公开(公告)号：US20080019097A1

公开(公告)日：2008-01-24

申请号：US11782049

申请日：2007-07-24

Applicant: Jian Zhang ,  Sandeep Tonapi ,  Arun Gowda ,  Ryan Mills

Inventor： Jian Zhang ,  Sandeep Tonapi ,  Arun Gowda ,  Ryan Mills

IPC: H05K7/20

CPC classification number: F28F13/00 ,  F28F2013/005 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.

Abstract translation: 提供热管理系统。 该系统可以包括位于散热单元和发热单元之间的发热单元，散热单元和热传输结构。 热传输结构具有与发热单元热连通的第一表面和与散热单元热连通的第二表面。 热传输结构包括长度与宽度比大于1的导热材料，并且长度方向定向地促进沿热交换结构第一表面或第二表面中的至少一个的大致垂直方向的热传导。 热传递层包括在相对非导热的基质内限定不连续阵列的多个独立的导热条或通道。

公开(公告)号：US07279223B2

公开(公告)日：2007-10-09

申请号：US10737453

申请日：2003-12-16

Applicant: Slawomir Rubinsztajn ,  John Robert Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

Inventor： Slawomir Rubinsztajn ,  John Robert Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

IPC: B32B27/38 ,  B32B27/18 ,  C08L63/00 ,  C08L83/00 ,  H01L21/56

CPC classification number: C08G59/423 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31663

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract translation: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。

公开(公告)号：US20050049350A1

公开(公告)日：2005-03-03

申请号：US10647680

申请日：2003-08-25

Applicant: Sandeep Tonapi ,  Hong Zhong ,  Florian Schattenmann ,  Jennifer David ,  Kimberly Saville ,  Arun Gowda ,  David Esler ,  Ananth Prabhakumar

Inventor： Sandeep Tonapi ,  Hong Zhong ,  Florian Schattenmann ,  Jennifer David ,  Kimberly Saville ,  Arun Gowda ,  David Esler ,  Ananth Prabhakumar

IPC: C08L83/04 ,  C09J183/04 ,  H01L23/373 ,  H01L23/42 ,  C08K3/00

CPC classification number: C09J183/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K2201/005 ,  C08L83/04 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/12044 ,  H01L2924/3011 ,  C08L83/00 ,  H01L2924/00

Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

Abstract translation: 热界面组合物含有直径与聚合物基质共混的直径小于25微米的最大粒径的填料颗粒。 这种组合物使得可获得的可获得的粘合线厚度降低，这降低了存在于热界面材料和相应配合表面之间的原位热阻。

公开(公告)号：US20070284758A1

公开(公告)日：2007-12-13

申请号：US11438657

申请日：2006-05-22

Applicant: Jian Zhang ,  Davide Simone ,  Christopher Carter ,  Laura Meyer ,  Charles Becker ,  Florian Schattenmann ,  Sandeep Tonapi ,  Slawomir Rubinsztajn ,  Christopher Keimel

Inventor： Jian Zhang ,  Davide Simone ,  Christopher Carter ,  Laura Meyer ,  Charles Becker ,  Florian Schattenmann ,  Sandeep Tonapi ,  Slawomir Rubinsztajn ,  Christopher Keimel

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.

Abstract translation: 提供电子封装。 电子封装可以包括具有限定开口的表面的底部填充层。 电子封装可以包括设置在开口内的聚合物凸块结构。 提供了用作底部填充层的层压体。 提供相关方法。

公开(公告)号：US20060275952A1

公开(公告)日：2006-12-07

申请号：US11146838

申请日：2005-06-07

Applicant: Arun Gowda ,  Sandeep Tonapi ,  Ryan Mills ,  David Esler ,  Stephen Latham ,  John Campbell

Inventor： Arun Gowda ,  Sandeep Tonapi ,  Ryan Mills ,  David Esler ,  Stephen Latham ,  John Campbell

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L21/4871 ,  H01L23/3737 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.

