公开(公告)号：US20220389225A1

公开(公告)日：2022-12-08

申请号：US17752884

申请日：2022-05-25

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： YI-HSUEH HO ,  MENG-YING TSAI

IPC: C08L101/12

Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer; wherein the polymer film has a thermal expansion coefficient between 0 and 60 ppm/t of 50° C. to 200° C., a water absorption rate less than 0.5%, a dielectric loss tangent of Df less than 0.005 at a frequency of 10 GHz, and a storage elastic modulus greater than 0.1 GPa at 310° C. A method for manufacturing the polymer film, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder; providing a liquid crystal polymer glue; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film.

公开(公告)号：US10040939B2

公开(公告)日：2018-08-07

申请号：US14697185

申请日：2015-04-27

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chun-Ting Lai ,  Chih-Wei Lin

IPC: C08L79/08 ,  C08J5/18 ,  C09D179/08 ,  C08G73/10

Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.

公开(公告)号：US20150072158A1

公开(公告)日：2015-03-12

申请号：US14319588

申请日：2014-06-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chih-Wei LIN ,  Chi-Huan LO

IPC: C08K3/04 ,  C08K3/36 ,  H05K3/00 ,  H05K1/05

CPC classification number: C08K3/04 ,  C08G73/1071 ,  C08K3/36 ,  C09D179/08 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0323 ,  Y10T428/31681 ,  C08L79/08

Abstract: A black polyimide film includes a polyimide polymer formed by reaction of diamine monomers with dianhydride monomers, and a carbon black having an oxygen-to-carbon weight ratio higher than 11%. The black polyimide film can prevent flaking of carbon black when it is subject to an etching process, and exhibit desirable characteristics of extension rate and insulation.

Abstract translation: 黑色聚酰亚胺膜包括通过二胺单体与二酐单体的反应形成的聚酰亚胺聚合物和碳 - 碳重量比高于11％的炭黑。 黑色聚酰亚胺膜可以防止在进行蚀刻处理时炭黑的剥落，并且具有延伸率和绝缘性的所需特性。

公开(公告)号：US20250026899A1

公开(公告)日：2025-01-23

申请号：US18752818

申请日：2024-06-25

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： WEN-HSUAN CHUNG

IPC: C08J5/18 ,  B29C41/00 ,  B29C41/38 ,  B29C41/42 ,  B29C59/04 ,  B29C71/02 ,  B29K79/00 ,  B29K105/00 ,  C08G73/10

Abstract: The present invention provides a method for manufacturing a polyimide film with a reduced gloss, which comprises providing a diamine and a diacid anhydride for polymerization in a solvent to form a polyimide precursor solution; adding 2-5 equivalents of a dehydrating agent and a catalyst into the polyimide precursor solution and then coating a carrier with the polyimide precursor solution to form a polyimide gel film; providing an embossing wheel to roll the polyimide gel film peeled from the carrier at a temperature of 140-200° C. and a pressure of 3-10 Kgf/cm2 to form a concave and convex shape on a surface of the polyimide gel film; and baking the polyimide gel film to form a polyimide film with a 60° gloss of less than 100 GUs.

公开(公告)号：US20220356306A1

公开(公告)日：2022-11-10

申请号：US17700541

申请日：2022-03-22

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： YI-HSUEH HO ,  MENG-YING TSAI

IPC: C08G73/10 ,  C08J5/18 ,  C08K3/04 ,  C08J3/14

Abstract: A black matte polyimide film is provided, the black matte polyimide film includes polyimide, carbon black and polyimide fine powder. The polyimide component is obtained by polymerization of a dianhydride and a diamine, followed by chemical cyclization, in which the dianhydride is pyromellitic dianhydride, and the diamine comprises 5˜15 mol % of p-phenylenediamine and 95˜85 mol % of 4,4′-diaminodiphenyl ether; the carbon black is present in an amount of 2 to 8 wt % of the polyimide film; and the polyimide fine powder is present in an amount of 5 to 10 wt % of the polyimide film, such that the black matte polyimide film has a glossiness between 5 and 30 and a thermal expansion coefficient of less than 41 ppm/° C.

公开(公告)号：US20210102034A1

公开(公告)日：2021-04-08

申请号：US17009802

申请日：2020-09-02

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： YI-HSUEH HO ,  YUN-HSIANG CHANG ,  YI-CHIA HUANG ,  PAUL S.C. WU

IPC: C08J5/18 ,  C08G73/10 ,  C09D179/08

Abstract: A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.

公开(公告)号：US10334738B2

公开(公告)日：2019-06-25

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/683 ,  H01L23/498 ,  C03C17/34 ,  C08L79/08 ,  C08G73/10 ,  C09D179/08

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20180042125A1

公开(公告)日：2018-02-08

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/46 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K3/007 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US09850401B2

公开(公告)日：2017-12-26

申请号：US14561070

申请日：2014-12-04

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Ting Lai ,  Chih-Wei Lin

IPC: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  H05K1/03 ,  H05K3/38 ,  C08G73/10 ,  B32B38/00 ,  H05K3/02

CPC classification number: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/322 ,  B32B2038/0016 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  H05K1/036 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/2495 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31544 ,  C08L27/18 ,  C08L83/04 ,  C08K3/36

Abstract: A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

公开(公告)号：US09839136B2

公开(公告)日：2017-12-05

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S. C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.