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    Device for applying an electronic component
    11.
    发明授权
    Device for applying an electronic component 有权
    用于应用电子部件的装置

    公开(公告)号：US08205325B2

    公开(公告)日：2012-06-26

    申请号：US12414133

    申请日：2009-03-30

    Applicant: Ghassem Azdasht

    Inventor： Ghassem Azdasht

    IPC: B23P19/00

    CPC classification number: H05K3/3494 ,  H01L24/75 ,  H05K3/303 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/107 ,  Y10T29/49133 ,  Y10T29/49149 ,  Y10T29/49822 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53274

    Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component. The emission opening includes two emission windows which are spaced apart from one another by a component contact surface and each of the two emission windows is assigned to one of the terminal faces of the component. The component contact surface is formed by two front surfaces of two support bars which are arranged so as to be located opposite one another and which are embodied in the vacuum duct.

    Abstract translation: 本发明涉及一种用于将具有端子面的电子部件应用于也具有端子面的基板的装置，其中通过施加装置将部件从进给装置移除。 应用设备随后将元件定位在基板上，使得元件端子面从组件的接触侧延伸到元件后侧，并且基板端子面处于重叠位置。 激光能量的直接应用随后将端子面接触到元件端子面。 应用装置具有接触喷嘴，其具有用于容纳部件的部件容纳区域。 接触喷嘴具有联接到真空管道的真空开口和用于向组件施加激光辐射的发射开口。 发射开口包括两个发射窗口，两个发射窗口通过部件接触表面彼此间隔开，并且两个发射窗口中的每一个分配给部件的一个终端面。 部件接触表面由两个支撑杆的两个前表面形成，这两个支撑杆被布置为彼此相对定位并且被实施在真空管道中。

    Device for alternately contacting two wafers
    12.
    发明授权
    Device for alternately contacting two wafers 有权
    用于交替接触两个晶片的装置

    公开(公告)号：US07932611B2

    公开(公告)日：2011-04-26

    申请号：US10581819

    申请日：2004-12-02

    Applicant: Elke Zakel ,  Ghassem Azdasht

    Inventor： Elke Zakel ,  Ghassem Azdasht

    IPC: H01L23/48

    CPC classification number: H01L23/10 ,  B23K26/57 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/40 ,  H01L21/50 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2924/01079

    Abstract: A method and device for alternately contacting two wafer-like component composite arrangements, in which the two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement , so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

    Abstract translation: 用于交替接触两个晶片状部件复合布置的方法和装置，其中在其相对的接触表面上设置有接触金属化的双组分复合布置通过它们的接触金属化进入覆盖位置以形成接触对，其中 定位要接合在一起的接触金属化彼此压靠，接触金属化通过将组件复合结构中的一个的后部暴露于激光辐射而接触，激光辐射的波长被选择为吸收程度的函数 的组件复合布置，使得激光辐射通过暴露于后面的激光辐射的组件复合结构的传输基本上被抑制或激光辐射的吸收基本上在一个或两个组件复合材料的接触金属化中发生 安排

    Method of attaching a component to a plate-shaped support
    17.
    发明授权
    Method of attaching a component to a plate-shaped support 失效
    将部件附接到板状支撑件的方法

    公开(公告)号：US6056188A

    公开(公告)日：2000-05-02

    申请号：US76273

    申请日：1998-05-12

    Applicant: Ghassem Azdasht ,  Paul Kasulke

    Inventor： Ghassem Azdasht ,  Paul Kasulke

    IPC: H01L21/60 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

    CPC classification number: H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3494

    Abstract: A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component and the support member. Following this, a glass fiber or a glass fiber bundle is applied to the surface of the plate-shaped support member located opposite the electronic component. Finally, a laser pulse is conducted through the glass fiber or glass fiber bundle for melting the solder so as to establish a punctiform electrical and mechanical connection between the support member and the electronic component in this way.

