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    III-V CHIP PREPARATION AND INTEGRATION IN SILICON PHOTONICS
    11.
    发明申请
    III-V CHIP PREPARATION AND INTEGRATION IN SILICON PHOTONICS 审中-公开
    硅光子III-V芯片的制备和集成

    公开(公告)号：WO2017197132A1

    公开(公告)日：2017-11-16

    申请号：PCT/US2017/032189

    申请日：2017-05-11

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： LAMBERT, Damien

    IPC: H01S5/02

    Abstract: A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.

    Abstract translation: 通过将III-V晶片固定到转印晶片来制造复合半导体激光器。 去除III-V晶片的衬底，并且将III-V晶片蚀刻成多个芯片，同时将III-V晶片固定到转移晶片。 转移晶片被分离。 转移晶片的一部分用作将芯片接合在硅器件的凹槽中的手柄。 该芯片被用作半导体激光器的增益介质。

    METHOD AND SYSTEM FOR WIDELY TUNABLE LASER
    12.
    发明申请
    METHOD AND SYSTEM FOR WIDELY TUNABLE LASER 审中-公开
    用于广泛可调激光器的方法和系统

    公开(公告)号：WO2017066044A1

    公开(公告)日：2017-04-20

    申请号：PCT/US2016/055329

    申请日：2016-10-04

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： LI, Guoliang ,  KRASULICK, Stephen, B. ,  LAMBERT, Damien

    IPC: H01S3/00 ,  H01S3/094 ,  H01S3/067

    CPC classification number: H01S5/068 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/0268 ,  H01S5/4012 ,  H01S5/4087

    Abstract: A widely tunable laser system includes a substrate, first and second lasers, an output and at least one optical combining device. The first laser is integrated with the substrate, includes a gain medium that includes a first material, and emits light at a wavelength that is tunable within a first wavelength range that is determined at least in part by the first material. The second laser is integrated with the substrate, includes a gain medium that includes a second material, and emits light at a wavelength that is tunable within a second wavelength range that is different from the first wavelength range that is determined at least in part by the second material. The at least one optical combining device is configured to direct light from one or both of the first laser and the second laser to the output.

    Abstract translation: 一种可广泛调谐的激光系统包括衬底，第一和第二激光器，输出和至少一个光学组合装置。 第一激光器与衬底集成，包括增益介质，该增益介质包括第一材料，并发射可在至少部分由第一材料确定的第一波长范围内可调的波长的光。 第二激光器与衬底集成，包括增益介质，该增益介质包括第二材料，并发射波长可调的第二波长范围内的光，该第二波长范围与第一波长范围不同，该第二波长范围至少部分由 第二种材料。 该至少一个光学组合装置被配置为将来自第一激光器和第二激光器中的一个或两个的光引导至输出。

    MULTI-PORT OPTICAL CIRCULATOR SYSTEM
    13.
    发明申请
    MULTI-PORT OPTICAL CIRCULATOR SYSTEM 审中-公开
    多端口光电循环系统

    公开(公告)号：WO2013142464A1

    公开(公告)日：2013-09-26

    申请号：PCT/US2013/032907

    申请日：2013-03-19

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： HE, Lina ,  MIZRAHI, Amit

    IPC: G02B6/26 ,  G02B6/27 ,  G02B27/10

    CPC classification number: G02F1/2257 ,  G02B6/2746 ,  G02B27/4244 ,  G02F1/0955 ,  G02F1/3136 ,  G02F2001/212

    Abstract: An optical circulator includes a first optical isolator including a first port and a second port and a plurality of optical isolators coupled to the second port of the first optical isolator. Each of the plurality of optical isolators comprise a first port and a second port.

    Abstract translation: 光环行器包括第一光隔离器，其包括第一端口和第二端口以及耦合到第一光隔离器的第二端口的多个光隔离器。 多个光隔离器中的每一个包括第一端口和第二端口。

    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES
    14.
    发明申请
    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES 审中-公开
    CMOS电子与光电器件的垂直集成

    公开(公告)号：WO2013109955A1

    公开(公告)日：2013-07-25

    申请号：PCT/US2013/022244

    申请日：2013-01-18

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： DALLESASSE, John ,  KRASULICK, Stephen B. ,  CREAZZO, Timothy ,  MARCHENA, Elton

    IPC: H01L27/14 ,  H01L27/12

    CPC classification number: H01L27/14689 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/0688 ,  H01L27/12 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/15

    Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括多个硅基器件的SOI衬底，提供包括多个光子器件的化合物半导体衬底，以及切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供具有基底层和包括多个CMOS器件的器件层的组装衬底，将多个光子管芯安装在组装衬底的预定部分上，并且对准SOI衬底和组件衬底。 该方法还包括将SOI衬底和组件衬底接合以形成复合衬底结构，并从复合衬底结构去除组装衬底的至少基底层。

    MONOLITHICALLY-INTEGRATED, POLARIZATION-INDEPENDENT CIRCULATOR
    16.
    发明申请
    MONOLITHICALLY-INTEGRATED, POLARIZATION-INDEPENDENT CIRCULATOR 审中-公开
    整体集成的极化独立循环

    公开(公告)号：WO2018017958A2

    公开(公告)日：2018-01-25

    申请号：PCT/US2017/043295

    申请日：2017-07-21

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： SODAGAR, Majid ,  WANG, Wenyi ,  LI, Changyi ,  LI, Guoliang ,  ASKARI, Murtaza ,  WANG, Yi

    CPC classification number: G02B6/2746 ,  G02B6/1228 ,  G02B6/126 ,  G02B2006/1215 ,  G02F1/093

    Abstract: A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.

