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    A TEMPERATURE COMPENSATED RC OSCILLATOR FOR SIGNAL CONDITIONING ASIC USING SOURCE BULK VOLTAGE OF MOSFET
    14.
    发明公开
    A TEMPERATURE COMPENSATED RC OSCILLATOR FOR SIGNAL CONDITIONING ASIC USING SOURCE BULK VOLTAGE OF MOSFET 审中-公开
    温度补偿的RC振荡器信号AUFBEREITUNGS ASIC与MOSFET的源极接地电压

    公开(公告)号：EP2473891A1

    公开(公告)日：2012-07-11

    申请号：EP10814523.6

    申请日：2010-09-02

    Applicant: S3C, Inc.

    Inventor： ZHU, Zhineng

    IPC: G05F1/10

    CPC classification number: H03L1/022 ,  H03K3/011 ,  H03K3/03 ,  H03K3/354 ,  H03K4/502

    Abstract: A temperature compensated CMOS RC oscillator circuit changes the source- bulk voltage to stabilize the MOSFET's threshold voltage variation over temperature using a resistor and temperature-correlated bias current. The MOSFET's source is connected to ground through a resistor. This temperature-correlated bias current also runs through this resistor. When temperature increases, the bias current also increases, which increases the MOSFET's source-bulk voltage. The increased source-bulk voltage helps to stabilize the threshold voltage of MOSFET at high temperature. A power saving logic is also embedded in this oscillator to achieve higher frequency at lower power consumption. In the present invention, there is no high gain op amp or high speed comparator, which makes the resultant oscillator to be low power design and which can be integrated into a single chip with other system.

    SENSOR DEVICE PACKAGING AND METHOD
    15.
    发明公开
    SENSOR DEVICE PACKAGING AND METHOD 审中-公开
    传感器器件封装及相应方法

    公开(公告)号：EP2316008A4

    公开(公告)日：2016-01-27

    申请号：EP09808902

    申请日：2009-08-21

    Applicant: S3C INC

    Inventor： DANGTRAN JOHN ,  HORTON ROGER

    IPC: G01L9/06 ,  B81B7/00

    CPC classification number: B81B7/0077 ,  B81B7/0019

    Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

    MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
    16.
    发明公开
    MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT 审中-公开
    机械设备VERPACKUNGSTECHNIK ZUR BEFESTIGUNG VON MEMS- UND FLEXIBLEN SCHALTUNGEN

    公开(公告)号：EP2783395A4

    公开(公告)日：2015-09-02

    申请号：EP12851847

    申请日：2012-11-07

    Applicant: S3C INC

    Inventor： NZEADIBE IHIOMA U ,  HUSSAIN JAVED ,  CASTAGNA JOSEPH ,  YUAN LI ,  HORTON ROGER

    IPC: H01L29/84

    CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

    Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

    Abstract translation: 所公开的本发明提供了用于各种实现的坚固，紧凑的感测装置，包括在内燃机过程中需要低成本精确的压力感测的汽车，船舶和其他燃烧技术。 在本发明的一个或多个方面，提出了一种具有柔性电路的MEMS传感器连接，其通信优选通过使用引线键合技术实现。

    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
    18.
    发明公开
    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER 审中-公开
    VERFAHRENFÜRMINIMIERTE SPANBILDUNG贝德TRENNUNG VON MEMS芯片AUF EINEM WAFER

    公开(公告)号：EP2567401A4

    公开(公告)日：2013-12-25

    申请号：EP11778212

    申请日：2011-05-03

    Applicant: S3C INC

    Inventor： HORTON ROGER ,  HUSSAIN JAVED

    IPC: B81C1/00 ,  H01L23/58

    CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

    Abstract: A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

    Abstract translation: 一种用于在微电子机械系统（MEMS）晶片上分离多个裸片的方法，包括在第一表面上的多个裸片中的至少两个裸片之间在晶片的第一侧上划刻凹口，并且在第一表面上沉积金属 多个管芯的第一表面。 所述方法进一步包括在所述多个管芯中的至少两个之间从其第二表面通过所述凹口划刻所述晶片的第二侧。 第一侧面和第二侧面基本平行并且彼此相对，并且第一表面和第二表面基本平行且彼此相对。 在根据本发明的工艺中，提供了一种在锯切晶片期间最小化MEMS器件的键合部分的碎裂的方法，其最小程度地影响与将晶粒分离在晶片上相关的工艺步骤。

    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
    19.
    发明公开
    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER 审中-公开
    PROCEDURE FOR MINIMIZED SPAN教育在MEMS芯片上的晶片中的分离

    公开(公告)号：EP2567401A1

    公开(公告)日：2013-03-13

    申请号：EP11778212.8

    申请日：2011-05-03

    Applicant: S3C, Inc.

    Inventor： HORTON, Roger ,  HUSSAIN, Javed

    IPC: H01L23/58

    CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

    Abstract: A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

    SENSOR DEVICE PACKAGING AND METHOD
    20.
    发明公开
    SENSOR DEVICE PACKAGING AND METHOD 审中-公开
    传感器器件封装及相应方法

    公开(公告)号：EP2316008A1

    公开(公告)日：2011-05-04

    申请号：EP09808902.2

    申请日：2009-08-21

    Applicant: S3C, Inc.

    Inventor： DANGTRAN, John ,  HORTON, Roger

    IPC: G01L9/06

    CPC classification number: B81B7/0077 ,  B81B7/0019

    Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

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