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    COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF
    1.
    发明专利
    COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF 未知

    公开(公告)号：AU2003298904A1

    公开(公告)日：2004-06-30

    申请号：AU2003298904

    申请日：2003-12-05

    Applicant: SURFECT TECHNOLOGIES INC

    Inventor： GRIEGO THOMAS P

    IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34

    Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

    Coated and magnetic particles and applications thereof
    2.
    发明专利
    Coated and magnetic particles and applications thereof 未知

    公开(公告)号：AU2003298904A8

    公开(公告)日：2004-06-30

    申请号：AU2003298904

    申请日：2003-12-05

    Applicant: SURFECT TECHNOLOGIES INC

    Inventor： GRIEGO THOMAS P

    IPC: B23K35/02 ,  C25D7/12 ,  C25D17/16 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L21/288 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H05K3/34 ,  C25B11/04

    Abstract: A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

    METAL HYDRIDE COMPOSITE MATERIALS
    4.
    发明专利
    METAL HYDRIDE COMPOSITE MATERIALS 未知

    公开(公告)号：AU2003211015A1

    公开(公告)日：2003-09-04

    申请号：AU2003211015

    申请日：2003-02-12

    Applicant: SURFECT TECHNOLOGIES INC

    Inventor： GRIECO THOMAS P

    IPC: B22F1/02 ,  C25D5/00 ,  C25D7/00 ,  H01M4/24 ,  H01M8/04 ,  H01M8/06 ,  B22F9/00 ,  C25D17/28 ,  C25D15/00

    Abstract: A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.

    Apparatus and method for highly controlled electrodeposition
    6.
    发明申请
    Apparatus and method for highly controlled electrodeposition 审中-公开
    高度控制电沉积的装置和方法

    公开(公告)号：US20040256222A1

    公开(公告)日：2004-12-23

    申请号：US10778647

    申请日：2004-02-12

    Applicant: Surfect Technologies, Inc.

    Inventor： Thomas P. Griego ,  Fernando M. Sanchez

    IPC: C25D005/02 ,  C25D005/00 ,  C25D017/16

    CPC classification number: B23K35/0244 ,  B22F2998/00 ,  B22F2999/00 ,  C25D15/00 ,  C25D15/02 ,  C25D17/001 ,  H01F41/16 ,  H01F41/20 ,  H01F41/26 ,  H01L2224/11334 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/014 ,  B22F1/025 ,  B22F1/0088

    Abstract: An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The apparatus includes a pressurized electrochemical cell to improve plating efficiency and reduce defects, vertical laminar flow of the electrolyte solution to remove surface gases from the vertically arranged substrate, a rotating wafer chuck to eliminate edge plating effects, and a variable aperture to control the current distribution and ensure deposit uniformity across the entire substrate. Also a dynamic profile anode whose shape can be varied to optimize the current distribution to the substrate. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate.

    Abstract translation: 用于高度控制电沉积的装置和方法，特别适用于电镀亚微米结构。 该过程的增强控制提供了在整个基板上更均匀的沉积厚度，并且允许亚微米特征的可靠电镀。 该装置包括一个加压电化学电池，以提高电镀效率并减少缺陷，电解质溶液的垂直层流从垂直排列的衬底去除表面气体，旋转晶片卡盘以消除边缘电镀效应，以及可变孔径来控制电流 分布并确保整个基板的沉积均匀性。 还可以改变其形状可以改变以优化对衬底的电流分布的动态轮廓阳极。 阳极有利地能够使用金属离子源并且可以靠近阴极放置，从而最小化衬底的污染。

    動態輪廓陽極 DYNAMIC PROFILE ANODE
    9.
    发明专利
    動態輪廓陽極 DYNAMIC PROFILE ANODE 审中-公开
    动态轮廓阳极 DYNAMIC PROFILE ANODE

    公开(公告)号：TW200617214A

    公开(公告)日：2006-06-01

    申请号：TW094129290

    申请日：2005-08-26

    Applicant: 塞非特 科技股份有限公司 SURFECT TECHNOLOGIES, INC.

