公开(公告)号：US09616171B2

公开(公告)日：2017-04-11

申请号：US15015627

申请日：2016-02-04

Applicant: Cam Med LLC

Inventor： Yanzhe Qin ,  Zhifei Ge

IPC: A61M31/00 ,  A61M5/168 ,  A61M5/145 ,  F04B43/04 ,  A61M5/142 ,  B81C1/00 ,  A61M39/24 ,  F04B53/10 ,  F16K99/00

CPC classification number: A61M5/14248 ,  A61M5/14586 ,  A61M5/16881 ,  A61M39/24 ,  A61M2005/14252 ,  A61M2205/3334 ,  A61M2205/35 ,  A61M2205/581 ,  A61M2205/582 ,  A61M2207/00 ,  B32B37/12 ,  B32B2535/00 ,  B81B2201/036 ,  B81C1/00158 ,  B81C2201/034 ,  F04B43/043 ,  F04B53/10 ,  F16K2099/008 ,  F16K2099/0094

Abstract: A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.

公开(公告)号：US20160236929A1

公开(公告)日：2016-08-18

申请号：US15033069

申请日：2013-11-19

Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY

Inventor： Jung Chul Lee ,  Il Lee

IPC: B81C1/00 ,  B81B3/00 ,  G01D11/30 ,  B81C99/00

CPC classification number: B81C1/0015 ,  B29C35/0805 ,  B29C64/135 ,  B29C2035/0827 ,  B29K2071/02 ,  B29K2105/0061 ,  B29K2995/0027 ,  B29L2031/756 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B81B3/0021 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C99/0025 ,  B81C2201/0188 ,  B81C2201/034 ,  B81C2203/038 ,  G01D11/30 ,  G01Q70/14 ,  G01Q70/16

Abstract: Disclosed is a method for manufacturing a microcantilever having a predetermined thickness that includes forming a liquid synthetic resin for cantilevers to a thickness corresponding to the thickness of the microcantilever on an upper surface of a base block having an adhesive base and a non-adhesive base, and curing the liquid synthetic resin for cantilevers via a boundary between the adhesive base and the non-adhesive base, wherein the adhesive base has stronger adhesivity to the cured synthetic resin for cantilevers than the non-adhesive base.

Abstract translation: 公开了一种具有预定厚度的微悬臂梁的制造方法，其包括在具有粘合剂基底和非粘性基底的基座的上表面上形成用于悬臂的液体合成树脂至与微悬臂梁的厚度相对应的厚度， 并且通过粘合剂基部和非粘合剂基部之间的边界固化用于悬臂的液体合成树脂，其中粘合剂基底与用于悬臂的固化合成树脂的粘合性比非粘合剂基部具有更强的粘附性。

公开(公告)号：US09214590B2

公开(公告)日：2015-12-15

申请号：US13787134

申请日：2013-03-06

Applicant: The University of North Carolina at Chapel Hill

Inventor： Joseph M. DeSimone ,  Ginger Denison Rothrock ,  Zhilian Zhou ,  Edward T. Samulski ,  Meredith Earl ,  Stuart Williams

IPC: B29C37/00 ,  B29C39/36 ,  H01L31/18 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/00 ,  H01L31/0352 ,  H01L51/00 ,  H01L51/42 ,  B81C99/00 ,  B81C1/00

CPC classification number: H01L31/18 ,  B29C37/0003 ,  B29C39/36 ,  B81C1/00031 ,  B81C1/00214 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L31/0352 ,  H01L51/0004 ,  H01L51/0036 ,  H01L51/0047 ,  H01L51/422 ,  H01L51/4253 ,  Y02E10/549

Abstract: A photovoltaic device includes an electron accepting material and an electron donating material. One of the electron accepting or donating materials is configured and dimensioned as a first component of a bulk heterojunction with a predetermined array of first structures, each first structure is substantially equivalent in three dimensional shape, has a substantially equivalent cross-sectional dimension, and where each first structure of the array of first structures has a substantially equivalent orientation with respect to adjacent first structures of the predetermined array forming a substantially uniform array.

