公开(公告)号：KR1020110012178A

公开(公告)日：2011-02-09

申请号：KR1020090069780

申请日：2009-07-30

Applicant: (주)파트론

Inventor： 김태일

IPC: G01C17/32 ,  G01C17/00

CPC classification number: G01C17/32 ,  G01R33/0206 ,  G01R33/025

Abstract: PURPOSE: An electronic compass package with a fluxgate device mounted by a flip bonding method and a manufacturing method thereof are provided to reduce the size of an electronic compass package using a bump ball. CONSTITUTION: An electronic compass package with a fluxgate device mounted by a flip bonding method comprises bumps. The bumps are formed in electric terminals of a x-axis fluxgate element(500), a y-axis fluxgate element(400), and a z-axis flux gate element(200). The bump is mounted in ball grid array. The bumps are electrically connected to each electric terminal of ASIC driver elements(300). The x-axis and y-axis fluxgate elements are horizontally installed on the top of the ASIC driver elements.

Abstract translation: 目的：提供一种通过翻转接合方法安装的磁通门装置及其制造方法的电子罗盘包，以减小使用凸珠球的电子罗盘包的尺寸。 构成：具有通过翻转接合方法安装的磁通门装置的电子罗盘包装件包括凸块。 凸起形成在x轴磁通门元件（500），y轴磁通门元件（400）和z轴磁通门元件（200）的电端子中。 凸块安装在球栅阵列中。 凸块电连接到ASIC驱动器元件（300）的每个电端子。 x轴和y轴磁通门元件水平安装在ASIC驱动器元件的顶部。

公开(公告)号：KR1020100132611A

公开(公告)日：2010-12-20

申请号：KR1020090051295

申请日：2009-06-10

Applicant: (주)파트론

Inventor： 김태일

IPC: G01C17/32 ,  H01L43/02

CPC classification number: G01C17/32 ,  G01R33/04 ,  H01L43/02

Abstract: PURPOSE: An electronic compass enclosed in a housing structure is provided to solve a problem that a z-axis flux gate device is fallen due to weak impact which is generated when the z-axis flux gate device is tilted. CONSTITUTION: An electronic compass having housing structure enclosed therein is comprised of a thin film type 3-axes fluxgate and a housing(100). The magnetic field from three directions is detected through the thin film type 3-axes fluxgate. The housing accommodates an x-axis flux gate device(250), an y-axis flux gate device(270), a z-axis flux gate device(210), and ASIC driver component(230). The ASIC driver component runs each flux gate device. A cavity having a certain level is recessed in the housing.

Abstract translation: 目的：提供一种封闭在外壳结构中的电子罗盘，用于解决z轴磁通门装置由于z轴磁通门装置倾斜时产生的弱冲击而下降的问题。 构成：其中包含壳体结构的电子罗盘包括薄膜型3轴磁通门和壳体（100）。 通过薄膜型3轴磁通门检测来自三个方向的磁场。 壳体容纳x轴磁通门装置（250），y轴磁通门装置（270），z轴磁通门装置（210）和ASIC驱动器部件（230）。 ASIC驱动器组件运行每个磁通门装置。 具有一定水平面的空腔凹进壳体。

公开(公告)号：KR1020100114155A

公开(公告)日：2010-10-25

申请号：KR1020090032549

申请日：2009-04-15

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  장한성

IPC: G01C17/32 ,  H01L21/64

CPC classification number: G01C17/32 ,  G01R33/04 ,  H01L21/64 ,  H01L23/48 ,  H01L2224/48137

Abstract: PURPOSE: An electron compass with a flux gate device, and a manufacturing method thereof are provided to improve the reliability of a bonding pad thin film. CONSTITUTION: An electron compasses with a flux gate device comprises follows. An z-axis fluxgate sensor is equipped on a single board with fixed size. The first electrical terminal of a single board and a terminal which is arranged on the z-axis fluxgate sensor are electrically connected with one another. A base substrate(210) of the electron compass is vertically mounted on a z-axis flux gate device(100). The first electrical terminal with fixed length is formed at end of a single board.

Abstract translation: 目的：提供具有磁通门装置的电子罗盘及其制造方法，以提高焊盘薄膜的可靠性。 构成：具有磁通门装置的电子罗盘包括如下。 z轴磁通门传感器配有固定尺寸的单板。 布置在z轴磁通门传感器上的单板和端子的第一电端子彼此电连接。 电子罗盘的基底（210）垂直地安装在z轴磁通门装置（100）上。 具有固定长度的第一个电气端子形成在单板的端部。

公开(公告)号：KR1020090057522A

公开(公告)日：2009-06-08

申请号：KR1020070124134

申请日：2007-12-03

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  전문수

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H05K13/0015 ,  H05K13/0023

Abstract: A method for manufacturing a package on a camera module by using a PCB(Printed Circuit Board) panel and the PCB panel thereof are provided to lower manufacturing cost by removing an outer shape processing process and increase manufacturing efficiency per PCB panel by increasing cutting precision. One unit substrate array is formed by vertically arranging a plurality of unit boards including a circuit pattern on a PCB. A PCB panel is manufactured by horizontally arranging the unit substrate arrays. A part between the neighboring unit substrate arrays is cut by using a dicing saw(S130). A package array is formed by mounting the part for forming a camera module on each unit substrate of the PCB panel(S160). Each package is separated by cutting the neighboring packages(S170).

