公开(公告)号：US20050049352A1

公开(公告)日：2005-03-03

申请号：US10737943

申请日：2003-12-16

Applicant: Slawomir Rubinsztajn ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar ,  Ryan Mills

Inventor： Slawomir Rubinsztajn ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar ,  Ryan Mills

IPC: C08K9/06 ,  C08L63/00 ,  C09C1/30 ,  H01L21/56 ,  H01L23/29 ,  C08K3/34

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

Abstract translation: 提供了用作底部填充材料的溶剂改性树脂组合物。 所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。 溶剂改性树脂组合物可用于制备透明的B阶树脂膜。 本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

公开(公告)号：US08048819B2

公开(公告)日：2011-11-01

申请号：US11167847

申请日：2005-06-23

Applicant: Slawomir Rubinsztajn ,  John Robert Campbell ,  Ryan Christopher Mills ,  Sandeep Shrikant Tonapi ,  Ananth Prabhakumar

Inventor： Slawomir Rubinsztajn ,  John Robert Campbell ,  Ryan Christopher Mills ,  Sandeep Shrikant Tonapi ,  Ananth Prabhakumar

IPC: B01J21/00 ,  B01J23/00 ,  B01J25/00 ,  B01J29/00 ,  B01J31/00 ,  B01J21/02 ,  B01J21/04 ,  B01J23/02

CPC classification number: H01L23/293 ,  B01J31/0237 ,  B01J31/0244 ,  B01J31/146 ,  C08G59/68 ,  C08G59/70 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract translation: 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可包括固化催化剂。 电子设备可以包括可固化组合物。 还提供与前述相关的方法。

公开(公告)号：US20060065387A1

公开(公告)日：2006-03-30

申请号：US10950554

申请日：2004-09-28

Applicant: Sandeep Tonapi ,  Arun Gowda ,  Kevin Durocher ,  David Esler ,  Hong Zhong ,  Ananth Prabhakumar

Inventor： Sandeep Tonapi ,  Arun Gowda ,  Kevin Durocher ,  David Esler ,  Hong Zhong ,  Ananth Prabhakumar

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L21/4878 ,  H01L21/563 ,  H01L23/367 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic assembly having at least a heat dissipating unit and a heat generating unit is provided. At least one of the heat dissipating unit and the heat generating unit has at least one deliberately modified surface.

Abstract translation: 提供具有至少散热单元和发热单元的电子组件。 散热单元和发热单元中的至少一个具有至少一个故意改变的表面。

公开(公告)号：US20050266263A1

公开(公告)日：2005-12-01

申请号：US11155990

申请日：2005-06-17

Applicant: John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

Inventor： John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

IPC: B32B15/00

CPC classification number: H01L23/293 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/22 ,  C08G59/3218 ,  C08G59/68 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  C09C3/12 ,  C09J163/00 ,  H01L24/81 ,  H01L2224/274 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12812 ,  H01L2924/00

Abstract: A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.

Abstract translation: 提供细碎的耐火固体和相关方法。 该固体可具有大于约5平方米/克的表面积。 固体可以具有每平方毫米表面积的活性表面终止位置的密度足够低，使得包含小于约99重量％的固体的可固化树脂的可固化组合物在a以后的稳定比小于约3 期间约两周。 此外，提供了包含固化层的固化性组合物，固化层和电子器件。

公开(公告)号：US20050131106A1

公开(公告)日：2005-06-16

申请号：US10736946

申请日：2003-12-16

Applicant: Sandeep Shrikant Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Slawomir Rubinsztajn

Inventor： Sandeep Shrikant Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Slawomir Rubinsztajn

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  C08K9/00 ,  C08K3/34

CPC classification number: H01L21/563 ,  C08L63/00 ,  C08L2205/02 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L2666/22 ,  C08L83/00 ,  H01L2924/00

Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract translation: 提供了用作底部填充材料的组合物。 底部填充材料包括第一可固化透明树脂组合物和第二可固化助熔树脂组合物。 第一可固化树脂组合物包括至少一种与溶剂组合的芳族环氧树脂，官能化胶体二氧化硅分散体和至少一种选自脂环族环氧单体，脂族环氧单体，羟基芳族化合物和组合的其它组分，以及 混合物，从而形成溶剂改性树脂。 第二可固化助熔组合物包含至少一种环氧树脂。 两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

公开(公告)号：US20050129956A1

公开(公告)日：2005-06-16

申请号：US10737453

申请日：2003-12-16

Applicant: Slawomir Rubinsztajn ,  John Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

Inventor： Slawomir Rubinsztajn ,  John Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

IPC: C08G59/42 ,  C08G77/14 ,  C08G77/38 ,  B32B27/38 ,  C08L63/00 ,  C08L83/00

CPC classification number: C08G59/423 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31663

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract translation: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。

公开(公告)号：US20050049334A1

公开(公告)日：2005-03-03

申请号：US10654378

申请日：2003-09-03

Applicant: Slawomir Rubinsztain ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar

Inventor： Slawomir Rubinsztain ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar

IPC: C08K9/06 ,  C08L63/00 ,  C09C1/30 ,  H01L21/56 ,  H01L23/29

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A solvent modified resin underfill material comprising a resin in combination with a filler of functionalized colloidal silica and solvent to form a transparent B-stage resin composition, which may then be cured to form a low CTE, high Tg thermoset resin. Embodiments of the disclosure include use as a wafer level filler, and an encapsulant for electronic chips.

Abstract translation: 一种溶剂改性树脂底部填充材料，其包括与官能化胶体二氧化硅和溶剂的填料结合的树脂，以形成透明的B阶树脂组合物，然后可将其固化以形成低CTE，高Tg热固性树脂。 本公开的实施例包括用作晶片级填充物，以及用于电子芯片的密封剂。

公开(公告)号：US20050048700A1

公开(公告)日：2005-03-03

申请号：US10653371

申请日：2003-09-02

Applicant: Slawomir Rubinsztajn ,  Sandeep Tonapi ,  John Campbell ,  Ananth Prabhakumar

Inventor： Slawomir Rubinsztajn ,  Sandeep Tonapi ,  John Campbell ,  Ananth Prabhakumar

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  B32B27/38

CPC classification number: C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01066 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T428/31511 ,  H01L2924/00

Abstract: A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract translation: 一种包含环氧树脂与环氧固化剂和任选的试剂的组合物和具有约1nm至约250nm粒度范围的官能化胶体二氧化硅的填料的无流动底部填充组合物。 胶体二氧化硅用至少一种有机烷氧基硅烷官能化剂官能化，随后用至少一种封端剂官能化。 环氧固化剂包括酸酐固化剂。 任选的试剂包括固化催化剂和含羟基的单体。 粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。