Applicant: XILINX, INC.

    CPC classification number: H10B80/00 H01L23/5223 H01L23/5286

    Abstract: A DRAM fabrication process for producing a semiconductor die adapted for having the ability to be both a hybrid memory and power supply capacitance. DRAM arrays on a semiconductor die may be individually selected to function as either a memory or as supplemental capacitance on a power distribution network serving circuits on one or more semiconductor dice in a three-dimensional active-on-active (AoA) stacked semiconductor die package configuration. Defective DRAM array trench capacitors can be repurposed to serve as supplemental capacitance on a power distribution network. DRAM array trench capacitors can be dynamically reassigned as supplemental capacitance when power supply monitors sense that additional power supply capacitance is needed.

    Dynamic port handling for isolated modules and dynamic function exchange

    公开(公告)号:US12026444B2

    公开(公告)日:2024-07-02

    申请号:US17522834

    申请日:2021-11-09

    Applicant: Xilinx, Inc.

    Inventor: Hao Yu Jun Liu

    CPC classification number: G06F30/343 G06F30/327 G06F30/347

    Abstract: Dynamic port handling for circuit designs can include inserting, within a static isolated module of a circuit design, static drivers configured to drive isolated modules of reconfigurable module (RM) instances for inclusion in an RM of the circuit design. For each RM instance of a plurality of RM instances to be inserted into the RM, one or more additional ports can be inserted in the RM based on a number of isolated modules included in a current RM instance. Further, net(s) corresponding to the additional port(s) can be created. The circuit design, including the current RM instance, the additional port(s), and the net(s), can be placed and routed. Prior to the inserting and the performing place and route for a next RM instance to be inserted into the RM, the current RM instance can be removed from the RM along with the additional port(s) and the net(s).

    Systems and methods to transport memory mapped traffic amongst integrated circuit devices

    公开(公告)号:US12019576B2

    公开(公告)日:2024-06-25

    申请号:US17879675

    申请日:2022-08-02

    Applicant: XILINX, INC.

    CPC classification number: G06F13/4027 G06F2213/40

    Abstract: Embodiments herein describe a decentralized chip-to-chip (C2C) interface architecture to transport memory mapped traffic amongst heterogeneous IC devices in a packetized, scalable, and configurable manner. An IC chip may include functional circuitry that exchanges memory-mapped traffic with an off-chip device, a NoC that packetizes and de-packetizes memory-mapped traffic and routes the packetized memory-mapped traffic between the functional circuitry and the off-chip device, and NoC inter-chip bridge (NICB) circuitry that interfaces between the NoC and the off-chip device over C2C interconnections. The NICB circuitry may be configurable in a full mode to map packetized memory-mapped traffic to the C2C interconnections in a 1:1 fashion and in a compressed to map packetized memory-mapped traffic to the C2C interconnections in a less-than 1:1 fashion.

    Lock-stepping asynchronous logic
    169.
    发明授权

    公开(公告)号:US12019526B2

    公开(公告)日:2024-06-25

    申请号:US17746843

    申请日:2022-05-17

    Applicant: XILINX, INC.

    CPC classification number: G06F11/1679 H03L7/0814

    Abstract: Methods and systems to detect a metastable condition and suppress/mask a signal during the metastable condition. The metastable condition may arise from asynchronous sampling. Techniques disclosed herein may be configured to enable asynchronous lock-stepping, where outputs of redundant circuit blocks of a first clock domain are received at input nodes of a second clock domain. In the second clock domain, logic states at the input nodes are compared to detect errors, and results of the comparison are masked during transitions at the input nodes. Masking may be constrained to situations where logic states at the input nodes differ.

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