Abstract translation: 提供了通过使用PCB（印刷电路板）面板及其PCB面板在相机模块上制造封装的方法，通过去除外形加工工艺降低制造成本，并通过提高切割精度提高每个PCB面板的制造效率。 通过在PCB上垂直布置包括电路图案的多个单元板来形成一个单位衬底阵列。 通过水平布置单元基板阵列来制造PCB面板。 通过使用切割锯切割相邻单元基板阵列之间的部分（S130）。 通过将用于形成相机模块的部件安装在PCB面板的每个单位基板上（S160）来形成封装阵列。 通过切割相邻的包装来分离每个包装（S170）。

公开(公告)号：KR102114699B1

公开(公告)日：2020-05-25

申请号：KR1020180067322

申请日：2018-06-12

Applicant: (주)파트론

Inventor： 김태일 ,  김현 ,  김영문 ,  서화범

IPC: H01L31/0203 ,  H01L31/08 ,  H01L31/048

公开(公告)号：KR101993898B1

公开(公告)日：2019-06-27

申请号：KR1020170065897

申请日：2017-05-29

Applicant: (주)파트론

Inventor： 김종태 ,  김태일

IPC: G03B17/12 ,  G02B5/28 ,  H04N5/225

公开(公告)号：KR101872758B1

公开(公告)日：2018-07-31

申请号：KR1020170141061

申请日：2017-10-27

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  김현 ,  김영문

IPC: H05K1/02 ,  H04N5/225

CPC classification number: H05K1/0271 ,  H04N5/225

Abstract: 본발명은카메라모듈에관한것으로서, 상기카메라모듈은전자부품과패턴이형성되는인쇄회로기판, 상기인쇄회로기판의한 면에상기인쇄회로기판과접착되게위치하고, 상기인쇄회로기판과접착되는면의반대편에위치하는면은검은색을띄고있는평탄부, 및상기평탄부위에장착되어있는이미지센서를포함한다.

公开(公告)号：KR1020110131606A

公开(公告)日：2011-12-07

申请号：KR1020100051133

申请日：2010-05-31

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  김형주

IPC: G06F3/0354 ,  G06F3/042

CPC classification number: G06F3/042 ,  G06F3/0354 ,  G06F2203/04103

Abstract: PURPOSE: An ultra thin optical input device is provided to apply an ultra input device to various portable devices by reducing the thickness of an optical input device. CONSTITUTION: An optical function unit is inserted inside a cover and includes an optical filter(122) which selectively penetrates light according to wavelength. A lens structure(130) penetrates light which penetrating the optical filter and performs a light condensing function. A light blocking unit(140) blocks the light which penetrates the lens structure. The circuit board includes an optical sensor(152) sensing the light.

Abstract translation: 目的：提供超薄光输入设备，通过减小光输入设备的厚度，将超输入设备应用于各种便携式设备。 构成：光学功能单元插入到盖子内，并包括选择性地穿透根据波长的光的滤光器（122）。 透镜结构（130）穿透穿过滤光器的光并执行聚光功能。 遮光单元（140）阻挡穿透透镜结构的光。 电路板包括感测光的光学传感器（152）。

公开(公告)号：KR1020100125557A

公开(公告)日：2010-12-01

申请号：KR1020090044323

申请日：2009-05-21

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  전문수

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H04N5/2257 ,  H04N5/33

Abstract: PURPOSE: A small sized camera module is provided to simply insert a lens assembly into a housing holder by means of a groove protrusion, thereby simplifying a manufacturing process to reduce manufacturing costs and manufacturing time. CONSTITUTION: A lens assembly(120) is loaded on a substrate. A housing holder(130) is mounted on the substrate. A penetration opening is formed in the housing holder and part of the lens assembly is inserted into the penetration opening to support the lens assembly. A protrusion part is formed in an end of the lens assembly.

Abstract translation: 目的：提供一种小尺寸相机模块，以便通过凹槽突出部将透镜组件简单地插入外壳固定器中，从而简化制造过程以降低制造成本和制造时间。 构成：将透镜组件（120）装载在基板上。 壳体保持器（130）安装在基板上。 在壳体保持器中形成穿透开口，并且透镜组件的一部分插入到穿透开口中以支撑透镜组件。 突出部形成在透镜组件的一端。