Methods for removing nuclei formed during epitaxial growth
    11.
    发明授权
    Methods for removing nuclei formed during epitaxial growth 有权
    去除在外延生长期间形成的核的方法

    公开(公告)号:US09378950B1

    公开(公告)日:2016-06-28

    申请号:US15051362

    申请日:2016-02-23

    Abstract: A method for removing nuclei formed during a selective epitaxial growth process includes epitaxially growing a first group of one or more semiconductor structures over a substrate with one or more mask layers. A second group of a plurality of semiconductor structures is formed on the one or more mask layers. The method also includes forming one or more protective layers over the first group of one or more semiconductor structures. At least a subset of the second group of the plurality of semiconductor structures is exposed from the one or more protective layers. The method further includes, subsequent to forming the one or more protective layers over the first group of one or more semiconductor structures, etching at least the subset of the second group of the plurality of semiconductor structures.

    Abstract translation: 一种用于去除在选择性外延生长工艺过程中形成的核的方法包括用一个或多个掩模层在衬底上外延生长第一组一个或多个半导体结构。 在一个或多个掩模层上形成第二组多个半导体结构。 该方法还包括在一个或多个半导体结构的第一组上形成一个或多个保护层。 多个半导体结构的第二组的至少一个子集从一个或多个保护层露出。 该方法还包括:在一个或多个半导体结构的第一组上形成一个或多个保护层之后,至少蚀刻多个半导体结构的第二组的子集。

    CMOS画像センサ用のゲート制御型電荷変調デバイス

    公开(公告)号:JP2018129536A

    公开(公告)日:2018-08-16

    申请号:JP2018078326

    申请日:2018-04-16

    Abstract: 【課題】小さな暗電流、高い量子効率、強いチャンネル変調を有する光センサを提供する。 【解決手段】光を検知するためのデバイス100は、第1の型のドーパントを用いてドープされた第1の半導体領域104と、第2の型のドーパントを用いてドープされた第2の半導体領域106と、を含む。第2の半導体領域は、第1の半導体領域の上方に配置されている。デバイスは、ゲート絶縁層110と、ゲート112と、ソース114と、ドレイン116と、を含む。第2の半導体領域は、ゲート絶縁層のほうを向いて配置されている上面と、第2の半導体領域の上面に対して反対側に配置されている底面と、を有する。第2の半導体領域は、第2の半導体領域の上面を含む上側部分と、上側部分とは相互に排他的であり第2の半導体領域の底面を含む下側部分と、を有する。第1の半導体領域は、第2の半導体領域の上側部分及び下側部分の両方と接触している。 【選択図】図1A

    METHODS FOR REMOVING NUCLEI FORMED DURING EPITAXIAL GROWTH
    14.
    发明公开
    METHODS FOR REMOVING NUCLEI FORMED DURING EPITAXIAL GROWTH 审中-公开
    方法拆卸过程中受过教育的外延生长核

    公开(公告)号:EP3111466A1

    公开(公告)日:2017-01-04

    申请号:EP16750355.6

    申请日:2016-05-23

    Abstract: A method for removing nuclei formed during a selective epitaxial growth process includes epitaxially growing a first group of one or more semiconductor structures over a substrate with one or more mask layers. A second group of a plurality of semiconductor structures is formed on the one or more mask layers. The method also includes forming one or more protective layers over the first group of one or more semiconductor structures. At least a subset of the second group of the plurality of semiconductor structures is exposed from the one or more protective layers. The method further includes, subsequent to forming the one or more protective layers over the first group of one or more semiconductor structures, etching at least the subset of the second group of the plurality of semiconductor structures.

    Gate-controlled Charge Modulated Device for CMOS Image Sensors

    公开(公告)号:US20190221595A1

    公开(公告)日:2019-07-18

    申请号:US16167241

    申请日:2018-10-22

    Applicant: Stratio Inc.

