公开(公告)号：US20070069605A1

公开(公告)日：2007-03-29

申请号：US11453697

申请日：2006-06-15

Applicant: Gerrit Klaasse ,  Hendrikus Tilmans

Inventor： Gerrit Klaasse ,  Hendrikus Tilmans

IPC: H02N1/00 ,  H01L41/00

CPC classification number: B81B3/0072 ,  B81B2201/016 ,  H01L41/0933 ,  H02N1/002

Abstract: Micro electromechanical devices and methods for designing such devices are disclosed. An example micro electromechanical device includes at least two anchors. The example device also includes a floating element. The floating element extends between the at least two anchors and includes a predetermined reference portion. In at least one predetermined state during operation of the device, the reference portion is located within a predetermined reference plane. The floating element includes at least two flexible sections, where the at least two flexible sections each extends between the reference portion and a respective one of the anchors. In the example device, at least two of the at least two flexible sections include respective stress relieving elements. The stress relieving elements enable deflection of the floating element as a result of a stress gradient. The stress relieving elements are provided at predetermined locations between the respective anchors and the reference portion, where the predetermined locations are selected such that the reference portion is substantially located within the predetermined reference plane in the at least one predetermined state of the device.

Abstract translation: 公开了用于设计这种装置的微机电装置和方法。 示例性微机电装置包括至少两个锚。 示例设备还包括浮动元件。 浮动元件在至少两个锚固件之间延伸并且包括预定的参考部分。 在设备运行期间的至少一个预定状态下，参考部分位于预定的参考平面内。 浮动元件包括至少两个柔性部分，其中至少两个柔性部分各自在参考部分和相应的一个锚固件之间延伸。 在示例性装置中，至少两个柔性部分中的至少两个包括各自的应力释放元件。 应力消除元件使得浮动元件由于应力梯度而偏转。 应力消除元件设置在相应的锚固件和参考部分之间的预定位置处，其中预定位置被选择为使得参考部分在装置的至少一个预定状态中基本上位于预定参考平面内。

公开(公告)号：US07045440B2

公开(公告)日：2006-05-16

申请号：US10663986

申请日：2003-09-17

Applicant: Michael A. Huff ,  Mehmet Ozgur

Inventor： Michael A. Huff ,  Mehmet Ozgur

IPC: H01L21/46 ,  H01L21/50

CPC classification number: B82Y30/00 ,  B81B7/0064 ,  B81B2201/016 ,  B81B2207/015 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C2203/0118 ,  B81C2203/035 ,  H01G5/16 ,  H01G5/18 ,  H01G5/40 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072 ,  H01L2224/16225 ,  H01L2924/15153 ,  H01P1/127 ,  H01P1/184 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q15/0013 ,  H01Q15/004 ,  H01Q21/0087 ,  H05K1/0306 ,  H05K1/16

Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

Abstract translation: 使用微机电开关（“MEMS”）和低温共烧陶瓷（“LTCC”）技术的相控阵天线系统和其它类型的射频（RF）装置和系统以及制造这种相控阵天线的方法 系统和其他类型的射频（RF）设备。 每个天线或其他类型的装置包括至少两个多层陶瓷模块和在其中一个模块上制造的MEMS装置。 一旦完成了MEMS器件的制造，就将两个陶瓷模块结合在一起，密封MEMS器件，并允许所有器件层之间的电连接。 底部陶瓷模块在背面还具有用于安装集成电路的空腔。 内部层使用标准LTCC制造和低损耗介电LTCC带材料中可用的导电，电阻和高k电介质浆料形成。

公开(公告)号：US06787438B1

公开(公告)日：2004-09-07

申请号：US09981610

申请日：2001-10-16

Applicant: Richard D. Nelson

Inventor： Richard D. Nelson

IPC: H01L2120

CPC classification number: B81B3/0072 ,  B81B2201/016 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0858 ,  G02B26/0866 ,  H01H59/0009

Abstract: A microelectromechanical device is provided which includes a contact structure interposed between a pair of electrodes arranged beneath a beam. In some embodiments, the device may include additional contact structures interposed between the pair of electrodes. For example, the device may include at least three contact structures between the pair of electrodes. In some embodiments, the beam may be suspended above the pair of electrodes by a support structure affixed to a first end of the beam. Such a device may further include an additional support structure affixed to a second end of the beam. In some cases, the device may be adapted to pass a signal from the first end to the second end of the beam. In addition or alternatively, the device may be adapted to pass the signal between one or both ends of the beam and one or more of the contact structures.

