公开(公告)号：WO2011156344A3

公开(公告)日：2012-05-31

申请号：PCT/US2011039408

申请日：2011-06-07

Applicant: SEMPRIUS INC ,  MEITL MATTHEW ,  CARR JOSEPH ,  BURROUGHS SCOTT

Inventor： MEITL MATTHEW ,  CARR JOSEPH ,  BURROUGHS SCOTT

IPC: H01L31/052 ,  G09F13/00

CPC classification number: H01L31/0232 ,  G09F9/3026 ,  G09F9/33 ,  G09F9/35 ,  G09F27/007 ,  H01L31/0543 ,  H01L31/173 ,  H02S40/22 ,  Y02E10/52

Abstract: A concentrated photovoltaic and display apparatus includes a backplane substrate, a plurality of photovoltaic elements distributed over the backplane substrate, a plurality of display elements distributed over the backplane substrate between the photovoltaic elements, and an optical element positioned over the backplane substrate, the photovoltaic elements, and the display elements. The optical element is configured to concentrate incident light propagating in a direction substantially parallel to an optical axis thereof onto the photovoltaic elements. The optical element is further configured to direct light reflected or emitted from the display elements in a direction that is not substantially parallel to the optical axis of the optical element. Related fabrication methods and arrays including the apparatus are also discussed.

Abstract translation: 集中光伏和显示设备包括背板衬底，分布在背板衬底上的多个光伏元件，分布在光伏元件之间的背板衬底上的多个显示元件，以及定位在背板衬底上的光学元件，光伏元件 和显示元素。 光学元件被配置为将沿基本平行于其光轴的方向传播的入射光集中到光伏元件上。 光学元件进一步被配置为将从显示元件反射或发射的光引导到基本上不平行于光学元件的光轴的方向上。 还讨论了包括该装置的相关制造方法和阵列。

公开(公告)号：WO2012018544A3

公开(公告)日：2012-02-09

申请号：PCT/US2011/044833

申请日：2011-07-21

Applicant: SEMPRIUS, INC. ,  MEITL, Matthew ,  BUKOVNIK, Rudolph ,  MENARD, Etienne ,  WAGNER, Wolfgang ,  KNEEBURG, David ,  MARK, Jimmy

Inventor： MEITL, Matthew ,  BUKOVNIK, Rudolph ,  MENARD, Etienne ,  WAGNER, Wolfgang ,  KNEEBURG, David ,  MARK, Jimmy

IPC: B29C33/62 ,  G02B3/00 ,  B29C33/38 ,  B29C33/44

Abstract: Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.

公开(公告)号：WO2010091391A3

公开(公告)日：2011-09-29

申请号：PCT/US2010023577

申请日：2010-02-09

Applicant: SEMPRIUS INC ,  MENARD ETIENNE ,  BOWER CHRISTOPHER ,  BURROUGHS SCOTT ,  CARR JOE ,  CONNER BOB ,  DETS SERGIY ,  FURMAN BRUCE ,  MEITL MATTHEW ,  SULLIVAN MICHAEL

Inventor： MENARD ETIENNE ,  BOWER CHRISTOPHER ,  BURROUGHS SCOTT ,  CARR JOE ,  CONNER BOB ,  DETS SERGIY ,  FURMAN BRUCE ,  MEITL MATTHEW ,  SULLIVAN MICHAEL

IPC: H01L31/052

CPC classification number: G02B19/0076 ,  G02B3/0056 ,  G02B19/0014 ,  G02B19/0042 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/52

Abstract: CPV modules include a back plate having an array of 1mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000X lens-to-cell light concentration to the array of solar cells. To achieve this 1000X lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.