    Inventor： 湯馬司P. 哥雷也枸 THOMAS P. GRIEGO ,  佛南度M. 桑切士 FERNANDO M. SANCHEZ

    IPC: C25D

    Abstract: 一種其形狀可變化以於高度控制電沉積期間最佳化至一基板之電流分布之一動態輪廓陽極。該製成之增大控制為整個基板之更統一沉積厚度做準備，並允許次微米特徵之可靠電鍍。該陽極尤其有用於電鍍次微米結構。該陽極可有利地使用金屬離子來源，且可放置靠近於該陰極，因此使該基板之污染縮到最小。該陽極輪廓可於該沉基製程期間變化。該陽極可由多個同心區域組成，其各可以獨立電壓與電流操作。

    Abstract in simplified Chinese: 一种其形状可变化以于高度控制电沉积期间最优化至一基板之电流分布之一动态轮廓阳极。该制成之增大控制为整个基板之更统一沉积厚度做准备，并允许次微米特征之可靠电镀。该阳极尤其有用于电镀次微米结构。该阳极可有利地使用金属离子来源，且可放置靠近于该阴极，因此使该基板之污染缩到最小。该阳极轮廓可于该沉基制程期间变化。该阳极可由多个同心区域组成，其各可以独立电压与电流操作。

    SUBMICRON AND NANO SIZE PARTICLE ENCAPSULATION BY ELECTROCHEMICAL PROCESS AND APPARATUS
    10.
    发明申请
    SUBMICRON AND NANO SIZE PARTICLE ENCAPSULATION BY ELECTROCHEMICAL PROCESS AND APPARATUS 审中-公开
    电化学过程和装置的纳米颗粒和纳米尺寸颗粒

    公开(公告)号：WO2004053204A1

    公开(公告)日：2004-06-24

    申请号：PCT/US2002/038944

    申请日：2002-12-05

    Applicant: SURFECT TECHNOLOGIES, INC. ,  GRIEGO, Thomas, P. ,  EICHMAN, John, W., III

    Inventor： GRIEGO, Thomas, P. ,  EICHMAN, John, W., III

    IPC: C25D17/16

    CPC classification number: C25D17/16 ,  B22F2998/00 ,  B22F2999/00 ,  B22F1/025 ,  B22F1/0088 ,  C25D3/00 ,  C25D15/00

    Abstract: An apparatus and method for coating or treating powdered material, particularly ultrafine powders in the nanometer or submicron range of mean diameters, by electrolytic processes. A platen (30) is mounted for rotation upon a fixed shaft (20), and a rotary flow-through electrolytic cell (36) is mounted upon a platen (30) for rotation thereon, the cell's axis of rotation (B) being offset from the platen's axis of rotation (A). The cells axis of rotation (B) revolves around the platen's axis (A) as the platen (30) rotates. The electrolytic cell (36) accordingly undergoes a planetary rotation, as the cell (36) revolves around the platen's axis of rotation (A). The planetary rotation of the cell (B) allows the powdered material to be collected by centrifugal force and constantly agitated to promote uniform electroplating. An electrode array (44) and rolling contact system are supplied which allow electric potential to be applied only to those electrodes actually in contact with the powdered material to be treated.

    Abstract translation: 一种用于通过电解方法涂覆或处理粉末材料，特别是纳米或亚微米范围内的超微粉末的装置和方法。 安装用于在固定轴（20）上旋转的压盘（30），并且旋转流通电解槽（36）安装在压板（30）上以旋转，电池的旋转轴线（B）被偏移 从压盘的旋转轴（A）。 当压板（30）旋转时，单元旋转轴线（B）围绕压板的轴线（A）旋转。 当电池（36）围绕压板的旋转轴线（A）旋转时，电解槽（36）相应地经历行星旋转。 电池（B）的行星旋转允许通过离心力收集粉末材料并且不断地搅动以促进均匀的电镀。 提供电极阵列（44）和滚动接触系统，其允许电势仅施加到实际上与被处理粉末材料接触的那些电极。

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