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公开(公告)号：US07279223B2
公开(公告)日：2007-10-09
申请号：US10737453
申请日：2003-12-16
Applicant: Slawomir Rubinsztajn , John Robert Campbell , Ananth Prabhakumar , Sandeep Tonapi
Inventor： Slawomir Rubinsztajn , John Robert Campbell , Ananth Prabhakumar , Sandeep Tonapi
CPC classification number: C08G59/423 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663
Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
Abstract translation: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。
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2.发明申请Thin bond-line silicone adhesive composition and method for preparing the same 审中-公开薄粘合线硅胶组合物及其制备方法公开(公告)号：US20050049350A1
公开(公告)日：2005-03-03
申请号：US10647680
申请日：2003-08-25
Applicant: Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
Inventor： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
IPC: C08L83/04 , C09J183/04 , H01L23/373 , H01L23/42 , C08K3/00
CPC classification number: C09J183/04 , C08G77/045 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K2201/005 , C08L83/04 , H01L23/3737 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/12044 , H01L2924/3011 , C08L83/00 , H01L2924/00
Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Abstract translation: 热界面组合物含有直径与聚合物基质共混的直径小于25微米的最大粒径的填料颗粒。 这种组合物使得可获得的可获得的粘合线厚度降低，这降低了存在于热界面材料和相应配合表面之间的原位热阻。
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公开(公告)号：US20060192280A1
公开(公告)日：2006-08-31
申请号：US11068376
申请日：2005-02-28
Applicant: David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
Inventor： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
CPC classification number: H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/00
Abstract: A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
Abstract translation: 描述了形成聚合物增强焊料凸起的装置或基底的方法。 该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构， 所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。 聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。
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公开(公告)号：US20050170188A1
公开(公告)日：2005-08-04
申请号：US11096160
申请日：2005-04-01
Applicant: John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
Inventor： John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
IPC: B32B27/38
CPC classification number: C08G59/3218 , C08G59/24 , C08G59/4215 , C08G59/68 , C08K3/36 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , Y10T428/31511 , C08L63/00 , H01L2924/00
Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
Abstract translation: 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。
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公开(公告)号：US07022410B2
公开(公告)日：2006-04-04
申请号：US10736946
申请日：2003-12-16
Applicant: Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
Inventor： Sandeep Shrikant Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Slawomir Rubinsztajn
CPC classification number: H01L21/563 , C08L63/00 , C08L2205/02 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31515 , C08L2666/22 , C08L83/00 , H01L2924/00
Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
Abstract translation: 提供了用作底部填充材料的组合物。 底部填充材料包括第一可固化透明树脂组合物和第二可固化助熔树脂组合物。 第一可固化树脂组合物包括至少一种与溶剂组合的芳族环氧树脂，官能化胶体二氧化硅分散体和至少一种选自脂环族环氧单体，脂族环氧单体，羟基芳族化合物和组合的其它组分，以及 混合物，从而形成溶剂改性树脂。 第二可固化助熔组合物包含至少一种环氧树脂。 两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。
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Patent Agency Ranking
公开(公告)号：US20050181214A1
公开(公告)日：2005-08-18
申请号：US11006265
申请日：2004-12-07
Applicant: John Robert Campbell , Slawomir Rubinsztajn , Florian Johannes Schattenmann , Sandeep Shrikant Tonapi , Ananth Prabhakumar , Wing-Keung Woo , Joseph Michael Anostario , Donna Marie Sherman
Inventor： John Robert Campbell , Slawomir Rubinsztajn , Florian Johannes Schattenmann , Sandeep Shrikant Tonapi , Ananth Prabhakumar , Wing-Keung Woo , Joseph Michael Anostario , Donna Marie Sherman
IPC: C01B33/149 , C08L63/00 , H01L21/56 , H01L23/29 , B32B27/38
CPC classification number: H01L23/295 , C01B33/149 , C08L63/00 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01019 , H01L2924/0102 , H01L2924/01055 , H01L2924/01066 , H01L2924/01067 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , Y10T428/31511 , C08L2666/28 , C08L2666/54 , H01L2924/00
Abstract: A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.
Abstract translation: 可固化环氧树脂制剂包含环氧单体，环氧低聚物或其组合; 有机官能胶体二氧化硅; 固化催化剂; 和任选试剂。 本发明的其它实施方案包括制备可固化环氧树脂制剂的方法和包含可固化环氧树脂制剂的半导体封装。 固化制剂的实施方案可以具有低的热膨胀系数和/或高的玻璃化转变温度。
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7.发明申请Nano-filled composite materials with exceptionally high glass transition temperature 审中-公开具有极高玻璃化转变温度的纳米填充复合材料公开(公告)号：US20050048291A1
公开(公告)日：2005-03-03
申请号：US10641425
申请日：2003-08-14
Applicant: Wing Woo , Slawomir Rubinsztajn , John Campbell , Florian Schattenmann , Sandeep Tonapi , Ananth Prabhakumar
Inventor： Wing Woo , Slawomir Rubinsztajn , John Campbell , Florian Schattenmann , Sandeep Tonapi , Ananth Prabhakumar
CPC classification number: B82Y30/00 , C01P2004/64 , C08K9/04 , C09C1/3081 , H01L23/293 , H01L23/295 , H01L2224/16227 , H01L2224/73104 , H01L2224/73204 , H01L2224/92125 , H01L2224/94 , Y10T428/31511 , C08L63/00 , H01L2224/11 , H01L2224/27
Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
Abstract translation: 在本发明中提供可固化的环氧树脂制剂。 该制剂包含环氧单体，粒度在约2纳米至约20纳米之间的有机官能化胶体二氧化硅，以及任选的试剂，其中有机官能化胶体二氧化硅基本上增加了环氧树脂制剂的玻璃化转变温度。 本发明的其它实施方案包括包含上述可固化环氧树脂制剂的半导体封装。
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公开(公告)号：US20060293172A1
公开(公告)日：2006-12-28
申请号：US11167847
申请日：2005-06-23
Applicant: Slawomir Rubinsztajn , John Campbell , Ryan Mills , Sandeep Tonapi , Ananth Prabhakumar
Inventor： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Sandeep Tonapi , Ananth Prabhakumar
IPC: B01J31/00
CPC classification number: H01L23/293 , B01J31/0237 , B01J31/0244 , B01J31/146 , C08G59/68 , C08G59/70 , H01L21/563 , H01L24/81 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
Abstract translation: 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可包括固化催化剂。 电子设备可以包括可固化组合物。 还提供与前述相关的方法。
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公开(公告)号：US20060147719A1
公开(公告)日：2006-07-06
申请号：US11368146
申请日：2006-03-03
Applicant: Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
Inventor： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
CPC classification number: C08K3/22 , Y10T428/2995 , Y10T428/31511
Abstract: A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
Abstract translation: 提供可固化组合物及其相关方法。 可固化组合物可以包括可固化树脂和细碎的耐火固体。 固体可以具有大于约5平方米/克的表面积，并且确定每平方毫米表面积的活性表面终止位点的密度。
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公开(公告)号：US20050148721A1
公开(公告)日：2005-07-07
申请号：US11062040
申请日：2005-02-18
Applicant: Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
Inventor： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
IPC: C08L83/04 , C09J183/04 , H01L23/373 , H01L23/42 , C08K3/34
CPC classification number: C09J183/04 , C08G77/045 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K2201/005 , C08L83/04 , H01L23/3737 , H01L23/42 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/12044 , H01L2924/3011 , C08L83/00 , H01L2924/00
Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
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