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公开(公告)号：JP5090101B2
公开(公告)日：2012-12-05
申请号：JP2007210016
申请日：2007-08-10
Applicant: 株式会社大和化成研究所
IPC: C23C22/53
CPC classification number: C23C2222/10
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公开(公告)号：JP2012172190A
公开(公告)日：2012-09-10
申请号：JP2011034739
申请日：2011-02-21
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： SOGAWA AKIHIRO , NISHIMOTO YOSHIHIRO , YOSHIMOTO MASAKAZU
IPC: C23C26/00
Abstract: PROBLEM TO BE SOLVED: To provide a water-based sealing agent solution which does not contain organic solvents causing environmental pollution, is capable of carrying out a treatment without energization so as to respond to the treatment of a recent device with a small size and a high density, and is capable of carrying out the sealing treatment selectively and quantitatively to parts to be treated; and to provide a sealing method using the same.SOLUTION: The sealing agent solution for plating materials of noble metals or noble metal alloys includes: a nitrogen-containing five-membered cyclic compound having a mercapto group and not containing a benzene ring, as a first component; a linear alkane thiol having a carbon number of 10 or more and 20 or less, as a second component; and a nonionic surfactant, as a third component.
Abstract translation: 要解决的问题：为了提供不含有引起环境污染的有机溶剂的水性密封剂溶液，能够在不通电的情况下进行处理，以便对具有小的 尺寸和高密度，并且能够对待处理的部件选择性和定量地进行密封处理; 并提供使用该密封方法的密封方法。 解决方案：贵金属或贵金属合金电镀材料的密封剂溶液包括：具有巯基并且不含苯环的含氮五元环化合物作为第一组分; 碳数为10以上且20以下的直链烷烃硫醇作为第二成分; 和非离子表面活性剂，作为第三组分。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP4738607B2
公开(公告)日：2011-08-03
申请号：JP2001023553
申请日：2001-01-31
Applicant: 株式会社大和化成研究所
CPC classification number: Y02E60/12
Abstract: PROBLEM TO BE SOLVED: To obtain a new molten salt by regarding DNA as a high- concentration nucleic acid base assembly and converting the DNA into an onium salt. SOLUTION: This molten salt is obtainable by converting the DNA or a nucleic acid base by reacting with a certain kind of organic acid or an alkylating agent or the like into an onium salt. The molten salt has excellent performances as an electrolyte to the served for an ionics material.
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Patent Agency Ranking
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17.发明专利Bath for tin or tin-alloy plating, and barrel-plating process using the plating bath 有权用于镀锡或锡合金镀层的浴槽，以及使用镀锌浴的棒材工艺
公开(公告)号：JP2010265491A
公开(公告)日：2010-11-25
申请号：JP2009115600
申请日：2009-05-12
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
Inventor： NISHIKAWA TETSUJI , TSUJI SEIKI , SASAYAMA HIROAKI , YOSHIMOTO MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To provide a plating bath which can enhance the uniformity and the like of a plated film in a wide range of current density, impart an adequate appearance and soldering characteristics to the plated film, and prevent the aggregation among electroconductive media and among articles to be plated, in a barrel-plating process. SOLUTION: A bath for tin or tin-alloy plating includes: (A) a soluble salt formed of either a stannous salt or a mixture of the stannous salt and a salt of a metal selected from the group consisting of silver, copper, bismuth, indium, zinc, antimony, nickel and lead; (B) an acid or a salt thereof; and (C) a dibenzazole disulfide sulfonate compound specifically such as dibenzothiazolyl disulphide disodium disulfonate. Because of including the compound (C), the plating bath can enhance the uniformity and smoothness of the film in the wide range of the current density, impart the superior appearance and soldering characteristics to the film, and prevent the aggregation among the electroconductive media, when having applied to a barrel-plating process. