公开(公告)号：KR1020060003888A

公开(公告)日：2006-01-11

申请号：KR1020057019889

申请日：2004-04-20

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 아사쿠라겐타로

IPC: H01L21/68

CPC classification number: H01L21/68742 ,  H01L21/67069

Abstract: A device for applying a semiconductor treatment to a treatment subject substrate (W) includes a lifting mechanism (48) disposed on a table (38) for assisting in delivering the treatment subject substrate. The lifting mechanism includes lifter pins (51) for supporting and lifting/lowering the treatment subject substrate, and guide holes (49) for guiding the lifting/lowering movement of the lifter pins. Each guide hole comprises a main hole portion (49a) extending from the upper surface to the lower surface and through the table, and an extension hole portion (49b) extending into an extension sleeve (66) projecting downward from the lower surface of the table correspondingly to the main hole portion.

Abstract translation: 用于将半导体处理应用于处理对象基板（W）的装置包括设置在桌子（38）上用于辅助输送处理对象基板的提升机构（48）。 提升机构包括用于支撑和提升/降低处理对象基板的升降销（51）和用于引导提升销的升降运动的导向孔（49）。 每个导孔包括从上表面延伸到下表面并穿过工作台的主孔部分（49a）和延伸到从桌子的下表面向下突出的延伸套筒（66）的延伸孔部分（49b） 对应于主孔部分。