Abstract translation: 光电器件包括电子接收材料和给电子材料。 电子接受或捐赠材料之一被配置和定尺寸为具有预定阵列的第一结构的本体异质结的第一部件，每个第一结构基本上相当于三维形状，具有基本相当的横截面尺寸，并且其中 第一结构阵列的每个第一结构相对于预定阵列的相邻第一结构具有基本上等同的取向，形成基本均匀的阵列。

公开(公告)号：US09139914B2

公开(公告)日：2015-09-22

申请号：US14259628

申请日：2014-04-23

Applicant: Ajou University Industry-Academic Cooperation Foundation

Inventor： Chang-Koo Kim ,  Sung-Woon Cho

IPC: H01L21/00 ,  C23F1/12 ,  B22F1/00 ,  C23C18/16 ,  C23C18/18 ,  C23C18/40 ,  H01L21/288 ,  C23F4/00

CPC classification number: C23F1/12 ,  B22F1/0018 ,  B22F1/0044 ,  B22F9/02 ,  B22F2001/0037 ,  B22F2304/05 ,  B81C1/00492 ,  B81C2201/0187 ,  B81C2201/034 ,  C23C18/1605 ,  C23C18/1657 ,  C23C18/1893 ,  C23C18/405 ,  C23F4/00 ,  H01J2237/0203 ,  H01J2237/3341 ,  H01L21/288 ,  Y10T29/49982

Abstract: This invention relates to a method of fabricating a three-dimensional copper nanostructure, including manufacturing a specimen configured to include a SiO2 mask; performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen; performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal; removing an over-plated portion and the SiO2 mask from the metal layer; and removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer. In this invention, a uniform copper nanostructure array can be obtained by subjecting a large-area specimen disposed in a Faraday cage to multi-directional slanted plasma etching using high-density plasma, forming a copper film on the etched portion of the specimen, and removing an over-plated copper film and the SiO2 mask, and the diameter of the copper nanostructure can be arbitrarily adjusted, thus attaining high applicability.

Abstract translation: 本发明涉及一种制造三维铜纳米结构的方法，包括制造被配置为包括SiO 2掩模的试样; 执行多方向倾斜等离子体蚀刻以在样本上形成三维蚀刻结构层; 进行电镀，使得样品的多方向倾斜等离子体蚀刻部分被金属填充; 从金属层去除过镀层部分和SiO 2掩模; 除去除了作为三维蚀刻结构层的金属以外的试样的表面的一部分。 在本发明中，通过对设在法拉第笼中的大面积试样进行多层倾斜等离子体蚀刻，使用高密度等离子体，在试样的蚀刻部分上形成铜膜，可以得到均匀的铜纳米结构体， 去除过镀铜膜和SiO 2掩模，并且可以任意调整铜纳米结构的直径，从而获得高适用性。

公开(公告)号：US20140183044A1

公开(公告)日：2014-07-03

申请号：US14138514

申请日：2013-12-23

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Raphael RENAUDOT ,  Vincent AGACHE ,  Yves FOUILLET

IPC: C25D1/12

CPC classification number: C25D1/12 ,  B81C99/009 ,  B81C2201/034

Abstract: The invention relates to a method of forming a microfluidic array comprising at least one channel of semi-circular section, comprising the following steps: bringing into contact a first liquid (7) with an array of electrodes (3) of a microfluidic chip (1) comprising at least one pair of substantially parallel and coplanar electrodes (3a, 3b) arranged on a substrate (4), activating said array of electrodes so as to actuate by liquid dielectrophoresis LDEP said first liquid to form a fluidic structure (9) comprising at least one fluidic finger (9a), and using said fluidic structure as a mould to form said microfluidic array by solidification or hardening of a second liquid (11) deposited on the microfluidic chip and hugging the shape of said fluidic structure.

Abstract translation: 本发明涉及一种形成包括至少一个半圆形截面通道的微流体阵列的方法，包括以下步骤：使第一液体（7）与微流体芯片（1）的电极阵列（3）接触 ）包括布置在基板（4）上的至少一对基本上平行和共面的电极（3a，3b），激活所述电极阵列以便通过液体介电电泳LDEP所述第一液体致动以形成流体结构（9），所述流体结构（9）包括 至少一个流体指（9a），并且使用所述流体结构作为模具以通过凝固或固化沉积在所述微流体芯片上的第二液体（11）形成所述微流体阵列并且拥抱所述流体结构的形状。

公开(公告)号：US20140004291A1

公开(公告)日：2014-01-02

申请号：US14016651

申请日：2013-09-03

Applicant: Carnegie Mellon University, Center for Technology and Enterprise Creation

Inventor： Metin Sitti ,  Seok Kim

IPC: C09J7/02

CPC classification number: C09J7/00 ,  A44B18/0049 ,  B29C33/3842 ,  B29C33/424 ,  B29C33/52 ,  B29C39/34 ,  B29C39/36 ,  B29C39/42 ,  B29L2031/756 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/034 ,  C09J9/00 ,  C09J2201/626 ,  Y10T428/23957 ,  Y10T428/2933 ,  Y10T428/2935 ,  Y10T428/2976

Abstract: A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.

