Abstract:
A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed.
Abstract:
The present invention provides a vehicle speed warning system and method for acquiring the images thereof. There is a speedometer image acquisition device, mounted correspondingly to the speedometer of the existing panel, and used to acquire the images of the speedometer. An image converter converts the images acquired by a speedometer image acquisition device into digital image data. A processor is used to receive digital image data and analyze the rotating angle of the pointer of speedometer. A memory stores the program of the vehicle speed warning system and digital image data of the speedometer. A display screen displays the speed value and/or the judgment result analyzed by the processor. The setting unit sets the warning threshold of the pointer angle of speedometer. A warning device, used to send a warning signal when the pointer angle of the speedometer exceeds the warning threshold set by the driver.
Abstract:
A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.
Abstract:
A lighting device for a barbecue stove includes a fixing seat mounted on a faceplate of the barbecue stove, a lamp body detachably mounted on the fixing seat, a lighting member mounted on a first end of the lamp body, a drive member mounted on a second end of the lamp body to drive the lamp body, and a magnetic member mounted on the drive member. Thus, the magnetic member of the lighting device is magnetically attached to a metallic surface located at any position of the barbecue stove so that the lighting device is arbitrarily attached to any position of the barbecue stove to provide a lighting effect.
Abstract:
The present invention provides methods, compositions, and systems for mass spectrometric analysis of magnetic nanoparticles displaying ligands on their surface. For example, the present invention provides methods of screening a sample for the presence of at least one analyte using ligand conjugated magnetic nanoparticles, magnetic separation, and mass spectrometric analysis. The present invention also relates to MALDI matrix compositions comprising ligand conjugated magnetic nanoparticles.
Abstract:
The present invention provides methods and compositions for carbohydrate encapsulated nanoparticle based mass spectrometry. For example, the present invention provides methods of screening samples for carbohydrate binding molecules, methods of characterizing carbohydrate binding epitopes in target molecules, and MALDI matrix compositions comprising carbohydrate encapsulated nanoparticles.
Abstract:
A latching axle assembly includes an axle having a head formed at an end of the axle. Multiple recesses are defined at an outer periphery of the head. A cap has multiple protrusions formed at an inner wall of the cap and respectively positioned in the recesses to detachably mount the cap on the head. The cap can be easily and quickly mounted on the axle, and can be detached from an axle found to be defective.
Abstract:
An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.
Abstract:
A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.