Abstract:
A driver circuit may include a first node (VA), and a first circuit to generate on the first node (VA) an inverted replica of an input signal (VIN) during driver switching between a first supply voltage (Vdd1) and ground, the inverted replica having a threshold voltage value based upon a reference voltage (Vref) greater than the first supply voltage (Vdd1). The driver circuit may include a cascode stage (M3) to be controlled by the reference voltage (Vref) and to be coupled between a second supply voltage (Vdd2) and the first node, a delay circuit (D) to generate a delayed replica of the input signal (VIN), an amplifier, and a switching network (M5, M6) to couple a control terminal of an active load transistor (M9) either to one of the reference voltage (Vref) or to ground, based upon the input signal (VIN).
Abstract:
A testing system for carrying out electrical testing of at least a through via (10) extending, at least in part, through a substrate (3) of a body (2) of semiconductor material and having a first end (10b) buried within the substrate (3) and not accessible from the outside of the body (2). The testing system has an electrical test circuit (22) integrated in the body (2) and electrically coupled to the through via (10) and to electrical-connection elements (8) carried by the body (2) for electrical connection towards the outside; the electrical test circuit (22) has a buried microelectronic structure (28) integrated in the substrate (3) so as to be electrically coupled to the first end (10b) of the through via (10), thereby closing an electrical path within the substrate (3) and enabling detection of at least one electrical parameter of the through via (10) through the electrical-connection means (8).
Abstract:
Circuit (1) of a voltage controlled oscillator comprising: - a bridge structure including two cross-coupled transistors of N type (M 3 , M 4 ) and two cross-coupled transistors of P type (M 5 , M 6 ); - a current mirror (3) connected to the two cross-coupled transistors of N type (M 3 , M 4 ) and arranged to generate a bias current (I B ) for the circuit (1); - an LC resonator (2) placed in parallel between the two cross-coupled transistors of N type (M 3 , M 4 ) and the two cross-coupled transistors of P type (M 5 , M 6 ). The circuit (1) is characterised in that the LC resonator (2) comprises: two pairs of differential inductors (L 1 , L 2 ) mutually coupled by means of a mutual inductance coefficient (M), each pair comprising a first inductor (L 1 ) arranged on a respective branch (10a) of an external loop, and a second inductor (L 2 ) arranged on a respective branch (12a) of an internal loop; a first varactor (C v33 ) connected to a common node (A) and to a first branch (12a) of the internal loop; a second varactor (C v33 ) connected to the common node (A) and to a second branch (12a) of the internal loop.
Abstract:
It is described a driving circuit (1) having at least one output terminal (OUT) connected to an ultrasonic pulse generator circuit and providing thereto with an output voltage (Vout), characterized in that it comprises at least one first portion (2A) connected to a first voltage reference (VPH) and including at least one first output transistor (MOP) being inserted between the first voltage reference (VPH) and the output terminal (OUT), such a first portion (2A) further comprising: at least one first high voltage comparator (3A) being connected to said output terminal (OUT) and to a first threshold voltage reference (VTHP), at least one first start-up circuit (4A) being controlled by a first setting signal (SETP); at least one first switching ON /OFF circuit (5A) being connected at its input to the first start-up circuit (4A), in correspondence with a first internal circuit node (XP), and to the first high voltage comparator (3A), in correspondence with a second internal circuit node (YP), and at its output to a control terminal of the first output transistor (MOP); the first start-up circuit (4A) providing a switching on signal (ONA) to the first switching on/ off circuit (5A) while the high voltage comparator (3A) provides a switching off signal (OFFA) to the first switching on/ off circuit (5A) which causes the switching off of the output transistor (MOP), the high voltage comparator (3A) generating the switching off signal (OFFA) when the output voltage (Vout) reaches a first desired supply voltage value which depends on the value of the first threshold voltage reference (VTHP).
Abstract:
In order to verify robustness in regard to electrical overstresses of an electronic circuit under test (DUT), the latter is exposed to electrical overstresses (12, 14), and the behaviour thereof following upon exposure to said electrical overstresses is monitored (18). Moreover, the electrical overstress is applied to the electronic circuit (DUT) when the electronic circuit (DUT) is in its normal applicational conditions of operation. In particular, there is envisaged both the testing of the electronic circuit (DUT) in dynamic conditions by causing it to be traversed by the currents that characterize operation thereof and by exposing at least one supply line (20) of said electronic circuit under test (DUT) to electrical overstresses and the testing of said electronic circuit under test (DUT) in static conditions, without causing it to be traversed by the currents that characterize operation thereof and by exposing to electrical overstresses both the supply (20) and the input and/or output lines of said electronic circuit under test (DUT). The device (14) for generating the overstresses can be mounted on a circuit board (12), which can be coupled as daughter board to a mother board (10), on which the electronic circuit under test (DUT) is mounted.
Abstract:
A method for carrying out nucleic acid amplification, includes providing a reaction chamber (31), accommodating an array (36) of nucleic acid probes (37) at respective locations, for hybridizing to respective target nucleic acids; and introducing a solution (50) into the reaction chamber (31), wherein the solution (50) contains primers, capable of binding to target nucleic acids, nucleotides, nucleic acid extending enzymes and a sample including nucleic acids. The a structure of the nucleic acid probes (37) and of the primers so that a hybridization temperature (T H ) of the probes (37) is higher than an annealing temperature (T A ) of the primers, whereby hybridization and annealing take place in respective separate temperature ranges (R H , R A ).
Abstract:
A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.
Abstract:
A probe card (105') adapted for testing at least one integrated circuit integrated on corresponding at least one die (145) of a semiconductor material wafer, the probe card including a board (125') adapted for the coupling to a tester apparatus, and a plurality of probes (225) coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units (135'), each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test (145), the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.
Abstract:
PDs that can be supplied through the LAN line are discriminated from PDs that cannot be so supplied in function of the resistance of the supply line and of the voltage drop Vdrop caused by nonlinear elements in series therewith. The values of these two parameters are estimated by applying two distinct voltages to the supply terminals of the LAN line and sensing the relative steady-state currents absorbed by the power supply line and by processing voltage and current values for estimating the resistance (Rdet) of the line and the voltage drop (Vdrop) caused by nonlinear elements connected in series therewith.
Abstract:
The present invention- relates to the use of a nitroaniline derivative of Formula I for the production of nitric oxide and for the preparation of a medicament for the treatment of a disease wherein the administration of nitric oxide is beneficial. The present invention furthermore relates to a method for the production of NO irradiating a nitroaniline derivative of Formula I, a kit comprising a nitroaniline derivative of Formula I and a carrier and to a system comprising a source of radiations and a container associated to a nitroaniline derivative of Formula I. In Formula I, R and R I are each independently hydrogen or a C 1 -C 3 alkyl group; R II is hydrogen or an alkyl group.