公开(公告)号：KR100678475B1

公开(公告)日：2007-02-02

申请号：KR1020050021995

申请日：2005-03-16

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/304 ,  H01L21/68

Abstract: 본 발명은 웨이퍼 세정용 보트에 관한 것으로서, 복수매의 웨이퍼가 적재되도록 다수의 안착판이 형성된 복수개의 로드와, 로드들 내부에 형성된 가스공급유로와, 가스공급유로와 연통되고, 웨이퍼 상에 필터링된 세정가스를 분사할 수 있도록 안착판 선단부에 형성된 가스분사구와, 가스공급유로와 연결되어 세정가스를 공급하는 가스공급부를 포함함으로써, 복수매의 웨이퍼를 보트에 적재시킨 상태에서 잔류가스로 인해 이물질이 웨이퍼 표면에 응착되는 것을 보트 자체 내에서 세정시킴으로써 제품 수율을 향상시키고, 후속공정 진행시 정상적인 공정이 이루어질 수 있도록 할 수 있다.

公开(公告)号：KR1020070005224A

公开(公告)日：2007-01-10

申请号：KR1020050060412

申请日：2005-07-05

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/02

Abstract: A process chamber of semiconductor manufacturing equipment is provided to prevent the generation of arcing due to the exposure of a screw by insulating the screw from a plasma power using an improved cap made of ceramics. A process chamber of semiconductor manufacturing equipment includes a body. The body(110) is used for defining an inner space capable of performing a predetermined treatment on a semiconductor substrate. The body is fixed by using at least one or more screws, wherein at least a portion of each screw is exposed to the outside. The exposed portion of the screw is covered with a predetermined cap(240). The predetermined cap is made of ceramics.

Abstract translation: 提供了一种半导体制造设备的处理室，用于通过使用由陶瓷制成的改进的盖将绝缘螺钉与等离子体电源绝缘而防止由于螺钉的暴露而产生电弧。 半导体制造设备的处理室包括主体。 主体（110）用于限定能够对半导体基板执行预定处理的内部空间。 使用至少一个或多个螺钉固定主体，其中每个螺钉的至少一部分暴露于外部。 螺钉的暴露部分被预定的盖（240）覆盖。 预定的盖子由陶瓷制成。

公开(公告)号：KR1020070001681A

公开(公告)日：2007-01-04

申请号：KR1020050057292

申请日：2005-06-29

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/3065

CPC classification number: H01J37/18 ,  H01J37/32513 ,  H01L21/67069

Abstract: Semiconductor manufacture equipment is provided to reduce the number of components by using an end cap for encapsulating a mounting hole on a component mounting port. A process chamber(110) is provided with a component mounting port. The component mounting port includes a plurality of mounting holes(121,122,123,124) for mounting external components. An end cap(140) for encapsulating the mounting hole is coupled to the process chamber to encapsulate each of the mounting holes. The end cap is comprised of a hole inserting unit which is inserted into the mounting hole and a chamber coupling unit which is coupled to the process chamber. A sealing member is arranged between the process chamber and the end cap.

Abstract translation: 提供半导体制造设备以通过使用用于将安装孔封装在部件安装端口上的端盖来减少部件的数量。 处理室（110）设有元件安装口。 部件安装端口包括用于安装外部部件的多个安装孔（121,122,123,124）。 用于封装安装孔的端盖（140）联接到处理室以封装每个安装孔。 端盖包括插入安装孔的孔插入单元和联接到处理室的室联接单元。 密封构件设置在处理室和端盖之间。

公开(公告)号：KR1020060130967A

公开(公告)日：2006-12-20

申请号：KR1020050050729

申请日：2005-06-14

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/3065

CPC classification number: H01L21/68742 ,  H01J37/32862 ,  H01L21/67069

Abstract: A semiconductor fabricating apparatus is provided to shorten a cleaning time by separating a lift hoop formed in a nipper shape from a lifter, thereby increasing productivity. A reaction chamber(110) provides a sealed space in which a semiconductor fabricating process is performed by using plasma reaction. An electrostatic chuck(112) supports a wafer which is subjected to the semiconductor fabricating process in a lower end of the reaction chamber. Plural pins(114) are moved up to separate the wafer from the electrostatic chuck in a horizontal state. A lifter(116) supports the electrostatic chuck. A lift hoop(118) supports the lift pins formed around the lifter.

