公开(公告)号：JP2015515763A

公开(公告)日：2015-05-28

申请号：JP2014554997

申请日：2013-06-26

Applicant: インテル コーポレイション ,  インテル コーポレイション

Inventor： スー，ハオ−ハン ,  マハメード，ラシェッド ,  エー． アブデルモネウム，モハメッド ,  エー． アブデルモネウム，モハメッド ,  ハン，ドン−ホ

IPC: H01P1/10 ,  B81B3/00 ,  B81B7/02 ,  B81C1/00 ,  H01H49/00 ,  H01H57/00 ,  H01H59/00 ,  H01L41/09

CPC classification number: H01H59/0009 ,  B81B3/0056 ,  B81B2201/014 ,  B81B2203/0118 ,  H01H2001/0084 ,  H01H2057/006 ,  H01L41/094 ,  Y10T29/42

Abstract: 静電作動及び圧電作動を含むハイブリッドRF MEMSコンポーネント設計を提供し得る方法及びシステム。一例では、その方法は、片持ち梁と作動電極との間の第1ギャップを小さくすべく第1圧電力を発生させるために第1電圧を印加すること、及び、その片持ち梁と伝送電極との間の接触を創出すべく静電気力を発生させるために第2電圧を印加することを含み得る。

Abstract translation: 该方法和系统可以提供混合RF MEMS组件的设计，包括静电致动和压电驱动。 在一个示例中，该方法包括：生成第一压电力，从而减少了悬臂和工作电极，和发送电极和所述悬臂之间的间隙施加第一电压施加到第一 它可以包括将第二电压施加，以创建之间的接触，以产生静电力。

公开(公告)号：JP5679058B2

公开(公告)日：2015-03-04

申请号：JP2013522627

申请日：2011-07-04

Applicant: 富士通株式会社

Inventor： 中谷　忠司 ,  忠司 中谷 ,  奥田　久雄 ,  久雄 奥田 ,  勝木　隆史 ,  隆史 勝木 ,  上田　知史 ,  知史 上田

IPC: H01H59/00 ,  B81B3/00 ,  B81C1/00 ,  H01H49/00 ,  H01H57/00

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81C1/00976 ,  H01H2001/0084 ,  H01H2059/0072

公开(公告)号：JP2013503446A

公开(公告)日：2013-01-31

申请号：JP2012526823

申请日：2010-08-12

Applicant: インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation

Inventor： アンダーソン、フェリックス、ピー ,  マクデビッド、トーマス、エル ,  スタンパー、アンソニー、ケー

IPC: H01H49/00 ,  B81B3/00 ,  B81C1/00 ,  H01H59/00

CPC classification number: B81C1/0015 ,  B81B3/0018 ,  B81B2201/014 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  G06F17/5068 ,  H01L21/302

Abstract: Integrated MEMS switches, design structures and methods of fabricating such switches are provided. The method includes forming at least one tab of sacrificial material on a side of a switching device which is embedded in the sacrificial material. The method further includes stripping the sacrificial material through at least one opening formed on the at least one tab which is on the side of the switching device, and sealing the at least one opening with a capping material.

公开(公告)号：JP2011003530A

公开(公告)日：2011-01-06

申请号：JP2010055045

申请日：2010-03-11

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： NAKATANI TADASHI ,  INOUE HIROAKI ,  YAMADA HITOSHI ,  UEDA TOMOSHI

IPC: H01H59/00 ,  B81B3/00 ,  B81C3/00 ,  H01G5/16 ,  H01H49/00

CPC classification number: H01H59/0009 ,  B81B7/007 ,  B81B2201/014 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30105

Abstract: PROBLEM TO BE SOLVED: To provide an electronic device capable of being structured as a wafer-level package while achieving reduced size and height.SOLUTION: An electronic device includes: a substrate 11; a stationary contact electrode 13 provided above the substrate; a movable contact electrode 12 provided so as to face the stationary contact electrode 13; a wall 17 provided on the substrate so as to surround the stationary and movable contact electrodes; a film member 20 fixed to the wall 17 and sealing a space including the movable contact electrode 12 and the stationary contact electrode 13; and a support 18 provided on an inner side of the wall 17 on the substrate and provided to support the film member 20 from within the space in addition to the movable contact electrode 12 and the stationary contact electrode 13.

