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11.发明申请Card enclosed units, service providing sheets and information concealment sheet 有权卡片封闭单元，服务提供单和信息隐藏表公开(公告)号：US20140299493A1
公开(公告)日：2014-10-09
申请号：US14091911
申请日：2013-11-27
Applicant: Toppan Forms Co., Ltd.
Inventor： Shogo Nakagawa , Norifumi Aizawa , Nobuyuki Saitou
IPC: B42D15/00
CPC classification number: B42D15/025 , A45C11/182 , B42D15/085 , B65D73/0078
Abstract: A card enclosed unit that has card mount paper and support mount paper 20 adhered to each other. Card mount paper comprises upper paper 11 and lower paper 12. Card mount paper has card 2. Card 2 is separably enclosed in the card mount paper. Card 2 is peelably adhered to support mount paper 20. PIN code 4a is indicated on support mount paper 20 side adhesion surface of card 2. POS code 4b is indicated on support mount paper 20 side adhesion surface of card mount paper. Card mount paper has hole 3b such that hole 3b is opposite to POS code 4b.
Abstract translation: 具有卡安装纸和支撑安装纸20彼此粘附的卡封闭单元。 卡片安装纸包括上纸11和下纸12.卡安装纸具有卡2.卡2可分离地封装在卡安装纸中。 卡2可剥离地粘附到支撑安装纸20上。在代表卡2的支撑安装纸20侧粘合表面上指示PIN码4a。POS代码4b在卡安装纸的支撑安装纸20侧粘附表面上指示。 卡片安装纸具有孔3b，孔3b与POS代码4b相对。
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公开(公告)号：US09834360B2
公开(公告)日：2017-12-05
申请号：US14655963
申请日：2013-01-09
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Yasuhiro Tanaka , Sho Morita
CPC classification number: B65D81/18 , B65D81/3813 , B65D81/3825 , F25D3/08 , F25D2303/08221 , F25D2303/0843 , F25D2331/804
Abstract: An implement for storage at a constant temperature has two housings (21 and 22) that accommodate heat storage agents. One heat storage agent (41) is irremovably accommodated in one housing (21), and a hook-and-loop fastener (30) for installation in a storage container is provided on the outer surface of the other housing (22).
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公开(公告)号：US20170236048A1
公开(公告)日：2017-08-17
申请号：US15519029
申请日：2015-10-28
Applicant: Toppan Forms Co., Ltd.
Inventor： Norihiro Ooishi , Hitoshi Kagaya , Yoshihiro Mizunuma
IPC: G06K19/077 , H01Q1/22 , H01Q9/04
CPC classification number: G06K19/07745 , G06K19/07749 , G06K19/07779 , G06K19/07786 , G06K19/07794 , H01Q1/2225 , H01Q1/2283 , H01Q1/38 , H01Q7/00 , H01Q9/0464
Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.
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公开(公告)号：US20160330835A1
公开(公告)日：2016-11-10
申请号：US15110977
申请日：2015-01-23
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Abstract translation: 布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小 ，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。
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公开(公告)号：US20150008376A1
公开(公告)日：2015-01-08
申请号：US14371913
申请日：2013-01-25
Applicant: Toppan Forms Co., LTD.
Inventor： Kumi Hirose , Marina Imai
Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R′ and R″ independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.)
Abstract translation: 一种银墨水组合物，其包含具有由式-COOAg表示的基团的羧酸银，具有2至10个碳原子的脂族伯胺或仲胺，由以下通式（2）表示的乙炔醇和烃 具有6〜20个碳原子，在27℃下的粘度为40mPa·s以下（式中，R'和R“各自独立地表示碳原子数1〜20的烷基或苯基 基团，其中一个或多个氢原子可以被取代基取代。）
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Patent Agency Ranking
公开(公告)号：US11073958B2
公开(公告)日：2021-07-27
申请号：US16073665
申请日：2017-01-27
Applicant: SHARP KABUSHIKI KAISHA , TOPPAN FORMS CO., LTD.