Abstract translation: CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。 背板互连网络也设置在背板上。 该背板互连网络用于将太阳能电池阵列电连接在一起。 提供了与背板间隔开的前板。 该前板包括面向太阳能电池阵列的主镜阵列。 前板可以被配置为向太阳能电池阵列提供大于1000X的透镜到单元的光浓度。 为了实现这种1000X透镜到单元的光浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。 还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。

公开(公告)号：WO2006130721A3

公开(公告)日：2009-06-25

申请号：PCT/US2006021161

申请日：2006-06-01

Applicant: UNIV ILLINOIS ,  NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

IPC: H01L21/302 ,  H01L21/8242 ,  H01L23/62 ,  H01R12/00 ,  H05K3/36

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/1292 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/22 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78696 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/1033 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract translation: 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：WO2008036837A2

公开(公告)日：2008-03-27

申请号：PCT/US2007079070

申请日：2007-09-20

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  NUZZO RALPH G ,  MEITL MATTHEW ,  KO HEUNG CHO ,  YOON JONGSEUNG ,  MENARD ETIENNE ,  BACA ALFRED J

Inventor： ROGERS JOHN A ,  NUZZO RALPH G ,  MEITL MATTHEW ,  KO HEUNG CHO ,  YOON JONGSEUNG ,  MENARD ETIENNE ,  BACA ALFRED J

IPC: H01L21/28

CPC classification number: H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Abstract translation: 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

公开(公告)号：WO2012018997A2

公开(公告)日：2012-02-09

申请号：PCT/US2011046575

申请日：2011-08-04

Applicant: SEMPRIUS INC ,  MEITL MATTHEW ,  BOWER CHRISTOPHER ,  MENARD ETIENNE ,  CARTER JAMES ,  GRAY ALLEN ,  BONAFEDE SALVATORE

Inventor： MEITL MATTHEW ,  BOWER CHRISTOPHER ,  MENARD ETIENNE ,  CARTER JAMES ,  GRAY ALLEN ,  BONAFEDE SALVATORE

IPC: H01L21/46

CPC classification number: H01L21/306 ,  H01L21/02395 ,  H01L21/02461 ,  H01L21/02546 ,  H01L21/02549 ,  H01L21/02664 ,  H01L21/30612 ,  H01L21/7813 ,  H01L23/053 ,  H01L23/28 ,  H01L31/02168 ,  H01L31/048 ,  H01L31/184 ,  H01L31/1844 ,  H01L31/1892 ,  H01L2924/0002 ,  Y02E10/544 ,  H01L2924/00

Abstract: A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.

Abstract translation: 制造可转移半导体器件的方法包括在衬底上提供包括磷化铟铝的释放层，并且在释放层上提供支撑层。 支撑层和衬底包括相应的材料，例如砷化物基材料，使得释放层相对于支撑层和衬底具有蚀刻选择性。 在支撑层上提供至少一个器件层。 选择性地蚀刻释放层而基本上不蚀刻支撑层和衬底。 还讨论了相关的结构和方法。

公开(公告)号：WO2012018544A2

公开(公告)日：2012-02-09

申请号：PCT/US2011044833

申请日：2011-07-21

Applicant: SEMPRIUS INC ,  MEITL MATTHEW ,  BUKOVNIK RUDOLPH ,  MENARD ETIENNE ,  WAGNER WOLFGANG ,  KNEEBURG DAVID ,  MARK JIMMY

Inventor： MEITL MATTHEW ,  BUKOVNIK RUDOLPH ,  MENARD ETIENNE ,  WAGNER WOLFGANG ,  KNEEBURG DAVID ,  MARK JIMMY

IPC: B29C33/62

CPC classification number: G02B3/0031 ,  B29C33/3842 ,  B29C33/58 ,  B29C33/62 ,  G02B3/0025 ,  G02B3/0056

Abstract: Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.

