PRODUCTION OF HEAT TRANSMISSION PIPE

    公开(公告)号:JPS61270394A

    公开(公告)日:1986-11-29

    申请号:JP11244185

    申请日:1985-05-24

    Abstract: PURPOSE:To form a metallic plating layer having adequate dendrite ruggedness on the wall surface of a heat transmission pipe by mixing oxygen with a plating liquid added with an oxyethylene surface active agent and a low concn. of chloride ions just before the heat transmission pipe and admitting the liquid into the heat transmission pipe. CONSTITUTION:The heat transmission pipe 10 and fins 3 are tentatively fitted in the specified position. The pipe 10 and the fins 3 are press welded by expanding the pipe 10. The pipe 10, a connecting pipe 11 and a circulation pump 12 are combined and the acidic copper sulfate plating liquid 9 added with the oxyethylene surface active agent and a low concn. of chloride in a plating cell 7 is circulated into the pipe 10. Positive electric charge is thereupon applied to a counter electrode 14 formed by plating platinum to a titanium bar by a DC power source to use the same as the anode side. Negative charge is applied to a connecting terminal 15 as the cathode side. The plating liquid 9 is mixed with the oxygen generated by electrolysis from the electrode 14 and is admitted into the pipe 10 to form the rugged plating layer on the inside wall surface thereof.

    HEAT EXCHANGER
    169.
    发明专利

    公开(公告)号:JPS61201797A

    公开(公告)日:1986-09-06

    申请号:JP4222885

    申请日:1985-03-04

    Abstract: PURPOSE:To accelerate boiling heat transfer by a heat exchanger tube by carrying out expanding work for fixing heat radiating fins and by forming an uneven metallic layer on the inner wall surface of the heat exchanger tube by plating so as to increase the surface area. CONSTITUTION:A heat exchanger tube is expanded so as to fix heat radiating fins on the outside of the tube, and a metallic layer having ruggedness is formed on the inner wall surface of the heat exchanger tube by plating with a plating soln. contg. an oxyethylene surfactant and chloride ions as additives. A copper plating soln. such as an acidic plating soln. contg. copper sulfate is advantageously used as the plating soln. from the viewpoint of heat conductivity.

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