-
公开(公告)号：US12260541B2
公开(公告)日：2025-03-25
申请号：US17853859
申请日：2022-06-29
Applicant: Materials Analysis Technology Inc.
Inventor： Shang-En Wu , Keng-Chi Liang , Kuang-Tse Ho , Hung-Jen Chen
Abstract: A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.
-
公开(公告)号：US12154775B2
公开(公告)日：2024-11-26
申请号：US17852321
申请日：2022-06-28
Applicant: Materials Analysis Technology Inc.
Inventor： Yu-Teh Chung , Yen-An Tsai , Hung-Jen Chen
Abstract: An analysis system, an auxiliary analysis apparatus, and an analysis method are provided. The analysis method is used to perform a composition analysis operation on an analyte of a sample, and includes: a first heating step, a first mass spectrometry analysis step, a second heating step, a second mass spectrometry analysis step, and an analysis step. A heating device heats a non-analyzed area and a to-be-analyzed area of the sample in the first and the second heating step, respectively. In the first and the second mass spectrometry analysis step, gas generated after heating of the sample is guided into a gas chromatography-mass spectrometer, and two pieces of analysis data are correspondingly obtained. The analysis step is to compare the two pieces of analysis data and generate analysis result data. The analysis result data contains components of a composition that forms at least one portion of the analyte.
-
公开(公告)号：US11946945B2
公开(公告)日：2024-04-02
申请号：US17388125
申请日：2021-07-29
Applicant: Materials Analysis Technology Inc.
Inventor： Keng-Chieh Chu , Tsung-Ju Chan , Chun-Wei Wu , Hung-Jen Chen
CPC classification number: G01N35/00732 , G06K7/1413 , H01J37/26 , G01N2035/00752 , H01J2237/20292
Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.
-
公开(公告)号：US20220223373A1
公开(公告)日：2022-07-14
申请号：US17560460
申请日：2021-12-23
Applicant: Materials Analysis Technology Inc.
Inventor： CHIEN-WEI WU , KENG-CHIEH CHU , YUNG-SHENG FANG , CHUN-WEI WU , HUNG-JEN CHEN
IPC: H01J37/317 , H01J37/20
Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.
-
公开(公告)号：US09558565B2
公开(公告)日：2017-01-31
申请号：US14175278
申请日：2014-02-07
Applicant: MATERIALS ANALYSIS TECHNOLOGY INC
Inventor： Sajal Biring
CPC classification number: G06T7/181 , G06T7/12 , G06T7/62 , G06T2207/10056 , G06T2207/30148
Abstract: An automatic calculation method for thickness calculation of a deposition layer in a Fin-type field-effect transistor (FinFET) is disclosed through mapping edge lines onto an Excel spreadsheet. The similar method is also applied to the thickness calculation of superlattice or multiple quantum well for a light emitting diode (LED). The edge lines are obtained and transformed from an electronic image taken by Transmission Electron Microscopy (TEM), Focus Ion Beam (FIB), Atomic Force Microscopy (AFM), or X-Ray Diffraction (XRD) of the device.
Abstract translation: 通过将边缘线映射到Excel电子表格上，公开了Fin型场效应晶体管（FinFET）中的沉积层的厚度计算的自动计算方法。 类似的方法也适用于发光二极管（LED）的超晶格或多量子阱的厚度计算。 从透射电子显微镜（TEM），聚焦离子束（FIB），原子力显微镜（AFM）或X射线衍射（XRD）获得的电子图像获得边缘线并进行变换。
-
Patent Agency Ranking
公开(公告)号：US11291991B2
公开(公告)日：2022-04-05
申请号：US16576780
申请日：2019-09-20
Applicant: Materials Analysis Technology Inc.
Inventor： Hung-Jen Chen
IPC: B01L3/00
Abstract: A sample carrier device including a single substrate, a penetration structure and a fixing structure is provided. The penetration structure is formed on a side of the substrate. The penetration structure has a fluid passage. The fixing structure is formed on a side of the penetration structure. The sample carrier device is divided into an end portion, an observation portion and an operation portion. The user can separate the observation portion from the end portion by operating the operation portion. After the observation portion is separated from the end portion, the user can inject the sample into the fluid passage through a port of the fluid passage exposed to the observation portion. Once the sample is carried by the fluid passage of the observation portion, the user can seal the port of the fluid passage and place the observation portion in an electron microscope device.