Abstract translation: 用可流动的可硬化聚合物涂层涂覆加工的模具产生光学光滑的表面，并保持向上指向特征的清晰度。 这些程序以快速和便宜的方式为高效平凸硅硅玻璃透镜阵列生产模具，其中端铣刀限定透镜的形状，并且涂层产生其平滑度。 端铣加工和具有可移动销的板中的透镜形状特征在具有布置在特征内的弹出特征的模具中，其形成用于透镜元件的模板，而不显着降低光学性能。 此外，具有可移动嵌件的机械加工和涂布板可以产生具有减小体积的透镜阵列的模具和每个透镜元件中的一个或几个环。

公开(公告)号：WO2011126726A1

公开(公告)日：2011-10-13

申请号：PCT/US2011/029365

申请日：2011-03-22

Applicant: SEMPRIUS, INC. ,  MENARD, Etienne ,  BOWER, Christopher ,  MEITL, Matthew ,  GARROU, Philip

Inventor： MENARD, Etienne ,  BOWER, Christopher ,  MEITL, Matthew ,  GARROU, Philip

IPC: H01L21/77

CPC classification number: H05K7/06 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/048 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/81192 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92143 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/10 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/41 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

Abstract: An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

Abstract translation: 有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。 每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的顶侧和相对的底侧以及一个或多个有源元件。 有源元件电连接到触点，并且底侧粘附到目标基板。 还讨论了相关的制造方法。

公开(公告)号：WO2008143635A1

公开(公告)日：2008-11-27

申请号：PCT/US2007/022959

申请日：2007-10-31

Applicant: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  SEMPRIUS, INC. ,  ROGERS, John ,  NUZZO, Ralph ,  MEITL, Matthew ,  MENARD, Etienne ,  BACA, Alfred, J. ,  MOTALA, Michael ,  AHN, Jong-Hyun ,  PARK, Sang-Il ,  YU, Chang-Jae ,  KO, Heung, Cho ,  STOYKOVICH, Mark ,  YOON, Jongseung

Inventor： ROGERS, John ,  NUZZO, Ralph ,  MEITL, Matthew ,  MENARD, Etienne ,  BACA, Alfred, J. ,  MOTALA, Michael ,  AHN, Jong-Hyun ,  PARK, Sang-Il ,  YU, Chang-Jae ,  KO, Heung, Cho ,  STOYKOVICH, Mark ,  YOON, Jongseung

IPC: H01L27/15

CPC classification number: H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to 10 single crystalline semiconductor based devices fabricated using conventional high temperature processing methods Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.

Abstract translation: 本发明提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件 性能特征和功能与使用常规高温处理方法制造的10个基于单晶半导体的器件相当。本发明的光学系统具有诸如形状因子，部件密度和部件位置之类的器件几何形状和构造，其通过印刷获得，其提供范围 有用的设备功能。

公开(公告)号：WO2008030960A2

公开(公告)日：2008-03-13

申请号：PCT/US2007/077759

申请日：2007-09-06

Applicant: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  ROGERS, John A. ,  NUZZO, Ralph G. ,  MEITL, Matthew ,  MENARD, Etienne ,  LEE, Keon Jae ,  KHANG, Dahl-young ,  SUN, Yugang ,  ZHU, Zhengtao ,  KO, Heung Cho ,  CARLSON, Andrew ,  CHOI, Won Mook ,  STOYKOVICH, Mark ,  JIANG, Hanqing ,  HUANG, Young

Inventor： ROGERS, John A. ,  NUZZO, Ralph G. ,  MEITL, Matthew ,  MENARD, Etienne ,  LEE, Keon Jae ,  KHANG, Dahl-young ,  SUN, Yugang ,  ZHU, Zhengtao ,  KO, Heung Cho ,  CARLSON, Andrew ,  CHOI, Won Mook ,  STOYKOVICH, Mark ,  JIANG, Hanqing ,  HUANG, Young

IPC: H01L31/16

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract translation: 在一个方面，本发明提供了可拉伸的和可选地可印刷的部件，例如半导体和电子电路，其能够在拉伸，压缩，弯曲或以其他方式变形时提供良好的性能，以及制造或 调谐这样的可伸缩组件。 对于一些应用优选的可拉伸半导体和电子电路除了可拉伸之外还是柔性的，并且因此能够沿一个或多个轴显着地伸长，弯曲，弯曲或其他变形。 此外，本发明的可拉伸半导体和电子电路适用于各种各样的器件配置，以提供完全柔性的电子和光电子器件。