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    Flexible circuit board assembly and method
    161.
    发明授权
    Flexible circuit board assembly and method 失效
    柔性电路板组装及方法

    公开(公告)号：US5434362A

    公开(公告)日：1995-07-18

    申请号：US300762

    申请日：1994-09-06

    Applicant: Tomasz L. Klosowiak ,  David W. Currier ,  Gary K. Mui

    Inventor： Tomasz L. Klosowiak ,  David W. Currier ,  Gary K. Mui

    IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K1/02

    CPC classification number: H05K5/003 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K3/0061

    Abstract: A flexible circuit board assembly (10) includes a flexible substrate (11) having first and second end portions (14,15) and an intermediate portion (16). Conductive metalization interconnect paths (17) extend between the substrate end portions (14, 15) and across the intermediate portion (16). The substrate first and second end portions are mounted to first and second end portions (21, 22) of a rigidizer plate (20). Stiffening material (35) is provided on the flexible substrate intermediate portion (16) to define stiff (36, 37, 38) and less stiff (39, 40) paths that extend across the interconnect paths (17) and the substrate intermediate portion (16) and define desired bend curvature characteristics for the flexible substrate intermediate portion (16). A method utilizes this structure to provide a flexible circuit board assembly (10), preferably with a bent rigidizer plate (20).

    Abstract translation: 柔性电路板组件（10）包括具有第一和第二端部（14,15）和中间部分（16）的柔性基板（11）。 导电金属化互连路径（17）在基板端部（14,15）之间延伸并跨越中间部分（16）。 衬底第一和第二端部安装到刚性化板（20）的第一和第二端部（21,22）上。 硬化材料（35）设置在柔性基板中间部分（16）上，以限定穿过互连路径（17）和基板中间部分（16）延伸的刚性（36,37,38）和较小刚性（39,40） 16）并且限定用于柔性基板中间部分（16）的所需弯曲曲率特性。 一种方法利用该结构来提供柔性电路板组件（10），优选地具有弯曲的刚性板（20）。

    Multilayer circuit board with integral flexible appendages
    162.
    发明授权
    Multilayer circuit board with integral flexible appendages 失效
    具有整体灵活附件的多层电路板

    公开(公告)号：US4037047A

    公开(公告)日：1977-07-19

    申请号：US537714

    申请日：1974-12-31

    Applicant: Glen J. Taylor

    Inventor： Glen J. Taylor

    IPC: H05K3/00 ,  H05K1/14 ,  H05K3/30

    CPC classification number: H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109

    Abstract: Method and structure for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned relationship between rigid layers equipped with suitable electrical connections. All of the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in preselected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. By keeping the rigid layers intact, the assemblage is maintained rigid during the plating procedure, thereby avoiding undesirable work hardening of the flexible portions even without tools for restraining the flexible portions. The selective bonding and preslotting permits the ready removal of the rigid material from certain portions of the assemblage to form the circuit board with integral flexible conductor appendages.

    Abstract translation: 用于制造具有整体柔性导线附件的多层印刷电路板的方法和结构，涉及利用配备有适当电连接的刚性层之间以适当对准的关系结合的柔性电路层的阵列。 所有的层都大大地大于完成的电路板将被选择性地结合并且在预先选定的位置开槽的尺寸，并且在贯穿用于互连的孔的钻孔过程中保持在这种超大尺寸的状态，并且通过导电 材料。 只有在电镀步骤完成之后，上，下刚性层的部分从附件部分上方和下方的位置移除，从而使它们达到所需的柔性状态。 通过保持刚性层的完整性，组装在电镀过程中保持刚性，从而避免了柔性部分的不期望的加工硬化，甚至没有用于限制柔性部分的工具。 选择性粘合和预拉伸允许从组合件的某些部分准备去除刚性材料以形成具有整体柔性导体附件的电路板。

    MULTILAYER FLEXIBLE FR4 CIRCUIT
    164.
    发明公开
    MULTILAYER FLEXIBLE FR4 CIRCUIT 审中-公开
    多层柔性的FR4电路

    公开(公告)号：EP1446990A4

    公开(公告)日：2007-07-11

    申请号：EP02786547

    申请日：2002-10-28

    Applicant: MOTOROLA INC

    Inventor： MOORE KEVIN S ,  GALL THOMAS P

    IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46

    CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/0366 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2203/302 ,  Y10T29/49135