-
公开(公告)号：TW201736820A
公开(公告)日：2017-10-16
申请号：TW105111188
申请日：2016-04-11
Applicant: 閤康生物科技股份有限公司 , BIO MATERIALS ANALYSIS TECHNOLOGY INC.
Inventor： 張平 , CHANG, PIN , 陳弘仁 , CHEN, HUNG-JEN
CPC classification number: G01N27/27 , B01L3/5027 , B01L3/508 , B01L2300/0627 , B01L2300/0645 , B01L2300/0809 , B01L2300/0861 , B01L2300/0877 , B01L2300/12 , B01L2300/18 , B01L2300/1827 , C25D17/00 , C25D21/12 , G01N27/44704 , G01N27/44791 , H01J37/20
Abstract: 一種樣本收集元件包括兩基板以及間隔件。兩基板相對疊置。基板具有第一表面，與第一表面相對的第二表面、第一凹槽以及至少一第二凹槽。兩基板的第一表面相對設置，且第一凹槽及第二凹槽分別位於第一表面。基板的第一凹槽共同形成第一連通道，且基板的第二凹槽共同形成連通至樣本收集元件之外的第二連通道。第一連通道與第二連通道彼此連通。間隔件配置於兩第一表面之間，用以連接並固定兩基板。兩基板與間隔件之間形成樣本容納空間。樣本容納空間包括第一連通道及至少一第二連通道。此外，一種樣本收集元件的製作方法亦被提及。
Abstract in simplified Chinese: 一种样本收集组件包括两基板以及间隔件。两基板相对叠置。基板具有第一表面，与第一表面相对的第二表面、第一凹槽以及至少一第二凹槽。两基板的第一表面相对设置，且第一凹槽及第二凹槽分别位于第一表面。基板的第一凹槽共同形成第一连信道，且基板的第二凹槽共同形成连通至样本收集组件之外的第二连信道。第一连信道与第二连信道彼此连通。间隔件配置于两第一表面之间，用以连接并固定两基板。两基板与间隔件之间形成样本容纳空间。样本容纳空间包括第一连信道及至少一第二连信道。此外，一种样本收集组件的制作方法亦被提及。
-
公开(公告)号：TWI571622B
公开(公告)日：2017-02-21
申请号：TW105111188
申请日：2016-04-11
Applicant: 閤康生物科技股份有限公司 , BIO MATERIALS ANALYSIS TECHNOLOGY INC.
Inventor： 張平 , CHANG, PIN , 陳弘仁 , CHEN, HUNG-JEN
CPC classification number: G01N27/27 , B01L3/5027 , B01L3/508 , B01L2300/0627 , B01L2300/0645 , B01L2300/0809 , B01L2300/0861 , B01L2300/0877 , B01L2300/12 , B01L2300/18 , B01L2300/1827 , C25D17/00 , C25D21/12 , G01N27/44704 , G01N27/44791 , H01J37/20
-
公开(公告)号：TWI597481B
公开(公告)日：2017-09-01
申请号：TW104143103
申请日：2015-12-22
Applicant: 閤康生物科技股份有限公司 , BIO MATERIALS ANALYSIS TECHNOLOGY INC.
Inventor： 張平 , CHUNG, PIN , 洪英展 , HUNG, YING-CHAN , 陳弘仁 , CHEN, HUNG JEN
IPC: G01N1/28
CPC classification number: G01N1/02 , G01N23/2204 , G02B5/208 , G02B21/00 , H01J37/00
-
公开(公告)号：US20230029432A1
公开(公告)日：2023-01-26
申请号：US17853859
申请日：2022-06-29
Applicant: Materials Analysis Technology Inc.
Inventor： Shang-En Wu , Keng-Chi Liang , Kuang-Tse Ho , HUNG-JEN CHEN
Abstract: A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.
-
-
-
-
-
-
-
-
-
Search Results
43
records
(took 0.029 seconds)