Abstract translation: 公开了用于形成电子装置的方法，该电子装置包括同时用作底部填充材料的材料以及热界面材料。 此处还给出了包括散热元件，半导体芯片，基板和导热材料的电子组件，其中导热材料同时用作底部填充材料以及热界面材料。

公开(公告)号：US20060275608A1

公开(公告)日：2006-12-07

申请号：US11147061

申请日：2005-06-07

Applicant: Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Jian Zhang ,  Stephen Latham

Inventor： Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Jian Zhang ,  Stephen Latham

IPC: B32B27/38 ,  C08L63/00 ,  H01L21/00

CPC classification number: H01L23/3737 ,  C09J7/10 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31511 ,  H01L2924/00

Abstract: A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.

Abstract translation: 提供了包括热界面材料的可B阶段的膜。 该膜可以将发热装置固定到散热部件，可以进一步交联，并且可以将热能从发热装置传导到散热部件。 提供了制造和使用该膜的方法，以及包含该膜的装置。

公开(公告)号：US20060192280A1

公开(公告)日：2006-08-31

申请号：US11068376

申请日：2005-02-28

Applicant: David Esler ,  Donald Buckley ,  Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Arun Gowda

Inventor： David Esler ,  Donald Buckley ,  Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Arun Gowda

IPC: H01L23/48 ,  H01L21/58

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).

Abstract translation: 描述了形成聚合物增强焊料凸起的装置或基底的方法。 该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构， 所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。 聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。

公开(公告)号：US20050170188A1

公开(公告)日：2005-08-04

申请号：US11096160

申请日：2005-04-01

Applicant: John Campbell ,  Slawomir Rubinsztajn ,  David Gibson ,  Sandeep Tonapi ,  Ryan Mills ,  Ananth Prabhakumar

Inventor： John Campbell ,  Slawomir Rubinsztajn ,  David Gibson ,  Sandeep Tonapi ,  Ryan Mills ,  Ananth Prabhakumar

IPC: B32B27/38

CPC classification number: C08G59/3218 ,  C08G59/24 ,  C08G59/4215 ,  C08G59/68 ,  C08K3/36 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00

Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract translation: 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

公开(公告)号：US20050048291A1

公开(公告)日：2005-03-03

申请号：US10641425

申请日：2003-08-14

Applicant: Wing Woo ,  Slawomir Rubinsztajn ,  John Campbell ,  Florian Schattenmann ,  Sandeep Tonapi ,  Ananth Prabhakumar

Inventor： Wing Woo ,  Slawomir Rubinsztajn ,  John Campbell ,  Florian Schattenmann ,  Sandeep Tonapi ,  Ananth Prabhakumar

IPC: C08K9/04 ,  C09C1/30 ,  H01L23/29 ,  B32B27/38 ,  C08L63/00 ,  H01L21/56

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/04 ,  C09C1/3081 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2224/11 ,  H01L2224/27

Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.

Abstract translation: 在本发明中提供可固化的环氧树脂制剂。 该制剂包含环氧单体，粒度在约2纳米至约20纳米之间的有机官能化胶体二氧化硅，以及任选的试剂，其中有机官能化胶体二氧化硅基本上增加了环氧树脂制剂的玻璃化转变温度。 本发明的其它实施方案包括包含上述可固化环氧树脂制剂的半导体封装。

公开(公告)号：US20050045855A1

公开(公告)日：2005-03-03

申请号：US10654391

申请日：2003-09-03

Applicant: Sandeep Tonapi ,  Hong Zhong ,  Davide Simone ,  Raymond Fillion

Inventor： Sandeep Tonapi ,  Hong Zhong ,  Davide Simone ,  Raymond Fillion

IPC: C09K5/14 ,  H01L23/373 ,  H01B1/00

CPC classification number: H01L24/29 ,  C09K5/14 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3737 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

Abstract translation: 热界面组合物含有非导电的微米尺寸的填料和与聚合物基质混合的导电纳米颗粒。 这样的组合物增加了聚合物复合材料的体积热导率，并且降低了热界面材料和相应配合表面之间存在的热界面电阻。 这样的组合物是非导电的。 含有纳米颗粒的制剂与没有纳米颗粒的制剂相比，显示出微米级颗粒的相分离较少。