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了提供能够在宽的电流密度范围内提高电镀膜的均匀性等的镀液，赋予镀膜足够的外观和焊接特性，并且防止电镀膜之间的聚集 导电介质和要镀覆的物品之间的电镀工艺。 解决方案：用于锡或锡合金镀层的浴包括：（A）由亚锡盐或亚锡盐和选自银，铜的金属盐的混合物形成的可溶性盐 ，铋，铟，锌，锑，镍和铅; （B）酸或其盐; 和（C）二苯并唑二硫化物磺酸盐化合物，特别是二苯并噻唑基二硫化二磺酸二钠二钠。 由于含有化合物（C），电镀液可以在电流密度的宽范围内提高膜的均匀性和平滑性，赋予膜优异的外观和焊接特性，并且防止导电介质之间的聚集， 当应用于滚镀工艺时。 版权所有（C）2011，JPO＆INPIT
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18.发明专利
公开(公告)号：JP2009185358A
公开(公告)日：2009-08-20
申请号：JP2008028078
申请日：2008-02-07
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
Inventor： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To impart satisfactory film appearance stably with lapse of time to a grain refining agent of a film crystal to be added to a tin or tin alloy plating bath. SOLUTION: The tin or tin alloy plating bath includes (A) a stannous salt or a soluble salt comprised of a mixture composed of the stannous salt and a salt of a metal (for example, silver, copper, bismuth, etc.) selected from the groups VIII, IB, IIB, IIIA, IVA, VA from the fourth to the sixth period, (B) an acid or its salt, (C) a specific 2-mercaptobenzoazole derivative bonded with 3-6C alkylene with a mercapto group on the position 2 of benzoazole ring. Oxidation or cleavage is made to hardly arise by bonding of the 3-6C alkylene, and therefore, even if plating work progresses, the grain refining function lasts without declining, and the satisfactory film appearance can be of obtained stably with lapse of time. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了将待加入到锡或锡合金电镀液的膜晶体的晶粒细化剂经时地赋予令人满意的膜外观。 锡或锡合金电镀浴包括（A）由亚锡盐和金属盐（例如银，铜，铋等）组成的混合物的亚锡盐或可溶性盐 ）选自第四至第六期的VIII，IB，IIB，IIIA，IVA，VA族，（B）酸或其盐，（C）与3-6C亚烷基键合的特异性2-巯基苯并恶唑衍生物与 巯基在苯扎环2位上。 通过3-6C亚烷基的键合几乎不发生氧化或裂解，因此即使电镀工作进行，晶粒细化功能也不会下降，可以随时间稳定地获得令人满意的膜外观。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2007197791A
公开(公告)日：2007-08-09
申请号：JP2006018933
申请日：2006-01-27
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , OBATA KEIGO
CPC classification number: C23C22/58
Abstract: PROBLEM TO BE SOLVED: To develop and provide a post-treatment agent for plating, which improves fusion-joining resistance more effectively than sodium phosphate treatment solution.
SOLUTION: A composition of the post-treatment agent for plating to improve fusion-joining resistance is a solution which includes one or more selected from among compounds having amino nitrogen having at least two methylene groups coupled with a phosphonic acid group; and has a pH adjusted to an acidic region of 7 or lower. The solution also includes one or more compounds selected from among: a heterocyclic nitrogen-containing compound or a salt thereof; an aliphatic amine or an aromatic amine; and a C6-C24 straight-chain or branched-chain aliphatic carboxylic acid, or a salt of the carboxylic acid and the above amine. The composition can extremely effectively improve the fusion joinability of a plating film surface of tin or a tin alloy.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：开发并提供电镀后处理剂，其比磷酸钠处理溶液更有效地提高熔接接合电阻。 解决方案：用于电镀以提高熔接接合电阻的后处理剂的组合物是包含选自具有至少两个亚甲基与膦酸基团连接的氨基氮的化合物中的一种或多种的溶液; 并且将pH调节至7以下的酸性区域。 该溶液还包括一种或多种选自以下的化合物：杂环含氮化合物或其盐; 脂族胺或芳族胺; 和C 6 -C 24直链或支链脂族羧酸，或羧酸和上述胺的盐。 该组合物可以极大地提高锡或锡合金的镀膜表面的熔融连接性。 版权所有（C）2007，JPO＆INPIT
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