    Abstract translation: 将电子部件附接到板状支撑部件的表面的方法具有作为第一步骤，将电子部件施加到支撑部件的表面，焊料布置在电子部件和支撑部件之间。 接着，将玻璃纤维或玻璃纤维束施加到与电子部件相对的板状支撑部件的表面。 最后，激光脉冲通过玻璃纤维或玻璃纤维束进行熔化，从而以这种方式在支撑部件和电子部件之间建立点状的电气和机械连接。

    Method and apparatus for the bonding of a contact element
    18.
    发明授权
    Method and apparatus for the bonding of a contact element 失效
    用于接合接触元件的方法和装置

    公开(公告)号：US5938951A

    公开(公告)日：1999-08-17

    申请号：US564352

    申请日：1995-12-14

    Applicant: Ghassem Azdasht

    Inventor： Ghassem Azdasht

    IPC: B23K20/10 ,  B23K26/04 ,  G02B6/42 ,  H01L21/60 ,  B23K26/02

    CPC classification number: H01L24/80 ,  B23K20/10 ,  B23K26/04 ,  G02B6/4236 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  B23K2201/42 ,  G02B6/4226 ,  H01L2224/45 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042

    Abstract: Method and apparatus for bonding a contact element (17) on a substrate (20), in which the contact element is held by a connecting device designed, in particular, as a bonding head (11) and the contact element or the substrate or both are loaded with thermal energy, whereinthe contact element rests on the substrate when loaded with energy and a relative movement takes place between the contact element and the substrate,reference energy issuing from an emission surface (28) and transmitted to the contact element (17) is measured during the relative movement as a reference value for the quality of the relative position of the contact element (17), andthe relative movement and the energy loading are interrupted when an adequate reference value is measured.

    Abstract translation: PCT No.PCT / DE94 / 00677 Sec。 371 1995年12月14日第 102（e）日期1995年12月14日PCT提交1994年6月16日PCT公布。 公开号WO95 / 00283 日期1995年1月5日用于将接触元件（17）接合在基板（20）上的方法和装置，其中接触元件由特别设计为接合头（11）的连接装置保持，并且接触元件 或者衬底或两者都装有热能，其中当负载能量时接触元件搁置在衬底上，并且在接触元件和衬底之间发生相对运动，从发射表面（28）发出的参考能量被发送到 在相对运动期间测量接触元件（17）作为接触元件（17）的相对位置的质量的参考值，并且当测量足够的参考值时相对运动和能量负载被中断。

    Process and apparatus for producing a bonded metal coating
    19.
    发明授权
    Process and apparatus for producing a bonded metal coating 失效
    用于生产粘合金属涂层的方法和设备

    公开(公告)号：US5653381A

    公开(公告)日：1997-08-05

    申请号：US381989

    申请日：1995-02-08

    Applicant: Ghassem Azdasht

    Inventor： Ghassem Azdasht

    IPC: B23K1/005 ,  B23K3/06 ,  H05K3/34 ,  B23K1/00

    CPC classification number: H05K3/3478 ,  B23K1/0056 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107 ,  H05K3/3494

    Abstract: A process and apparatus is available for producing a bonded metal coating.older material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and which acts in the manner of a stamp, towards a bonding surface (24) of a substrate (25). The solder material then is acted upon by energy by means of the energy transfer device (13) for shaping and connection to the bonding surface (24).

    Abstract translation: PCT No.PCT / DE94 / 00678 Sec。 371日期1995年2月8日 102（e）日期1995年2月8日PCT Filed 1994年6月16日PCT公布。 公开号WO95 / 00279 日期1995年1月5日一种可用于生产粘结金属涂层的工艺和设备。 构造成形成焊料材料成形体（18）的焊料通过能量转移装置（13）输送，该能量转移装置（13）在毛细管（12）中引导并且以印模的方式朝向 接合表面（24）。 焊料材料然后通过能量作用于能量传递装置（13），用于成形和连接到接合表面（24）。

    Test contact arrangement
    20.
    发明授权
    Test contact arrangement 有权
    测试接触排列

    公开(公告)号：US08988094B2

    公开(公告)日：2015-03-24

    申请号：US12933764

    申请日：2009-03-27

    Applicant: Ghassem Azdasht

    Inventor： Ghassem Azdasht

    IPC: G01R31/20 ,  G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06733

    Abstract: The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.

    Abstract translation: 本发明涉及一种用于测试半导体部件的测试接触装置（15），包括至少一个测试接点（10），该接触件设置在测试接触框架（13）中，并被设计成悬臂的类型，并具有 紧固基座（12）和接触臂（30），其设置有接触尖端（11）并且连接到所述紧固基座，其中所述紧固基座插入其紧固突起（16）到框架开口（ 14），使得紧固突起的下边缘（17）基本上与测试接触框架的下侧（18）齐平地对齐。

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