公开(公告)号：WO2008137951A3

公开(公告)日：2009-03-19

申请号：PCT/US2008062943

申请日：2008-05-07

Applicant: SURFECT TECHNOLOGIES INC ,  XIE YIXIANG ,  ANDERSON STEVEN ,  PRIM MILES A ,  OBERLITNER THOMAS H ,  SANCHEZ FERNANDO M ,  MINOGUE GERARD ,  BASAME SOLOMON

Inventor： XIE YIXIANG ,  ANDERSON STEVEN ,  PRIM MILES A ,  OBERLITNER THOMAS H ,  SANCHEZ FERNANDO M ,  MINOGUE GERARD ,  BASAME SOLOMON

IPC: C25D17/00 ,  C25D5/00 ,  C25D5/10 ,  C25D7/12 ,  C25D21/00 ,  C25D21/04 ,  H01L21/288

CPC classification number: C25D5/10 ,  C25D5/00 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00 ,  C25D21/04

Abstract: A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point to a movable attachment member, a rotatable substrate support member positioned in the processing volume and having a longitudinally extending shaft extending from a non-substrate engaging side of the support member, a transducer coupled to the longitudinally extending shaft and being configured to impart energy to the substrate support member via the shaft, and at least one detachable chemistry module in fluid communication with the processing volume.

Abstract translation: 一种电镀计算机，具有具有内部处理量的电镀单元，所述电镀单元被配置为容纳用于电镀工艺的电镀液，电池安装平台至少连接到致动器的第一点，在第二点处连接到可移动的附接构件， 衬底支撑构件，其定位在处理容积中并且具有从支撑构件的非衬底接合侧延伸的纵向延伸的轴;耦合到纵向延伸的轴并被构造成经由轴向衬底支撑构件施加能量的换能器， 以及至少一个与处理体积流体连通的可拆卸化学模块。

公开(公告)号：WO2004072331A3

公开(公告)日：2004-10-28

申请号：PCT/US2004004277

申请日：2004-02-12

Applicant: SURFECT TECHNOLOGIES INC ,  GRIEGO THOMAS P ,  SANCHEZ FERNANDO M

Inventor： GRIEGO THOMAS P ,  SANCHEZ FERNANDO M

IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H05K3/34 ,  C25D5/00 ,  C25D17/00

CPC classification number: B23K35/0244 ,  B22F2998/00 ,  B22F2999/00 ,  C25D15/00 ,  C25D15/02 ,  C25D17/001 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L2224/11334 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/014 ,  B22F1/025 ,  B22F1/0088

Abstract: An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The apparatus includes a pressurized electrochemical cell (10) to improve plating efficiency and reduce defects, vertical laminar flow of the electrolyte solution to remove surface gases from the vertically arranged substrate, a rotating wafer chuck (12) to eliminate edge plating effects, and a variable aperture (18) to control the current distribution and ensure deposit uniformity across the entire substrate. Also a dynamic profile anode whose shape can be varied to optimize the current distribution to the substrate. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate.

Abstract translation: 用于高度控制电沉积的装置和方法，特别适用于电镀亚微米结构。 该过程的增强控制提供了在整个基板上更均匀的沉积厚度，并且允许亚微米特征的可靠电镀。 该设备包括一个加压电化学电池（10），以提高电镀效率并减少缺陷，电解质溶液的垂直层流从垂直排列的衬底去除表面气体，旋转晶片吸盘（12）以消除边缘电镀效应，以及 可变孔径（18）以控制电流分布并确保整个基板上的沉积均匀性。 还可以改变其形状可以改变以优化对衬底的电流分布的动态轮廓阳极。 阳极有利地能够使用金属离子源并且可以靠近阴极放置，从而最小化衬底的污染。

公开(公告)号：WO2004052547A2

公开(公告)日：2004-06-24

申请号：PCT/US2003/038614

申请日：2003-12-05

Applicant: SURFECT TECHNOLOGIES, INC. ,  GRIEGO, Thomas, P.

Inventor： GRIEGO, Thomas, P.

IPC: B03C

CPC classification number: H01L21/76898 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  C25D7/123 ,  C25D15/00 ,  C25D15/02 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/2885 ,  H01L21/76877 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/09572 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/104 ,  Y10T428/12063 ,  B22F1/025 ,  B22F1/0088 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For. solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

Abstract translation: 使用涂覆和/或磁性颗粒来沉积包括焊点，凸块，通孔，结合环等的结构的方法。 颗粒可以用可焊材料涂覆。 对于。 焊料接头，在回流之后，焊料材料可以包括基体中的未熔化的颗粒，由此增加接头的强度并减小接头阵列的节距。 颗粒和涂层可形成更高熔点的合金，允许多次后续回流步骤。 颗粒和/或涂层可以是磁性的。 在沉积期间可以施加外部磁场以精确控制颗粒加载和沉积位置。 具有不相容电位的元件可以由此在单个步骤中电沉积。 使用这样的场允许填充诸如通孔的高纵横比结构，而不需要结构的完整晶种金属化。 此外，由催化材料涂覆的磁性颗粒组成的催化剂，任选包括中间层。