Abstract translation: 要解决的问题：提供一种能够被构造为晶片级封装的电子器件，同时实现减小的尺寸和高度。解决方案：电子器件包括：衬底11; 设置在基板上方的固定接触电极13; 设置为与固定接触电极13相对的可动接触电极12; 设置在基板上以围绕固定和可动接触电极的壁17; 固定在壁17上并密封包括可动接触电极12和固定接触电极13的空间的膜构件20; 以及设置在基板上的壁17的内侧的支撑体18，并且设置成除了可动接触电极12和固定接触电极13之外还在空间内支撑膜构件20。

公开(公告)号：JP4580826B2

公开(公告)日：2010-11-17

申请号：JP2005178367

申请日：2005-06-17

Applicant: 株式会社東芝

Inventor： 隆 川久保 ,  亨彦 西垣 ,  利彦 長野 ,  和秀 阿部

IPC: B81B3/00 ,  H01G5/00 ,  H01G5/18 ,  H01H57/00 ,  H02N2/00

CPC classification number: B81B3/0021 ,  B81B2201/014 ,  B81B2201/045 ,  G02B26/0858 ,  H01G5/18 ,  H01G5/40 ,  H01H2057/006

Abstract: A micro-mechanical device includes a first piezoelectric actuator including a piezoelectric film, and lower and upper electrodes interleaving the piezoelectric film, and extending from a first fixing part on a substrate to a first operating end, and a second piezoelectric actuator connected to the first piezoelectric actuator via a connecting part at the first operating end of the first piezoelectric actuator, and extending from the connecting part to a second operating end, the second piezoelectric actuator being shorter than the first piezoelectric actuator.

Abstract translation: 微机械装置包括：第一压电致动器，其包括压电膜，下电极和上电极交错压电膜，并从衬底上的第一固定部分延伸到第一操作端;以及第二压电致动器， 压电致动器经由第一压电致动器的第一操作端处的连接部分并且从连接部分延伸到第二操作端，第二压电致动器比第一压电致动器短。

公开(公告)号：JP2008238330A

公开(公告)日：2008-10-09

申请号：JP2007082045

申请日：2007-03-27

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： KAWAKUBO TAKASHI ,  NAGANO TOSHIHIKO ,  NISHIGAKI MICHIHIKO

IPC: B81B3/00 ,  H01G5/18 ,  H01H57/00 ,  H01H59/00 ,  H01L41/09 ,  H01L41/18 ,  H02N2/00 ,  H02N2/12 ,  H02N13/00

CPC classification number: H01L41/094 ,  B81B3/001 ,  B81B2201/014 ,  H01G5/18 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072

Abstract: PROBLEM TO BE SOLVED: To provide a MEMS (Micro-Electro-Mechanical System) device having low operation voltage and strong pressure contact force and separating force. SOLUTION: This MEMS device has a substrate 1, a supporting part 2 provided on the substrate 1, a fixed electrode 10 provided on the substrate 1, a first electrode 4, a first piezoelectric film 5 formed on the first electrode 4, and a second electrode 6 formed on the first piezoelectric film 5. The MEMS device is provided with an actuator 3 having one end fixed to the substrate 1 via the supporting part 2, extended in a direction for connecting the supporting part 2 and the fixed electrode 10 and provided with the first electrode 4 to be opposed to the fixed electrode 10, and a stopper part 9 provided on a straight line for connecting the supporting part 2 and the fixed electrode 10 and provided on the substrate 1 to be opposed to the first electrode 4. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供具有低操作电压和强大的压力接触力和分离力的MEMS（微机电系统）装置。 解决方案：该MEMS器件具有基板1，设置在基板1上的支撑部2，设置在基板1上的固定电极10，第一电极4，形成在第一电极4上的第一压电膜5， 以及形成在第一压电膜5上的第二电极6. MEMS器件设置有致动器3，致动器3的一端经由支撑部件2固定到基板1，沿着连接支撑部件2和固定电极的方向延伸 并且设置有与固定电极10相对的第一电极4和设置在用于连接支撑部2和固定电极10的直线上并设置在基板1上以与第一电极相对的第一电极4的止动部9 电极4.版权所有（C）2009，JPO＆INPIT

