Abstract:
A polyimide film includes a first sub-layer and a second sub-layer connected with each other. The first sub-layer contains a first polyimide, and a particulate filler of fluorine-containing polymer distributed in the first polyimide. The second sub-layer includes a second polyimide similar or identical to the first polyimide. The first polyimide is derived from a first diamine component and a first dianhydride component, the first diamine component and/or the first dianhydride component containing fluorine atoms. The second sub-layer is derived from a second diamine component and a second dianhydride component, the second diamine component and/or the second dianhydride component also containing fluorine atoms.
Abstract:
A colored matting powder includes particles containing a polyimide obtained by reacting diamine and dianhydride monomers at a substantially equal molar ratio, and a pigment incorporated with the polyimide, a portion of the pigment being located at an outer surface of the particles. Moreover, a colored polyimide film is also described as incorporating the colored matting powder, and can exhibit low gloss, low transparency and good insulation.
Abstract:
A black matte polyimide film is provided, the black matte polyimide film includes polyimide, carbon black and polyimide fine powder. The polyimide component is obtained by polymerization of a dianhydride and a diamine, followed by chemical cyclization, in which the dianhydride is pyromellitic dianhydride, and the diamine comprises 5˜15 mol % of p-phenylenediamine and 95˜85 mol % of 4,4′-diaminodiphenyl ether; the carbon black is present in an amount of 2 to 8 wt % of the polyimide film; and the polyimide fine powder is present in an amount of 5 to 10 wt % of the polyimide film, such that the black matte polyimide film has a glossiness between 5 and 30 and a thermal expansion coefficient of less than 41 ppm/° C.
Abstract:
A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
Abstract:
A polyimide composite film for use in a flexible metal clad substrate, comprising: a polyimide base material film; a fluorine polymer layer, formed on at least one surface of the polyimide base material film, comprising polyimide resins and fluorine polymers, wherein the polyimide resin accounts for 2 to 20 wt % of the total solid content of the fluorine polymer layer, the aromatic functional group ratio of the polyimide resin in the fluorine polymer layer is greater than 35%, and the absorption onset wavelength (λonset) of the ultraviolet-visible spectrum is greater than 360 nm; a thickness ratio of the polyimide base material film to one layer of the fluorine polymer layers is 8:1 to 1:4; and a total thickness of the polyimide composite film is between 18 and 175 microns. Thus, the polyimide composite film has a low dielectric constant, low loss factor, and has good drilling processability.
Abstract:
A process of fabricating a graphite film includes providing a roll of a polyimide film, applying a first thermal treatment so that the roll of the polyimide film is carbonized to form a roll of a carbon film, and applying a second thermal treatment so that the roll of the carbon film is converted to a roll of a graphite film. The rolled polyimide film has a thickness between 10 μm and 150 μm, and includes polyimide derived from reaction of diamine monomers with dianhydride monomers, the dianhydride monomers including pyromellitic dianhydride (PMDA), the diamine monomers including 4,4′-oxydianiline (4,4′-ODA) and phenylenediamine (PDA) with a ODA:PDA diamine molar ratio being 50:50 to 80:20.
Abstract:
The present disclosure relates, according to some embodiments, to a method of fabricating a flexible metal-clad laminate comprising forming a metal layer on a surface of a polyimide film, wherein the metal layer and the polyimide film are contacting each other and forming a laminate, and heating the laminate at a temperature of about 80° C. to about 140° C. until a weight loss of the laminate reaches about 1% or higher.
Abstract:
A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.
Abstract:
A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.
Abstract:
A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.