    Abstract translation: 在硅光子学中形成偏振无关的光环行器。 偏振无关光环行器使用具有两个耦合器和两个耦合器的波导的分光器。 两个波导中的一个比另一个波导薄，以在通过一个波导传输的TE和TM模之间产生大的有效折射率差。 包括往复和/或非互易旋转器的偏振旋转器还被用于创建光学循环器。

    STEPPED OPTICAL BRIDGE FOR CONNECTING SEMICONDUCTOR WAVEGUIDES
    17.
    发明申请
    STEPPED OPTICAL BRIDGE FOR CONNECTING SEMICONDUCTOR WAVEGUIDES 审中-公开
    用于连接半导体波导的阶梯式光学桥

    公开(公告)号：WO2017139350A1

    公开(公告)日：2017-08-17

    申请号：PCT/US2017/016968

    申请日：2017-02-08

    Applicant: SKORPIOS TECHNOLOGIES, INC

    Inventor： LAMBERT, Damien

    IPC: G02B6/13

    CPC classification number: G02B6/12002 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12121 ,  G02B2006/12142 ,  G02B2006/12147 ,  H01S5/0202 ,  H01S5/021 ,  H01S5/02252 ,  H01S5/026 ,  H01S5/028 ,  H01S5/22 ,  H01S5/3013 ,  H01S5/343 ,  H01S5/4025 ,  H01S5/4087 ,  H04B10/505 ,  H04J14/02

    Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.

    Abstract translation: 光子器件包括其中形成有波导的半导体晶片。 波导的一端包括一个台阶。 光子器件还包括结合到半导体晶片并具有有源区的半导体芯片以及设置在半导体芯片的侧壁和波导的端部之间的间隙中的波导耦合器。 波导耦合器包括具有第一端和与第一端相对的第二端的光桥。 光桥的第一端与半导体芯片的有源区的面相接。 光桥的第二端与波导的端部连接，并且其一部分设置在波导端部的台阶上。

    BROADBAND HIGH-SPEED WAVELENGTH-DIVISION MULTIPLEXED RECEIVER USING MULTIPLE PHOTODETECTORS PER CHANNEL
    18.
    发明申请
    BROADBAND HIGH-SPEED WAVELENGTH-DIVISION MULTIPLEXED RECEIVER USING MULTIPLE PHOTODETECTORS PER CHANNEL 审中-公开
    宽带高速波分复用接收器，每通道使用多个光电转换器

    公开(公告)号：WO2017031072A1

    公开(公告)日：2017-02-23

    申请号：PCT/US2016/047066

    申请日：2016-08-15

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： LI, Guoliang ,  ASKARI, Murtaza

    IPC: H04B10/66 ,  H04J14/02

    CPC classification number: H04J14/02 ,  G02B6/00 ,  G02B6/12004 ,  G02B6/2931 ,  G02B6/2938 ,  G02B6/43 ,  G02B2006/12097 ,  H04B10/60 ,  H04B10/675

    Abstract: An optical receiver, used in wavelength-division multiplexing, has multiple photodetectors per channel. The optical receiver comprises a demultiplexer to separate incoming light into different output waveguides, one output waveguide for each channel. A splitter is used in each output waveguide to split each output waveguide into two or more branches. A separate photodetector is coupled with each branch so that two or more photodetectors are used to measure each channel.

    Abstract translation: 用于波分复用的光接收机每个通道具有多个光电探测器。 光接收器包括一个多路分离器，用于将入射光分离成不同的输出波导，每个通道一个输出波导。 在每个输出波导中使用分离器将每个输出波导分成两个或更多个分支。 单独的光电检测器与每个分支耦合，使得两个或更多个光电探测器用于测量每个通道。

    AXIAL ALIGNMENT OF A LENSED FIBER IN A SILICA V-GROOVE
    19.
    发明申请
    AXIAL ALIGNMENT OF A LENSED FIBER IN A SILICA V-GROOVE 审中-公开
    二氧化硅V型玻璃中的透镜纤维的轴向对准

    公开(公告)号：WO2016154045A1

    公开(公告)日：2016-09-29

    申请号：PCT/US2016/023242

    申请日：2016-03-18

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： LIU, Daming ,  ZYSKIND, John

    IPC: H01S5/24 ,  H01S5/32

    CPC classification number: G02B6/4243 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4202 ,  G02B6/4214 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4239

    Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.

    Abstract translation: V沟槽组件用于将透镜光纤（例如，由二氧化硅制成的光纤）与光子芯片中的波导连接。 V型槽组件由熔融二氧化硅制成。 使用熔融二氧化硅使得用于将透镜纤维粘合到V形槽组件和/或将V形槽组件粘合到光子芯片上的粘合剂（例如，环氧树脂）可以至少部分地被光固化 。

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