    Abstract: A device for sensing light includes a first semiconductor region doped with a dopant of a first type and a second semiconductor region doped with a dopant of a second type. The second semiconductor region is positioned above the first semiconductor region. The device includes a gate insulation layer; a gate, a source, and a drain. The second semiconductor region has a top surface that is positioned toward the gate insulation layer and a bottom surface that is positioned opposite to the top surface of the second semiconductor region. The second semiconductor region has an upper portion that includes the top surface of the second semiconductor region and a lower portion that includes the bottom surface of the second semiconductor region and is mutually exclusive with the upper portion. The first semiconductor region is in contact with both the upper portion and the lower portion of the second semiconductor region.

    Methods for forming a germanium island using selective epitaxial growth and a sacrificial filling layer

    公开(公告)号:US10366884B1

    公开(公告)日:2019-07-30

    申请号:US16184984

    申请日:2018-11-08

    Applicant: Stratio

    Abstract: A method for obtaining a semiconductor island includes epitaxially growing a semiconductor structure over a substrate with a mask layer defining a region not covered by the mask layer. The semiconductor structure includes a first portion located adjacent to the mask layer and a second portion located away from the mask layer. The first portion has a first height that is less than a second height of a portion of the mask layer located adjacent to the first portion. The second portion has a third height that is equal to, or greater than, the second height. The method also includes forming a filling layer over at least the first portion; and, subsequently removing at least a portion of the semiconductor structure that is located above the second height. Devices made by this method are also disclosed.

    Gate-Controlled Charge Modulated Device for CMOS Image Sensors

    公开(公告)号:US20230019977A1

    公开(公告)日:2023-01-19

    申请号:US17684124

    申请日:2022-03-01

    Applicant: Stratio, Inc.

    Abstract: A device for sensing light includes a first semiconductor region doped with a dopant of a first type and a second semiconductor region doped with a dopant of a second type. The second semiconductor region is positioned above the first semiconductor region. The device includes a gate insulation layer; a gate, a source, and a drain. The second semiconductor region has a top surface that is positioned toward the gate insulation layer and a bottom surface that is positioned opposite to the top surface of the second semiconductor region. The second semiconductor region has an upper portion that includes the top surface of the second semiconductor region and a lower portion that includes the bottom surface of the second semiconductor region and is mutually exclusive with the upper portion. The first semiconductor region is in contact with both the upper portion and the lower portion of the second semiconductor region.

    Gate-controlled charge modulated device for CMOS image sensors

    公开(公告)号:US11264418B2

    公开(公告)日:2022-03-01

    申请号:US16167241

    申请日:2018-10-22

    Applicant: Stratio Inc.

    Abstract: A device for sensing light includes a first semiconductor region doped with a dopant of a first type and a second semiconductor region doped with a dopant of a second type. The second semiconductor region is positioned above the first semiconductor region. The device includes a gate insulation layer; a gate, a source, and a drain. The second semiconductor region has a top surface that is positioned toward the gate insulation layer and a bottom surface that is positioned opposite to the top surface of the second semiconductor region. The second semiconductor region has an upper portion that includes the top surface of the second semiconductor region and a lower portion that includes the bottom surface of the second semiconductor region and is mutually exclusive with the upper portion. The first semiconductor region is in contact with both the upper portion and the lower portion of the second semiconductor region.

    METHODS FOR FORMING A GERMANIUM ISLAND USING SELECTIVE EPITAXIAL GROWTH AND A SACRIFICIAL FILLING LAYER

    公开(公告)号:US20210343528A1

    公开(公告)日:2021-11-04

    申请号:US17289205

    申请日:2018-11-09

    Applicant: STRATIO

    Abstract: A method for obtaining a semiconductor island includes epitaxially growing a semiconductor structure over a substrate with a mask layer defining a region not covered by the mask layer. The semiconductor structure includes a first portion located adjacent to the mask layer and a second portion located away from the mask layer. The first portion has a first height that is less than a second height of a portion of the mask layer located adjacent to the first portion. The second portion has a third height that is equal to, or greater than the second height. The method also includes forming a filling layer over at least the first portion; and, subsequently removing at least a portion of the semiconductor structure that is located above the second height. Devices made by this method are also disclosed.

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