    Abstract: A flexible circuit (100) includes a first circuit path portion (110) and a second rigid circuit path portion (140) to which electronic components (102) may be coupled. Each circuit path portion (110 and 140) including a resin layer (112 and 142) and an adjacent conductive layer (114 and 144). Each circuit path portion (110 and 140) defining a gap (120 and 150) substantially running along a line corresponding to a desired bend location. A central circuit path portion (130) is disposed between the first circuit path portion (110) and the second rigid circuit path portion (140) and includes a first conductive layer (134) in electrical communication with the first circuit path portion (110) and a second conductive layer (136) in electrical communication with the second rigid circuit path portion (140), so as to provide electrical communication across the gaps (120 and 150). A metal plate (160) is disposed adjacent the second rigid circuit path portion (140).

    Ceramic circuit sustrate and manufacturing method thereof
    165.
    发明公开
    Ceramic circuit sustrate and manufacturing method thereof 有权
    Keramiksubstrat和seine Herstellung

    公开(公告)号：EP1699080A1

    公开(公告)日：2006-09-06

    申请号：EP06110654.8

    申请日：2006-03-03

    Applicant: Dowa Mining Co., Ltd.

    Inventor： Itahana, Yoshiharu ,  Nakamura, Junji ,  Sawabe, Akio

    IPC: H01L23/373 ,  H05K3/38

    CPC classification number: H01L23/3735 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0545 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

    Abstract: A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability to prevent etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material 8 and 9 formed on the ceramic substrate, a circuit pattern section jointed onto the pattern of brazing material; wherein the pattern of brazing material includes a line pattern along the edge of the circuit pattern, and a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

    Abstract translation: 提供一种陶瓷电路基板及其制造方法，其通过在电路图案部和陶瓷基板之间形成间隙而具有优异的耐热冲击性，并且具有防止蚀刻残渣残留的能力。 根据本发明的陶瓷电路基板包括形成在陶瓷基板上的钎焊材料8和9的图案，连接到钎焊材料图案上的电路图形部分; 其中钎焊材料的图案包括沿电路图案的边缘的线图案，并且在位于陶瓷基板和电路图案之间的线图案内形成间隙。

    Electronic control module
    168.
    发明公开
    Electronic control module 失效
    电子控制模块

    公开(公告)号：EP0827372A3

    公开(公告)日：1998-05-06

    申请号：EP97113468.9

    申请日：1997-08-05

    Applicant: MOTOROLA, INC.

    Inventor： LI, Ronald ,  McKernan, Amy

    IPC: H05K5/00 ,  H05K3/00

    CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2201/10189

    Abstract: An electronic control module (40) includes a base plate (12) bent about first and second major bend axis (27, 28). The base plate includes first and second grooves (29, 30) formed at an upper surface (15a) coextensive with the first and second major bend axis (27, 28). A flexible film (18) is asymmetrically bonded by adhesive films (31, 32) about the first and second major bend axis (27, 28). The asymmetrical bonding of the flexible film (18) about the major bend axis (27, 28) causes non-bonded loop portions (35) of the flexible film (18) to assume a serpentine pattern and deflect away from the major bend axis (27, 28) when the base plate (12) is bent about the major bend axis (27, 28). The bonding arrangement of the flexible film (18) to the base plate (12) permits an electrical connector (36) to be attached to the backside of the electronic control module (40).

    Abstract translation: 电子控制模块（40）包括围绕第一和第二主弯曲轴线（27,28）弯曲的基板（12）。 底板包括形成在与第一和第二主弯曲轴线（27,28）共同延伸的上表面（15a）处的第一和第二凹槽（29,30）。 柔性膜（18）通过围绕第一和第二主弯曲轴线（27,28）的粘合膜（31,32）不对称地粘合。 柔性膜（18）围绕主弯曲轴线（27,28）的不对称结合导致柔性膜（18）的非接合环部分（35）呈现蛇形图案并偏离主弯曲轴线（ 当所述基板（12）围绕所述主弯曲轴线（27,28）弯曲时，所述基板（12,27,28） 柔性膜（18）与基板（12）的结合布置允许电连接器（36）附接到电子控制模块（40）的背侧。

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