Abstract translation: 提供一种半导体制造装置，通过将从钳子形成的提升环与升降机分开来缩短清洁时间，从而提高生产率。 反应室（110）提供通过使用等离子体反应进行半导体制造工艺的密封空间。 静电卡盘（112）在反应室的下端支撑经受半导体制造工艺的晶片。 多个销（114）向上移动以将晶片与静电卡盘分离成水平状态。 升降器（116）支撑静电卡盘。 升降环（118）支撑在升降机周围形成的升降销。

公开(公告)号：KR100648261B1

公开(公告)日：2006-11-23

申请号：KR1020040064404

申请日：2004-08-16

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/68

CPC classification number: H01L21/67201

Abstract: 본 발명은 로드락 모듈에 관한 것으로, 웨이퍼를 수용하는 챔버; 상기 챔버 내부로 퍼징 가스를 안내하는 퍼징 가스 공급관; 상기 챔버 내부로 공급된 퍼징 가스를 흡입하여 외부로 배출하는 배기구; 및 상기 퍼징 가스 공급관으로부터 공급받은 퍼징 가스를 상기 챔버 내부에 수용된 웨이퍼의 전체 표면을 향해 분사하는 퍼징 가스 분사부를 포함하는 것을 특징으로 한다. 본 발명에 의하면, 개선된 필터를 이용함으로써 웨이퍼 퓸을 충분히 배출할 수 있게 된다. 따라서, 웨이퍼 퓸에 의한 설비의 부식 문제가 해결됨으로써 설비의 수명 및 가동률을 높일 수 있고, 프론트 엔드 모듈의 청정도를 더욱 더 향상시킬 수 있다.

公开(公告)号：KR1020030046979A

公开(公告)日：2003-06-18

申请号：KR1020010077326

申请日：2001-12-07

Applicant: 삼성전자주식회사

Inventor： 최성석 ,  김용대 ,  이재생

IPC: H01L21/00

Abstract: PURPOSE: A semiconductor manufacturing equipment having a chamber lifting apparatus is provided to be capable of quickly and securely disassembling the semiconductor manufacturing equipment by lifting a heavy weight chamber. CONSTITUTION: A semiconductor manufacturing equipment(100) is provided with a load-lock chamber(110) for loading wafers(40), a process chamber(150) for carrying out a main process on the wafer, a buffer chamber(130) located between the load-lock chamber and the process chamber, and a chamber lifting apparatus(170) for lifting a heavy weight DTCU(Dome Temp Control Unit) chamber(152) when disassembling the semiconductor manufacturing equipment. The buffer chamber further includes a wafer transfer robot(135) for transferring the wafer from the load-lock chamber to the process chamber. The chamber lifting apparatus further includes a wire(178) for holding the heavy weight DTCU chamber, a driving motor(172) connected to the wire for controlling the wire, and a controller(175) for controlling the driving motor.

Abstract translation: 目的：提供一种具有室提升装置的半导体制造设备，能够通过提升重物室快速且可靠地拆卸半导体制造设备。 构成：半导体制造设备（100）设置有用于装载晶片（40）的加载锁定室（110），用于在晶片上执行主处理的处理室（150），位于 以及用于在拆卸半导体制造设备时提升重型DTCU（球顶温度控制单元）室（152）的室提升装置（170）。 缓冲室还包括用于将晶片从负载锁定室传送到处理室的晶片传送机器人（135）。 室提升装置还包括用于保持重型DTCU室的线（178），连接到用于控制线的线的驱动电机（172）和用于控制驱动电机的控制器（175）。

公开(公告)号：KR1019990016403A

公开(公告)日：1999-03-05

申请号：KR1019970038933

申请日：1997-08-14

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/68

Abstract: 본 발명은 비틀림이 방지된 이송부를 갖는 핸들러에 관한 것으로서, 헨들러의 이송부가 공급부에 튜브를 적재시키기 위해 가이트 판쪽으로 이동시, 이송부가 하나의 실린더만으로 기계적으로 연결되어 이동되기 때문에 이송부의 타측에는 힘의 불균형이 발생하고, 결국 이송부의 틀어짐이 발생한다. 이를 방지하기 위하여, 이송부 하부의 양쪽 요홈부에 각각 로드레스 실린더를 기계적으로 연결시키고, 각각의 로드레스 실린더를 하나의 공기 공급관에 의해서 균등하게 힘을 받도록 함으로써, 이송부의 틀어짐없이 이송부를 가이트 판으로 이동시킬 수 있게 되고, 공급부에 튜브를 정확하게 적재할 수 있게 된다.

公开(公告)号：KR1020060128082A

公开(公告)日：2006-12-14

申请号：KR1020050048950

申请日：2005-06-08

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/68 ,  H01L21/30

CPC classification number: H01L21/67265 ,  B25J11/0095 ,  H01L21/67742

Abstract: An assembly for moving work pieces linearly and a semiconductor wafer mapping device with the same are provided to reduce manufacturing costs of a wafer mapping device by preventing a wrong operation and an operation stop of the wafer mapping device. A semiconductor wafer mapping device includes a bar shaped rod(410). The bar shaped rod penetrates a rod block(420). The rod block has a hole, which is formed corresponding to a shape of the rod, and moves along the rod. A mapping arm(460) engages with the rod block. A sensor is installed at an end of the mapping arm and discriminates whether or not a wafer is present. The rod and the rod block have an ellipsoid or polygon shape. A hole is formed inside the rod and a rod magnet having magnetism moves through the hole. The rod magnet moves in the rod by a driver(440). The rod block and the rod are connected to each other by magnetic force.

