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Patent Agency Ranking
公开(公告)号：WO2018170584A1
公开(公告)日：2018-09-27
申请号：PCT/CA2018/050300
申请日：2018-03-13
Applicant: MICRODERMICS INC.
Abstract: Methods and apparatus for supporting microneedles are provided. The apparatus includes a plurality of pedestals extending away from a base and transversely spaced- apart from each other by inter-pedestal volumes. Each of the pedestals has a transversely extending contact surface. For each of the pedestals, one or more microneedles extend from the contact surface of the pedestal.
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公开(公告)号：WO2020023804A1
公开(公告)日：2020-01-30
申请号：PCT/US2019/043530
申请日：2019-07-25
Applicant: MICRODERMICS INC. , MANSOOR, Iman , STOEBER, Boris , RANAMUKHAARACHCHI, Sahan , RAEISZADEH, Mehrsa , SALTZSTEIN, William E.
Inventor： MANSOOR, Iman , STOEBER, Boris , RANAMUKHAARACHCHI, Sahan , RAEISZADEH, Mehrsa , SALTZSTEIN, William E.
IPC: A61M5/158 , A61B5/1486 , A61M5/32 , A61M5/162 , A61M37/00
Abstract: A sensor apparatus and a microneedle apparatus are disclosed. In one aspect, a sensor apparatus has a microneedle projecting and monolithically formed with a substrate and a probe supported by the microneedle for insertion with the microneedle into the skin of a subject. The microneedle provides a first electrode and the probe provides a second electrode of a sensing circuit. In another aspect, a sensor apparatus has an array of microneedles including a first microneedle and a second microneedle. A probe is supported by the second microneedle. The first microneedle provides a first electrode and the probe provides a second electrode of a sensing circuit. In another aspect, a microneedle apparatus with a support structure is provided. In another aspect, a microneedle apparatus capable of providing a physical and electrical contact away from the microneedle is provided.
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公开(公告)号：WO2014197995A1
公开(公告)日：2014-12-18
申请号：PCT/CA2014/050552
申请日：2014-06-12
Applicant: MICRODERMICS INC.
Inventor： STOEBER, Boris , MANSOOR, Iman , HÄFELI, Urs Otto
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模支柱; 在所述模具支柱上形成有孔导电层; 以及在所述导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模支柱; 在模具柱上沉积第一金属层以提供第一微针; 从模具柱移除第一微针; 以及在所述模具支柱上沉积第二金属层以提供第二微针。
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公开(公告)号：EP3007841A1
公开(公告)日：2016-04-20
申请号：EP14811447.3
申请日：2014-06-12
Applicant: Microdermics Inc.
Inventor： STOEBER, Boris , MANSOOR, Iman , HÄFELI, Urs Otto
CPC classification number: A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B05D1/36 , B05D2201/06 , B21G1/00 , B81C1/00111
Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模柱; 在模柱上形成有孔导电层; 以及在导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模柱; 在模柱上沉积第一金属层以提供第一微针; 从模柱移除第一微针; 以及在模柱上沉积第二金属层以提供第二微针。
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