公开(公告)号：WO2008137951A2

公开(公告)日：2008-11-13

申请号：PCT/US2008/062943

申请日：2008-05-07

Applicant: SURFECT TECHNOLOGIES, INC. ,  XIE, Yixiang ,  ANDERSON, Steven ,  PRIM, Miles A. ,  OBERLITNER, Thomas H. ,  SANCHEZ, Fernando M. ,  MINOGUE, Gerard ,  BASAME, Solomon

Inventor： XIE, Yixiang ,  ANDERSON, Steven ,  PRIM, Miles A. ,  OBERLITNER, Thomas H. ,  SANCHEZ, Fernando M. ,  MINOGUE, Gerard ,  BASAME, Solomon

IPC: C25D17/00 ,  C25D7/12 ,  C25D21/00 ,  C25D21/04 ,  C25D5/00 ,  C25D5/10 ,  H01L21/288

CPC classification number: C25D5/10 ,  C25D5/00 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00 ,  C25D21/04

Abstract: A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point to a movable attachment member, a rotatable substrate support member positioned in the processing volume and having a longitudinally extending shaft extending from a non-substrate engaging side of the support member, a transducer coupled to the longitudinally extending shaft and being configured to impart energy to the substrate support member via the shaft, and at least one detachable chemistry module in fluid communication with the processing volume.

Abstract translation: 一种电镀计算机，具有具有内部处理量的电镀单元，所述电镀单元被配置为容纳用于电镀工艺的电镀液，电池安装平台至少连接到致动器的第一点，在第二点处连接到可移动的附接构件， 衬底支撑构件，其定位在处理容积中并且具有从支撑构件的非衬底接合侧延伸的纵向延伸的轴;耦合到纵向延伸的轴并被构造成经由轴向衬底支撑构件施加能量的换能器， 以及至少一个与处理体积流体连通的可拆卸化学模块。

公开(公告)号：WO2005076977A3

公开(公告)日：2008-09-25

申请号：PCT/US2005003760

申请日：2005-02-04

Applicant: SURFECT TECHNOLOGIES INC ,  BLECK MARTIN ,  BERNER ROBERT WAYNE ,  MINOGUE GERARD ,  SANCHEZ FERNANDO M ,  HANNON MATHEW ,  GRIEGO THOMAS P

Inventor： BLECK MARTIN ,  BERNER ROBERT WAYNE ,  MINOGUE GERARD ,  SANCHEZ FERNANDO M ,  HANNON MATHEW ,  GRIEGO THOMAS P

IPC: C25B9/00 ,  C23C18/16 ,  C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00

CPC classification number: C25D5/003 ,  C23C18/1619 ,  C25D7/123 ,  C25D17/001

Abstract: The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.

Abstract translation: 本发明包括一种特别适用于自动催化（即无电解）电镀的金属电镀装置和方法，包括用于设置待镀层的基底和用于电镀溶液的循环的加压可密封容器，其中温度和压力是高度可控的。

公开(公告)号：WO2008058250A1

公开(公告)日：2008-05-15

申请号：PCT/US2007/084144

申请日：2007-11-08

Applicant: SURFECT TECHNOLOGIES, INC. ,  BASAME, Solomon B. ,  ANDERSON, Steven M. ,  XIE, Yixiang

Inventor： BASAME, Solomon B. ,  ANDERSON, Steven M. ,  XIE, Yixiang

IPC: C23C18/16

CPC classification number: C23C18/1601 ,  C23C18/1628 ,  C23C18/1671 ,  C23C18/1676

Abstract: A method and system for controlling an electroless deposition process are provided. The system generally includes an electroless plating cell having a work piece to be plated positioned therein, the work piece also being positioned in communication with an electroless plating solution contained by the plating cell, and a voltage measurement device in communication with the work piece and the electroless plating solution, the voltage measurement device being configured to measure the electrical potential difference between the work piece and the plating solution. The system further includes a control voltage device in communication with the work piece and being configured to apply a determined control voltage to the work piece, and a system controller in communication with the voltage measurement device and the control voltage device, the system controller being configured to receive an input from the voltage measurement device and to generate a control voltage output corresponding to the determined control voltage, the output being sent to the control voltage device to cause the control voltage device to apply the determined control voltage to the work piece.

Abstract translation: 提供了一种用于控制无电沉积工艺的方法和系统。 该系统通常包括具有被定位在其中的电镀工件的化学镀电池，工件还与镀电池所含的化学镀液相连通，以及与工件和 化学镀溶液，所述电压测量装置被配置为测量所述工件和所述电镀液之间的电位差。 该系统还包括与工件通信的控制电压装置，并且被配置为对所述工件施加确定的控制电压，以及与所述电压测量装置和所述控制电压装置通信的系统控制器，所述系统控制器被配置 为了从电压测量装置接收输入并产生对应于确定的控制电压的控制电压输出，该输出被发送到控制电压装置，以使控制电压装置将所确定的控制电压施加到工件。

公开(公告)号：WO2005076977A2

公开(公告)日：2005-08-25

申请号：PCT/US2005/003760

申请日：2005-02-04

Applicant: SURFECT TECHNOLOGIES, INC. ,  BLECK, Martin ,  BERNER, Robert, Wayne ,  MINOGUE, Gerard ,  SANCHEZ, Fernando, M. ,  HANNON, Mathew ,  GRIEGO, Thomas, P.