公开(公告)号：US08486348B2

公开(公告)日：2013-07-16

申请号：US12914675

申请日：2010-10-28

Applicant: Leon M. Bellan ,  Harold G. Craighead ,  Elizabeth A. Strychalski

Inventor： Leon M. Bellan ,  Harold G. Craighead ,  Elizabeth A. Strychalski

IPC: B29C67/20 ,  D06M10/00

CPC classification number: B81C1/00071 ,  B01L3/502707 ,  B01L3/502761 ,  B01L2300/0816 ,  B81B2201/0214 ,  B81B2201/051 ,  B81B2203/0338 ,  B81C2201/034

Abstract: A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.

Abstract translation: 通过在基底模具上形成牺牲纤维来制造器件。 纤维和模具被第一材料覆盖。 去除基底模具，然后除去覆盖的纤维以在第一材料中形成通道。

公开(公告)号：US08394224B2

公开(公告)日：2013-03-12

申请号：US12974404

申请日：2010-12-21

Applicant: Fahhad H. Alharbi ,  John D. Bass ,  Ho-Cheol Kim ,  Robert D. Miller

Inventor： Fahhad H. Alharbi ,  John D. Bass ,  Ho-Cheol Kim ,  Robert D. Miller

IPC: B32B27/00 ,  B29C33/52

CPC classification number: B32B27/00 ,  B81B2207/056 ,  B81C1/00357 ,  B81C2201/034

Abstract: Layered nanostructures are constructed by imprinting material with a mold, while selectively modifying and removing a portion of the mold. The mold, which includes a pattern of features, is modified so that the portion of the mold that includes the features is made chemically and/or physically distinct from the rest of the mold. That portion of the mold that includes the features is retained while the rest of the mold is removed. The retained portion of the mold provides mechanical support for any adjoining layer or layers.

Abstract translation: 层状纳米结构通过用模具压印材料构成，同时选择性地修改和去除模具的一部分。 包括特征图案的模具被改进，使得包括特征的模具部分在化学和/或物理上与模具的其余部分不同。 包括特征的模具的该部分在模具的其余部分被移除的同时被保留。 模具的保留部分为任何相邻的层提供机械支撑。

公开(公告)号：US20120328834A1

公开(公告)日：2012-12-27

申请号：US13360261

申请日：2012-01-27

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: B32B3/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US20120152448A1

公开(公告)日：2012-06-21

申请号：US12974404

申请日：2010-12-21

Applicant: FAHHAD H. ALHARBI ,  JOHN D. BASS ,  HO-CHEOL KIM ,  ROBERT D. MILLER

Inventor： FAHHAD H. ALHARBI ,  JOHN D. BASS ,  HO-CHEOL KIM ,  ROBERT D. MILLER

IPC: B32B37/24 ,  B82Y40/00

CPC classification number: B32B27/00 ,  B81B2207/056 ,  B81C1/00357 ,  B81C2201/034

Abstract: Layered nanostructures are constructed by imprinting material with a mold, while selectively modifying and removing a portion of the mold. The mold, which includes a pattern of features, is modified so that the portion of the mold that includes the features is made chemically and/or physically distinct from the rest of the mold. That portion of the mold that includes the features is retained while the rest of the mold is removed. The retained portion of the mold provides mechanical support for any adjoining layer or layers.

Abstract translation: 层状纳米结构通过用模具压印材料构成，同时选择性地修改和去除模具的一部分。 包括特征图案的模具被改进，使得包括特征的模具部分在化学和/或物理上与模具的其余部分不同。 包括特征的模具的该部分在模具的其余部分被移除的同时被保留。 模具的保留部分为任何相邻的层提供机械支撑。