Inventor： Shinji Yamagishi , Yasuhiro Sugita , Jean Mugiraneza , Yuki Owashi , Yoshitaka Kawanabe
Abstract: Provided is an antenna device that performs the reading of information via near field wireless communication by using a plurality of antenna patterns, and that has no insensitive area on the touch surface. An antenna device that reads information via near field wireless communication includes an antenna layer 20 that includes a plurality of antenna patterns 21a to 21l arrayed in parallel with one another, wherein at least a part of the antenna patterns 21a to 21l are arranged so as to overlap with one another when the antenna layer 20 is viewed in a plan view.
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公开(公告)号：US20180153034A1
公开(公告)日：2018-05-31
申请号：US15864301
申请日：2018-01-08
Applicant: Toppan Forms Co., Ltd.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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公开(公告)号：US09604489B2
公开(公告)日：2017-03-28
申请号：US14091911
申请日：2013-11-27
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Shogo Nakagawa , Norifumi Aizawa , Nobuyuki Saitou
CPC classification number: B42D15/025 , A45C11/182 , B42D15/085 , B65D73/0078
Abstract: A card enclosed unit has a card mount paper and a support mount paper adhered to each other. The card mount paper includes an upper paper and a lower paper. The card mount paper has a card. The card is separably enclosed in the card mount paper. The card is peelably adhered to support mount paper. A PIN code is indicated on the support mount paper side adhesion surface of the card, and a POS code is indicated on the support mount paper side adhesion surface of the card mount paper. The card mount paper has a hole such that the hole is facing the POS code.
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公开(公告)号：US20160286653A1
公开(公告)日：2016-09-29
申请号：US14778162
申请日：2014-03-27
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Akihito MORI
IPC: H05K1/18 , C09J169/00 , C09D11/52 , H05K3/32 , H05K1/09
CPC classification number: H05K1/181 , B32B15/00 , B32B2457/08 , C09D11/52 , C09J169/00 , H01L23/49883 , H01L2924/0002 , H05K1/09 , H05K1/092 , H05K1/097 , H05K3/105 , H05K3/1208 , H05K3/321 , H05K2201/06 , H05K2201/10636 , H05K2203/1157 , H05K2203/121 , Y02P70/611 , H01L2924/00
Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.
Abstract translation: 提供一种在基材上具有银层的层叠体，其中，银层包含粗糙度曲线的曲线满足以下条件（i）中的至少一个的表面，即，峰度的变化率为50％以下，高于或等于50％ 240小时后温度为85℃，相对湿度为85％的条件已经过去，条件（ii）在85℃的温度条件下，峰度的变化率大于等于200％ 经过480小时后的相对湿度为85％，并且通过导电接合部分将电子部件安装在层叠体的表面上的电路板。
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20.发明申请RADIO IC-MOUNTED ARTICLE, MANUFACTURING METHOD THEREFOR, AND MANAGEMENT METHOD FOR RADIO IC-MOUNTED ARTICLE 审中-公开无线电IC安装文章及其制造方法及无线电IC安装文章的管理方法公开(公告)号：US20150339567A1
公开(公告)日：2015-11-26
申请号：US14647746
申请日：2013-11-28
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Nobuyuki Hirasaki , Yuya Takahashi , Hitoshi Kagaya
IPC: G06K19/077 , H01Q1/22 , G06K7/10 , H01Q21/00
CPC classification number: G06K19/07794 , G06K7/10009 , G06K19/0723 , G06K19/07758 , H01Q1/2225 , H01Q9/26 , H01Q21/0087 , Y10T29/4902
Abstract: A radio IC-mounted article communicates in a microwave band or an ultrahigh frequency band, and is provided with: a substrate on which an IC chip and an antenna electrically connected to the IC chip are mounted; a first booster antenna electromagnetically coupled to the antenna; a second booster antenna electromagnetically coupled to the first booster antenna; and an article on which the substrate, the first booster antenna, and the second booster antenna are mounted.
Abstract translation: 无线IC安装物品在微波频带或超高频段中通信，并且设置有：其上安装IC芯片和与IC芯片电连接的天线的基板; 电磁耦合到天线的第一增强天线; 电磁耦合到第一增强天线的第二增强天线; 以及其上安装有基板，第一增强天线和第二增强天线的物品。
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