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公开(公告)号：KR1020090072561A
公开(公告)日：2009-07-02
申请号：KR1020070140714
申请日：2007-12-28
Applicant: 삼성전기주식회사
IPC: H02M3/28 , H02M7/5387
Abstract: An interleaved type converter is provided to reduce a circuit dimension and a manufacturing cost by preventing a ripple voltage of an output power source. An interleaved type converter(100) includes a first DC/DC converting circuit(110), a second DC/DC converting circuit(120), and a control part(130). The first DC/DC converting circuit converts an input DC power into a first output DC power. The first DC/DC converting circuit has an inductor(Lr) for resonance and a DC blocking capacitor(Cr). The second DC/DC converting circuit converts the input DC power into a second output DC power, and delivers the second output DC power to a first output DC power terminal. The control part controls switching of the second DC/DC converting circuit according to a phase difference between a current of the inductor for resonance and a voltage charged in the DC blocking capacitor.
Abstract translation: 提供交错型转换器，以通过防止输出电源的纹波电压来减小电路尺寸和制造成本。 交错型转换器（100）包括第一DC / DC转换电路（110），第二DC / DC转换电路（120）和控制部分（130）。 第一DC / DC转换电路将输入DC电力转换为第一输出DC电力。 第一DC / DC转换电路具有用于谐振的电感器（Lr）和隔直流电容器（Cr）。 第二DC / DC转换电路将输入的DC电力转换为第二输出DC电力，并将第二输出DC电力传送到第一输出DC电源端子。 控制部根据用于谐振的电感器的电流和在直流阻塞电容器中充电的电压之间的相位差来控制第二DC / DC转换电路的开关。
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公开(公告)号：KR1020140057431A
公开(公告)日：2014-05-13
申请号：KR1020120122296
申请日：2012-10-31
Applicant: 삼성전기주식회사
Inventor： 이강현
IPC: G01R31/26 , H01L21/677
CPC classification number: G01R31/2603 , H01L21/67333 , H01L21/67356 , H01L21/67379 , H01L21/67721
Abstract: The present invention relates to a semiconductor package accommodating tube which is integrally formed with a stopper. According to an embodiment of the present invention to this end, the semiconductor package accommodating tube may include an accommodating unit formed in a tubular shape and accommodating at least one semiconductor package therein; and the stopper formed on at least one step of the accommodating unit and formed by bending and deforming a portion of the accommodating unit.
Abstract translation: 本发明涉及与止动器一体形成的半导体封装容纳管。 根据本发明的实施例，为此，半导体封装容纳管可以包括形成为管状的容纳单元，并容纳至少一个半导体封装; 并且所述止动件形成在所述容纳单元的至少一个台阶上并且通过使所述容纳单元的一部分弯曲和变形而形成。
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公开(公告)号：KR102248525B1
公开(公告)日：2021-05-06
申请号：KR1020150183795
申请日：2015-12-22
Applicant: 삼성전기주식회사
IPC: H01L25/07 , H01L25/065 , H01L23/31 , H01L23/48 , H01L23/522 , H01L21/304
Abstract: 본발명의일 실시예에따른전자소자모듈의제조방법은, 기판을준비하는단계; 기판의일면에적어도하나의제1 전자소자를실장하는단계; 상기제1 전자소자를덮는제1 몰드부를형성하는단계; 상기제1 몰드부를관통하는비아홀과, 상기제1 몰드부를관통하는비아홀과, 상기비아홀로부터연장되어상기제1 몰드부의표면에형성되는홈부에도전성물질을충전하여도전성비아와회로패턴을형성하는단계; 상기회로패턴과접속된제2 전자소자를실장하는단계; 및상기제2 전자소자를덮는제2 몰드부를형성하는단계;를포함한다.
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公开(公告)号：KR1020160044953A
公开(公告)日：2016-04-26
申请号：KR1020140140086
申请日：2014-10-16
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/16225 , H01L2224/73253 , H01L2924/19105 , H01L23/04 , H01L25/0652 , H01L25/0655
Abstract: 본발명의반도체패키지모듈은기판에탑재되는하나이상의전자부품; 상기전자부품을내부에수용한상태로상기기판에탑재되는쉴드캔; 및상기전자부품과상기쉴드캔 사이에배치되어상기쉴드캔의휨 변형에의한충격을흡수하도록구성되는완충부재;를포함한다.
Abstract translation: 本发明的半导体封装模块包括安装在基板上的至少一个电子部件; 屏蔽罩可以安装在基板上，而屏蔽件可以容纳电子部件; 并且布置在电子部件和屏蔽罩之间的缓冲部件可以吸收由于屏蔽罐的翘曲变形引起的冲击。 因此，能够使电子部件与屏蔽体之间的碰撞最小化。
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公开(公告)号：KR1020150039402A
公开(公告)日：2015-04-10
申请号：KR1020130117930
申请日：2013-10-02
Applicant: 삼성전기주식회사
CPC classification number: H05K1/09 , H01L23/3121 , H01L23/3128 , H01L23/5384 , H01L23/5385 , H01L25/0655 , H01L2224/16225 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , Y10T29/49155
Abstract: 본발명의일 실시예에따른외부접속단자부, 이를이용한반도체패키지및 그제조방법에관한것이다. 외부접속단자부는내부절연제, 상기내부절연제를감싸도록형성된외부절연제및 상기내부절연제와외부절연제사이에형성된금속선을포함한다.