Abstract translation: 提供一种线性移动工件的组件和具有该组件的半导体晶片映射装置，以通过防止晶片映射装置的错误操作和操作停止来降低晶片映射装置的制造成本。 半导体晶片映射装置包括棒状棒（410）。 棒状杆穿过杆块（420）。 杆块具有对应于杆的形状形成的孔，并且沿杆移动。 测绘臂（460）与杆块接合。 传感器安装在映射臂的一端，并辨别晶片是否存在。 杆和杆块具有椭圆形或多边形形状。 在杆内部形成孔，具有磁性的杆状磁体通过该孔移动。 杆状磁体通过驱动器（440）在杆中移动。 杆块和杆通过磁力彼此连接。

公开(公告)号：KR1020060114980A

公开(公告)日：2006-11-08

申请号：KR1020050037229

申请日：2005-05-03

Applicant: 삼성전자주식회사

Inventor： 김용대

IPC: H01L21/02 ,  H01L21/30

CPC classification number: H01L21/67069 ,  H01L21/3065 ,  H01L21/67739 ,  H01L21/67742

Abstract: An etching method and an etching apparatus for manufacturing a semiconductor device are provided to enhance a manufacturing yield of the semiconductor device by preventing the semiconductor device from being contaminated by fumes from a wafer during a large-size wafer dry-poly etching process. An etching apparatus for manufacturing a semiconductor device includes a container(110), a substrate processor(165), and a substrate transfer module(105). The container is arranged to contain plural substrates therein. The substrate processor includes at least one process chamber, which processes the substrate. The substrate transfer module transfers the substrates from the container to the substrate processor. The substrate transfer module also transfers the processed substrates from the process chamber to the container. The substrate transfer module transfers the substrates from the container according to a top-to-bottom scheme.

Abstract translation: 提供一种用于制造半导体器件的蚀刻方法和蚀刻装置，以通过在大尺寸晶片干 - 多晶蚀刻工艺期间防止半导体器件被来自晶片的烟雾污染来提高半导体器件的制造成品率。 用于制造半导体器件的蚀刻装置包括容器（110），衬底处理器（165）和衬底转移模块（105）。 容器被布置成在其中容纳多个基板。 衬底处理器包括处理衬底的至少一个处理室。 基板转移模块将基板从容器传送到基板处理器。 衬底转移模块还将经处理的衬底从处理室传送到容器。 衬底转移模块根据顶部到底部的方案从容器传送衬底。

公开(公告)号：KR1020030042156A

公开(公告)日：2003-05-28

申请号：KR1020010072691

申请日：2001-11-21

Applicant: 삼성전자주식회사

Inventor： 윤명식 ,  김용대 ,  황완구 ,  이재생

IPC: H01L21/68

Abstract: PURPOSE: An apparatus for loading/unloading a substrate is provided to prevent the second supporting member and the members for fixing the second supporting member from being corroded by making the second supporting member, a bracket for fixing the second supporting member and a bolt formed of aluminum in which an aluminum oxide layer is formed through an anodizing process. CONSTITUTION: The first supporting member(102) supports a cassette containing a plurality of semiconductor substrates when the semiconductor substrates are loaded/unloaded into/from a loadlock chamber installed in an apparatus for processing the semiconductor substrate. The second supporting member(104) supports the cassette, vertically installed in a side of the first supporting member. The bracket(106) fixes the first and second supporting members. The aluminum oxide layer is formed on the surface of the second supporting member and the bracket through an anodizing process so that the corrosion of the second supporting member and the bracket caused by corrosive gas is controlled when the substrate is processed.

Abstract translation: 目的：提供一种用于装载/卸载基板的装置，以防止第二支撑构件和用于固定第二支撑构件的构件被制造第二支撑构件而被腐蚀，用于固定第二支撑构件的支架和由 铝，其中通过阳极氧化工艺形成氧化铝层。 构成：当半导体衬底被加载/卸载到安装在用于处理半导体衬底的设备的装载锁定室中时，第一支撑构件（102）支撑包含多个半导体衬底的盒。 第二支撑构件（104）支撑竖直地安装在第一支撑构件的一侧的盒。 支架（106）固定第一和第二支撑构件。 氧化铝层通过阳极氧化处理形成在第二支撑构件和支架的表面上，使得当处理基板时，控制由腐蚀性气体引起的第二支撑构件和支架的腐蚀。