Abstract translation: 提供了一种微电子机械装置，其包括插入在布置在梁下方的一对电极之间的接触结构。 在一些实施例中，该装置可以包括插入该对电极之间的附加接触结构。 例如，该装置可以包括在该对电极之间的至少三个接触结构。 在一些实施例中，梁可以通过固定到梁的第一端的支撑结构悬挂在一对电极之上。 这种装置还可以包括固定到梁的第二端的附加支撑结构。 在一些情况下，设备可以适于将信号从第一端传递到光束的第二端。 另外或替代地，该装置可以适于在横梁的一端或两端和一个或多个接触结构之间传递信号。

公开(公告)号：US20030148550A1

公开(公告)日：2003-08-07

申请号：US10014660

申请日：2001-11-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Richard P. Volant ,  John C. Bisson ,  Donna R. Cote ,  Timothy J. Dalton ,  Robert A. Groves ,  Kevin S. Petrarca ,  Kenneth J. Stein ,  Seshadri Subbanna

IPC: H01L021/00

CPC classification number: B81C1/00246 ,  B81B2201/016 ,  B81B2201/018 ,  B81B2203/0127 ,  B81B2207/07 ,  B81C1/00611 ,  B81C2201/0122 ,  B81C2203/0735 ,  H01G5/40 ,  H01H59/0009

Abstract: A method of fabricating micro-electromechanical switches (MEMS) integrated with conventional semiconductor interconnect levels, using compatible processes and materials is described. The method is based upon fabricating a capacitive switch that is easily modified to produce various configurations for contact switching and any number of metal-dielectric-metal switches. The process starts with a copper damascene interconnect layer, made of metal conductors inlaid in a dielectric. All or portions of the copper interconnects are recessed to a degree sufficient to provide a capacitive air gap when the switch is in the closed state, as well as provide space for a protective layer of, e.g., Ta/TaN. The metal structures defined within the area specified for the switch act as actuator electrodes to pull down the movable beam and provide one or more paths for the switched signal to traverse. The advantage of an air gap is that air is not subject to charge storage or trapping that can cause reliability and voltage drift problems. Instead of recessing the electrodes to provide a gap, one may just add dielectric on or around the electrode. The next layer is another dielectric layer which is deposited to the desired thickness of the gap formed between the lower electrodes and the moveable beam that forms the switching device. Vias are fabricated through this dielectric to provide connections between the metal interconnect layer and the next metal layer which will also contain the switchable beam. The via layer is then patterned and etched to provide a cavity area which contains the lower activation electrodes as well as the signal paths. The cavity is then back-filled with a sacrificial release material. This release material is then planarized with the top of the dielectric, thereby providing a planar surface upon which the beam layer is constructed.

Abstract translation: 描述了使用兼容工艺和材料制造与常规半导体互连级别集成的微机电开关（MEMS）的方法。 该方法基于制造容易修改以产生用于接触切换和任何数量的金属 - 介电金属开关的各种配置的电容开关。 该过程开始于铜镶嵌互连层，由金属导体嵌入电介质中。 铜互连的全部或部分凹陷到足以在开关处于闭合状态时提供电容气隙的程度，并为例如Ta / TaN的保护层提供空间。 在为开关指定的区域内限定的金属结构用作致动器电极以下拉可移动光束并且提供一个或多个路径用于开关信号横越。 气隙的优点是空气不会受到可能导致可靠性和电压漂移问题的电荷储存或捕集。 代替使电极凹陷以提供间隙，可以仅在电极上或周围添加电介质。 下一层是另一介质层，其被沉积到形成在下电极和形成开关器件的可移动梁之间的间隙的期望厚度上。 通过该电介质制造通孔以提供金属互连层和还包含可切换光束的下一个金属层之间的连接。 然后对通孔层进行图案化和蚀刻以提供包含下部激活电极以及信号路径的空腔区域。 然后用牺牲脱模材料填充空腔。 然后将该释放材料与电介质的顶部平坦化，由此提供构造波束层的平坦表面。

公开(公告)号：US20030042561A1

公开(公告)日：2003-03-06

申请号：US10230200

申请日：2002-08-29

Inventor： Hideyuki Funaki

IPC: H01L029/82

CPC classification number: H03H9/462 ,  B81B3/0021 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/051 ,  H01H13/80 ,  H01H59/0009 ,  H01H2001/0078 ,  H01H2201/008 ,  H03H3/0072

Abstract: A micromechanical switch comprises a substrate, at least one pair of support members fixed to the substrate, at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate, and a contact portion provided on the moving portion, and a driving electrode placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction parallel to the substrate with electrostatic force so that the contact portions of the beam members which are opposed to each other are short-circuited.

Abstract translation: 微机械开关包括基板，固定到基板的至少一对支撑构件，至少一对梁构件，其彼此靠近并平行放置在基板上方并分别连接到支撑构件之一 所述梁构件具有可相对于所述基板间隙移动的移动部分和设置在所述移动部分上的接触部分，以及设置在所述一对梁构件之间的所述基板上的驱动电极，以吸引所述移动部分的移动部分 梁构件在与静电力平行的方向上使得梁构件彼此相对的接触部分短路。

公开(公告)号：US06407482B2

公开(公告)日：2002-06-18

申请号：US09254030

申请日：1999-02-26

Applicant: Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara

Inventor： Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara

IPC: H01L4108

CPC classification number: H01H1/0036 ,  B81B7/0077 ,  B81B2201/016 ,  B81B2207/095 ,  B81C2203/0118 ,  H01H1/20 ,  H01H9/52 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/02 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2057/006 ,  H01H2061/006

Abstract: A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.