Abstract translation: 本发明的一个实施例涉及外部连接端子，使用其的半导体封装及其制造方法。 外部连接端子包括内部绝缘体，围绕内部绝缘体的外部绝缘体以及形成在内部绝缘体和外部绝缘体之间的金属线。
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Patent Agency Ranking
公开(公告)号：KR1020150035251A
公开(公告)日：2015-04-06
申请号：KR1020130115581
申请日：2013-09-27
Applicant: 삼성전기주식회사
IPC: H01L23/48
CPC classification number: H01L23/482 , H01L23/295 , H01L23/49811 , H01L24/16 , H01L24/29 , H01L25/0652 , H01L25/0655 , H01L25/16 , H01L2224/16225 , H01L2224/81447 , H01L2924/01322 , H01L2924/12042 , H01L2924/1531 , H01L2924/181 , H01L2924/19106 , H05K1/0366 , H05K1/141 , H05K3/181 , H05K2201/0275 , H05K2201/049 , H01L2924/00 , H01L2924/00014
Abstract: 본발명은외부접속단자부와외부접속단자부를갖는반도체패키지및 그들의제조방법에관한것이다. 본발명에따른외부접속단자부는절연재및 절연재양면에형성된금속도금패턴을포함한다.
Abstract translation: 本发明涉及具有外部连接端子的外部连接端子和半导体封装及其制造方法。 根据本发明，外部连接端子包括在绝缘材料两侧的绝缘材料和金属电镀图案。
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公开(公告)号：KR1020150034489A
公开(公告)日：2015-04-03
申请号：KR1020130114637
申请日：2013-09-26
Applicant: 삼성전기주식회사
Abstract: 본발명의마이크로폰패키지는하나이상의홈이형성되는기판유닛; 상기기판에장착되는마이크로폰유닛; 및상기홈에형성되는전극패드와연결되는쉴드캔 유닛;을포함할수 있다.
Abstract translation: 本发明的麦克风封装包括：形成至少一个凹槽的基片单元; 安装在基板上的麦克风单元; 以及与形成在槽上的电极焊盘连接的屏蔽罐单元。
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公开(公告)号：KR1020140055048A
公开(公告)日：2014-05-09
申请号：KR1020120121312
申请日：2012-10-30
Applicant: 삼성전기주식회사
Inventor： 이강현
CPC classification number: H01L21/67333 , B65D2585/86
Abstract: The present invention relates to a tube for storing a semiconductor package wherein a stopper and a tube are integrated. The tube for storing a semiconductor package, according to an embodiment of the present invention, includes: a storage part having a tube shape for storing at least one semiconductor package inside; and a stopper formed on at least one end of the storage part, and wherein the severed portion of the storage part is bent.
Abstract translation: 本发明涉及一种用于存储半导体封装的管，其中止动器和管被集成。 根据本发明的实施例的用于存储半导体封装的管包括：具有用于在其中存储至少一个半导体封装的管形状的存储部分; 以及形成在所述收纳部的至少一端的止动部，并且所述收容部的所述切断部弯曲。
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19.发明授权
公开(公告)号：KR100985566B1
公开(公告)日：2010-10-05
申请号：KR1020080076335
申请日：2008-08-05
Applicant: 삼성전기주식회사
IPC: H02M3/335
Abstract: 본 발명에 따른 교류 입력 전원에 연결된 역률 보상 회로와 DC/DC 컨버터로 이루어진 분산 전력 시스템의 홀드-업 타임 만족을 위한 홀드-업 타임 보조 회로는, 상기 DC/DC 컨버터의 입력단에 연결된 제 1 보조 스위치; 상기 제 1 보조 스위치에 연결된 제 2 보조 스위치; 상기 제 1 보조 스위치와 상기 제 2 보조 스위치가 연결되는 접점에 연결된 보조 변압기;를 포함할 수 있다.
분산 전력 시스템, 역률 보상 회로, 홀드-업 타임, DC/DC 컨버터, 시비율-
公开(公告)号：KR1020100016733A
公开(公告)日：2010-02-16
申请号：KR1020080076335
申请日：2008-08-05
Applicant: 삼성전기주식회사
IPC: H02M3/335
CPC classification number: H02M3/33569 , H02M2001/0096
Abstract: PURPOSE: An auxiliary circuit for hold-up time is provided to reduce a first side current stress and a second side voltage stress and to reduce the size and the loss of an output inductor due to a reduction of an output inductance. CONSTITUTION: A first auxiliary switch(Sa) is connected to an input end of a dc/dc converter. A second auxiliary switch(Sb) is connected to the first auxiliary switch. An auxiliary transformer(Taux) is connected to a contact point connecting the first auxiliary switch and the second auxiliary switch.
Abstract translation: 目的：提供用于保持时间的辅助电路，以减少第一侧电流应力和第二侧电压应力，并且由于输出电感的减小而减小输出电感器的尺寸和损耗。 构成：第一个辅助开关（Sa）连接到直流/直流转换器的输入端。 第二辅助开关（Sb）连接到第一辅助开关。 辅助变压器（Taux）连接到连接第一辅助开关和第二辅助开关的接触点。
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