公开(公告)号：JPS5973826A

公开(公告)日：1984-04-26

申请号：JP13356783

申请日：1983-07-21

Applicant: Tektronix Inc

Inventor： ROBAATO AREN MIYUURAA

IPC: H01H37/32 ,  B81B3/00 ,  H01H1/00 ,  H01H1/20 ,  H01H37/52 ,  H01H61/00 ,  H01H61/02 ,  H01H61/04

CPC classification number: H01H61/02 ,  B81B3/0086 ,  B81B2201/014 ,  H01H1/0036 ,  H01H1/20 ,  H01H2061/006

公开(公告)号：EP2524383A4

公开(公告)日：2018-03-28

申请号：EP11733466

申请日：2011-01-14

Applicant: WISPRY INC

Inventor： DEREUS DANA

IPC: H01G5/16 ,  B81B3/00 ,  H01G5/18 ,  H02N1/00

CPC classification number: H01G5/18 ,  B81B3/007 ,  B81B2201/014 ,  H02N1/006

Abstract: The present subject matter relates to MEMS tunable capacitors and methods for operating such capacitors. The tunable capacitor can feature a primary stationary actuator electrode on a substrate, a secondary stationary actuator electrode on the substrate, a stationary RF signal capacitor plate electrode on the substrate, a sprung cantilever disposed over the substrate, a beam anchor connecting a first end of the sprung cantilever to the substrate, and one or more elastic springs or other biasing members connecting a second end of the sprung cantilever to the substrate, the second end being located distally from the first end. The spring cantilever can be movable between an OFF state defined by the potential difference between the stationary and moveable actuator electrodes being zero, and an ON state defined by a non-zero potential difference between the stationary and moveable actuator electrodes.

公开(公告)号：EP2739562B1

公开(公告)日：2017-12-20

申请号：EP12746449.3

申请日：2012-08-03

Applicant: Cavendish Kinetics, Inc.

Inventor： TROY, Brian I. ,  RENAULT, Mickael ,  MAGUIRE, Thomas L. ,  LACEY, Joseph Damian Gordon ,  BOBEY, James F.

IPC: B81B3/00 ,  B81C1/00 ,  H01H1/00

CPC classification number: B81C1/00484 ,  B81B3/0008 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0108 ,  H01H1/0036 ,  H01H2001/0089

公开(公告)号：EP2833388A3

公开(公告)日：2015-03-11

申请号：EP14178181.5

申请日：2014-07-23

Applicant: Analog Devices Technology

Inventor： Macnamara, John G. ,  Fitzgerald, Padraig L. ,  Goggin, Raymond C. ,  Stenson, Bernard Patrick

IPC: H01H59/00 ,  B81C1/00 ,  H01H1/00

CPC classification number: H01H59/0009 ,  B81B7/007 ,  B81B2201/014 ,  B81B2207/092 ,  B81C1/00341 ,  H01H2001/0052 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/181 ,  Y10T307/937 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS switch device including: a substrate layer; an insulating layer formed over the substrate layer; and a MEMS switch module having a plurality of contacts formed on the surface of the insulating layer, wherein the insulating layer includes a number of conductive pathways formed within the insulating layer, the conductive pathways being configured to interconnect selected contacts of the MEMS switch module.

Abstract translation: 一种MEMS开关装置，包括：衬底层; 形成在衬底层上的绝缘层; 以及MEMS开关模块，其具有形成在绝缘层的表面上的多个触点，其中绝缘层包括形成在绝缘层内的多个导电通路，导电通路被配置为互连MEMS开关模块的选定触点。