Abstract translation: 由单晶构成的薄板状基板21设置有压电元件24，并且其一个表面设置有可动触点25的可动件20的两端固定并支撑在基座11上。然后，通过弯曲 经由压电元件24的可动片20与可动触点对置的一对固定触点38,39接触而脱离接触。 通过这种布置，可以获得具有机械接触机构的小型微型继电器，其具有接通触点的小电阻和期望的振动阻抗，频率特性和绝缘性能。

公开(公告)号：US20180308645A1

公开(公告)日：2018-10-25

申请号：US15771026

申请日：2016-11-14

Applicant: CAVENDISH KINETICS, INC.

Inventor： Robertus Petrus VAN KAMPEN ,  James Douglas HUFFMAN ,  Mickael RENAULT ,  Shibajyoti Ghosh DASTIDER ,  Jacques Marcel MUYANGO

IPC: H01H1/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H01H1/0036 ,  B81B3/0021 ,  B81B2201/016 ,  B81C1/00142 ,  H01H2001/0084

Abstract: The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.

公开(公告)号：US20180033553A1

公开(公告)日：2018-02-01

申请号：US15548992

申请日：2016-01-28

Applicant: CAVENDISH KINETICS, INC.

Inventor： Robertus Petrus VAN KAMPEN ,  Roberto GADDI ,  Richard L. KNIPE

IPC: H01G4/005 ,  H01H1/00

CPC classification number: H01G4/005 ,  B81B2201/016 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0057 ,  H01H2001/0084

Abstract: The present disclosure generally relates to a MEMS DVC utilizing one or more MIM capacitors located in the anchor of the DVC and an Ohmic contact located on the RF-electrode. The MIM capacitor in combination with the ohmic MEMS device ensures that a stable capacitance for the MEMS DVC is achieved with applied RF power.

公开(公告)号：US20170301493A1

公开(公告)日：2017-10-19

申请号：US15458444

申请日：2017-03-14

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： Mark Bachman ,  Guann-Pyng Li ,  Yang Zhang ,  Minfeng Wang

IPC: H01H50/32 ,  H01H50/00 ,  H01H50/44 ,  H01H50/58

CPC classification number: H01H50/32 ,  B81B3/0054 ,  B81B2201/016 ,  H01H1/0036 ,  H01H50/005 ,  H01H50/44 ,  H01H50/58 ,  H01H2001/0042

Abstract: Micro-electromagnetically actuated latched miniature relay switches formed from laminate layers comprising a spring and magnet, electromagnetic coils, magnetic latching material, and transmission line with contacts. Preferably the miniature relay switches transmit up to about 50 W of DC or AC line power, and carry up to about 10 A of load current, with an overall volume of less than about 100 mm3. In addition to switching large power, the device preferably requires less than 3 V to actuate, and has a latching feature that retains the switch state after actuation without the need for external applied voltage or current.

公开(公告)号：US09593007B2

公开(公告)日：2017-03-14

申请号：US14519772

申请日：2014-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. Jahnes ,  Anthony K. Stamper

IPC: H04R31/00 ,  B81B3/00 ,  B81C1/00 ,  G06F17/50 ,  B81B7/00 ,  H01L41/113 ,  H01L41/09

CPC classification number: B81B3/001 ,  B81B3/0021 ,  B81B3/0059 ,  B81B3/0072 ,  B81B7/0006 ,  B81B7/008 ,  B81B2201/016 ,  B81B2203/0163 ,  B81C1/00015 ,  B81C1/0015 ,  B81C1/00476 ,  G06F17/5045 ,  H01L41/094 ,  H01L41/1134 ,  H01L41/1138 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49121

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. A wiring layer is formed on a substrate comprising actuator electrodes and a contact electrode. A MEMS beam is formed above the wiring layer and at least one spring is formed and attached to at least one end of the MEMS beam. At least one spring has a predetermined spring constant based on a coefficient of thermal expansion (CTE) mismatch between materials of the MEMS structure and the spring. Additionally, an array of mini-bumps is formed between the wiring layer and the MEMS beam. A size of a space between fixed actuator electrodes or dummy actuators is determined based on a lateral shift of the MEMS beam.

Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 在包括致动器电极和接触电极的基板上形成布线层。 在布线层上方形成有MEMS光束，并且形成至少一个弹簧并将其连接到MEMS光束的至少一端。 基于MEMS结构的材料与弹簧之间的热膨胀系数（CTE）失配，至少一个弹簧具有预定的弹簧常数。 此外，在布线层和MEMS光束之间形成微小凸起阵列。 基于MEMS梁的横向偏移来确定固定致动器电极或虚拟致动器之间的空间的大小。