Inventor： BLECK, Martin ,  BERNER, Robert, Wayne ,  MINOGUE, Gerard ,  SANCHEZ, Fernando, M. ,  HANNON, Mathew ,  GRIEGO, Thomas, P.

IPC: C23C18/16 ,  C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00

CPC classification number: C25D5/003 ,  C23C18/1619 ,  C25D7/123 ,  C25D17/001

Abstract: The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.

Abstract translation: 本发明包括一种特别适用于自动催化（即无电解）电镀的金属电镀装置和方法，包括用于设置待镀层的基底和用于电镀溶液的循环的加压可密封容器，其中温度和压力是高度可控的。

公开(公告)号：WO2004052547A3

公开(公告)日：2004-12-02

申请号：PCT/US0338614

申请日：2003-12-05

Applicant: SURFECT TECHNOLOGIES INC ,  GRIEGO THOMAS P

Inventor： GRIEGO THOMAS P

IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34 ,  C25B11/04

CPC classification number: H01L21/76898 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  C25D7/123 ,  C25D15/00 ,  C25D15/02 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/2885 ,  H01L21/76877 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/09572 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/104 ,  Y10T428/12063 ,  B22F1/025 ,  B22F1/0088 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For. solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

Abstract translation: 使用涂覆和/或磁性颗粒沉积包括焊点，凸块，通孔，结合环等结构的方法。 颗粒可以用可焊接材料涂覆。 对于。 焊料回流焊接材料之后，焊料可以包括未熔化的颗粒在基质中，从而增加接头的强度并降低连接阵列的间距。 颗粒和涂层可形成较高熔点的合金，允许多次随后的回流步骤。 颗粒和/或涂层可以是磁性的。 可以在沉积期间施加外部磁场以精确地控制颗粒装载和沉积位置。 因此，具有不相容的电位的元件可以在一个步骤中电沉积。 使用这样的领域允许填充诸如通孔的高纵横比结构，而不需要结构的完全种子金属化。 而且，由涂覆有催化材料的磁性颗粒组成的催化剂，任选地包括中间层。

公开(公告)号：WO2004072331A2

公开(公告)日：2004-08-26

申请号：PCT/US2004/004277

申请日：2004-02-12

Applicant: SURFECT TECHNOLOGIES, INC. ,  GRIEGO, Thomas, P. ,  SANCHEZ, Fernando, M.

Inventor： GRIEGO, Thomas, P. ,  SANCHEZ, Fernando, M.

IPC: C25D

CPC classification number: B23K35/0244 ,  B22F2998/00 ,  B22F2999/00 ,  C25D15/00 ,  C25D15/02 ,  C25D17/001 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L2224/11334 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/014 ,  B22F1/025 ,  B22F1/0088

Abstract: An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The apparatus includes a pressurized electrochemical cell to improve plating efficiency and reduce defects, vertical laminar flow of the electrolyte solution to remove surface gases from the vertically arranged substrate, a rotating wafer chuck to eliminate edge plating effects, and a variable aperture to control the current distribution and ensure deposit uniformity across the entire substrate. Also a dynamic profile anode whose shape can be varied to optimize the current distribution to the substrate. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate.

Abstract translation: 用于高度控制电沉积的装置和方法，特别适用于电镀亚微米结构。 该过程的增强控制提供了在整个基板上更均匀的沉积厚度，并且允许亚微米特征的可靠电镀。 该装置包括一个加压电化学电池，以提高电镀效率并减少缺陷，电解质溶液的垂直层流从垂直排列的衬底去除表面气体，旋转晶片吸盘以消除边缘电镀效应，以及可变孔径来控制电流 分布并确保整个基板的沉积均匀性。 还可以改变其形状可以改变以优化对衬底的电流分布的动态轮廓阳极。 阳极有利地能够使用金属离子源并且可以靠近阴极放置，从而最小化衬底的污染。

公开(公告)号：WO2003068434A1

公开(公告)日：2003-08-21

申请号：PCT/US2003/004316

申请日：2003-02-12

Applicant: SURFECT TECHNOLOGIES, INC. ,  GRIECO, Thomas, P.

Inventor： GRIECO, Thomas, P.

IPC: B22F9/00

CPC classification number: H01M8/04216 ,  B22F1/025 ,  C25D5/00 ,  C25D7/006 ,  H01M4/242 ,  H01M8/065 ,  Y10T428/12028 ,  Y10T428/12097

Abstract: A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.

Abstract translation: 一种生产金属氢化物混合稀土金属复合粉末的方法，包括向旋转流通电沉积装置提供其颗粒包含一种或多种选自钛镧系合金金属和镍镧系合金金属的镧系合金金属和电沉积一种 或更多的非镧系金属通过该装置在粉末上。 还得到所得的物质和金属氢化物混合金属粉末的组合物。