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公开(公告)号：CA3078815A1
公开(公告)日：2019-04-25
申请号：CA3078815
申请日：2018-10-17
Applicant: MICRODERMICS INC
Inventor： MANSOOR IMAN , RANAMUKHAARACHCHI SAHAN ANUPAMA , STOEBER BORIS , RAEISZADEH MEHRSA
Abstract: An apparatus for inserting a microneedle into tissue. The apparatus comprises microneedle supported by a backing to move therewith and a forcer that is selectably operable between a retracted state and an extended state. Upon operation of the forcer from the retracted state to the extended state, the forcer applies force to the backing which causes the backing to travel in an insertion direction toward the tissue. A releasable locking mechanism which, in a locking state, permits one-way motion of the backing in the insertion direction toward the tissue and lockingly engages the backing to prevent motion of the backing in a reverse direction opposed to the insertion direction, the releasable locking mechanism releasable, to a released state, which permits motion of the backing in the reverse direction. The forcer is disengaged from the backing when the locking mechanism lockingly engages the backing.
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公开(公告)号：HK1218098A1
公开(公告)日：2017-02-03
申请号：HK16106118
申请日：2016-05-30
Applicant: MICRODERMICS INC
Inventor： STOEBER BORIS , MANSOOR IMAN , HFELI URS OTTO
IPC: B22D20060101 , A61M20060101 , B21G20060101
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公开(公告)号：US10589078B2
公开(公告)日：2020-03-17
申请号：US16238457
申请日：2019-01-02
Applicant: MICRODERMICS INC.
Inventor： Boris Stoeber , Iman Mansoor , Urs Otto Häfeli
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
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公开(公告)号：US20160158514A1
公开(公告)日：2016-06-09
申请号：US14965536
申请日：2015-12-10
Applicant: MICRODERMICS INC.
Inventor： Boris STOEBER , Iman MANSOOR , Urs Otto HÄFELI
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模支柱; 在所述模具支柱上形成有孔导电层; 以及在所述导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模支柱; 在模具柱上沉积第一金属层以提供第一微针; 从模具柱移除第一微针; 以及在所述模具支柱上沉积第二金属层以提供第二微针。
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公开(公告)号：WO2020023804A1
公开(公告)日：2020-01-30
申请号：PCT/US2019/043530
申请日：2019-07-25
Applicant: MICRODERMICS INC. , MANSOOR, Iman , STOEBER, Boris , RANAMUKHAARACHCHI, Sahan , RAEISZADEH, Mehrsa , SALTZSTEIN, William E.
Inventor： MANSOOR, Iman , STOEBER, Boris , RANAMUKHAARACHCHI, Sahan , RAEISZADEH, Mehrsa , SALTZSTEIN, William E.
IPC: A61M5/158 , A61B5/1486 , A61M5/32 , A61M5/162 , A61M37/00
Abstract: A sensor apparatus and a microneedle apparatus are disclosed. In one aspect, a sensor apparatus has a microneedle projecting and monolithically formed with a substrate and a probe supported by the microneedle for insertion with the microneedle into the skin of a subject. The microneedle provides a first electrode and the probe provides a second electrode of a sensing circuit. In another aspect, a sensor apparatus has an array of microneedles including a first microneedle and a second microneedle. A probe is supported by the second microneedle. The first microneedle provides a first electrode and the probe provides a second electrode of a sensing circuit. In another aspect, a microneedle apparatus with a support structure is provided. In another aspect, a microneedle apparatus capable of providing a physical and electrical contact away from the microneedle is provided.
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Patent Agency Ranking
公开(公告)号：WO2014197995A1
公开(公告)日：2014-12-18
申请号：PCT/CA2014/050552
申请日：2014-06-12
Applicant: MICRODERMICS INC.
Inventor： STOEBER, Boris , MANSOOR, Iman , HÄFELI, Urs Otto
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模支柱; 在所述模具支柱上形成有孔导电层; 以及在所述导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模支柱; 在模具柱上沉积第一金属层以提供第一微针; 从模具柱移除第一微针; 以及在所述模具支柱上沉积第二金属层以提供第二微针。
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公开(公告)号：TWI643966B
公开(公告)日：2018-12-11
申请号：TW103120606
申请日：2014-06-13
Applicant: 邁擴德米克斯股份有限公司 , MICRODERMICS INC.
Inventor： 曼舍 埃蒙 , MANSOOR, IMAN , 施陶柏 包理斯 , STOEBER, BORIS , 賀費理 烏爾斯奧托
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公开(公告)号：TW201518521A
公开(公告)日：2015-05-16
申请号：TW103120606
申请日：2014-06-13
Applicant: 邁擴德米克斯股份有限公司 , MICRODERMICS INC.
Inventor： 曼舍 埃蒙 , MANSOOR, IMAN , 施陶柏 包理斯 , STOEBER, BORIS , 賀費理 烏爾斯奧托
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: 本發明揭示用於製造金屬微針之方法。一種方法包含：提供一模具支柱；在該模具支柱上形成一有孔導電層；及在該導電層上沈積一金屬層以提供一有孔微針。另一方法包含：提供一模具支柱；在該模具支柱上沈積一第一金屬層以提供一第一微針；自該模具支柱移除該第一微針；及在該模具支柱上沈積一第二金屬層以提供一第二微針。
Abstract in simplified Chinese: 本发明揭示用于制造金属微针之方法。一种方法包含：提供一模具支柱；在该模具支柱上形成一有孔导电层；及在该导电层上沉积一金属层以提供一有孔微针。另一方法包含：提供一模具支柱；在该模具支柱上沉积一第一金属层以提供一第一微针；自该模具支柱移除该第一微针；及在该模具支柱上沉积一第二金属层以提供一第二微针。
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公开(公告)号：US20210023354A1
公开(公告)日：2021-01-28
申请号：US16845053
申请日：2020-04-09
Applicant: Microdermics Inc.
Inventor： Iman MANSOOR , Sahan Anupama RANAMUKHAARACHCHI , Boris STOEBER , Mehrsa RAEISZADEH
IPC: A61M37/00
Abstract: An apparatus for inserting a microneedle into tissue. The apparatus comprises microneedle supported by a backing to move therewith and a forcer that is selectably operable between a retracted state and an extended state. Upon operation of the forcer from the retracted state to the extended state, the forcer applies force to the backing which causes the backing to travel in an insertion direction toward the tissue. A releasable locking mechanism which, in a locking state, permits one-way motion of the backing in the insertion direction toward the tissue and lockingly engages the backing to prevent motion of the backing in a reverse direction opposed to the insertion direction, the releasable locking mechanism releasable, to a released state, which permits motion of the backing in the reverse direction. The forcer is disengaged from the backing when the locking mechanism lockingly engages the backing
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公开(公告)号：US20200078575A1
公开(公告)日：2020-03-12
申请号：US16575301
申请日：2019-09-18
Applicant: Microdermics Inc.
Inventor： Iman Mansoor , Sahan Anupama Ranamukhaarachchi , Mehrsa Raeiszadeh , Boris Stoeber
IPC: A61M37/00
Abstract: Methods and apparatus for supporting microneedles are provided. The apparatus includes a plurality of pedestals extending away from a base and transversely spaced-apart from each other by inter-pedestal volumes. Each of the pedestals has a transversely extending contact surface. For each of the pedestals, one or more microneedles extend from the contact surface of the pedestal.
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