Abstract:
본 발명은 발광 다이오드 패키지 및 그 제조방법에 관한 것으로서, 특히, 형광체 기판과, 상기 형광체 기판 상에 실장된 LED 칩과, 상기 LED 칩이 실장된 영역을 제외한 영역의 상기 형광체 기판 상에 실장된 회로 기판과, 상기 LED 칩과 상기 회로 기판의 통전을 위한 전극 연결부 및 상기 LED 칩과 회로 기판 및 형광체 기판을 덮는 봉지재를 포함하는 발광 다이오드 패키지를 제공한다. 또한, 본 발명은 상기 발광 다이오드 패키지의 제조방법을 제공한다. 발광다이오드, 패키지, 형광체, 박형화
Abstract:
PURPOSE: A light source module, a backlight unit, a display apparatus and a television set are provided to easily replace a light source part and to facilitate the maintenance of the light source part. CONSTITUTION: A plastic chassis(102) includes at least one through hole. At least one optical source part(101) is mounted on the through hole. At least one optical source part includes a light emitting device. The light emitting device emits light as an electric signal is supplied to the light emitting device. An optical device(103) is arranged in the upper part of the optical source part.
Abstract:
본 발명은 배터리팩이 장착 가능한 컴퓨터시스템 및 그 시스템본체에 관한 것이다. 컴퓨터시스템은, 적어도 하나의 배터리셀과, 상기 배터리셀의 온도를 감지하는 온도감지부를 포함하는 배터리팩과; 상기 배터리셀로부터 동작전원을 공급받아 동작을 수행하는 시스템부와, 상기 온도감지부와 연결되어, 상기 온도감지부에 의해 감지되는 상기 배터리셀의 온도를 평가하는 평가회로와, 상기 평가회로에 의해 평가되는 상기 배터리셀의 온도가 소정치 이상인 경우, 시스템보호제어를 수행하는 시스템제어부를 포함하는 시스템본체를 포함한다. 이에 의하여, 배터리팩에서 발생하는 열에 대하여 보다 높은 신뢰성으로 시스템보호제어를 수행할 수 있다. 배터리, 온도, 보호
Abstract:
PURPOSE: A light source module, a backlight unit, a display apparatus, a television set and an illumination apparatus are provided to reduce an optical distance by using a light module including an optical sheet and to reduce the number of a light source. CONSTITUTION: A first optical sheet(103) is arranged in the upper part of a light source unit(101). The first optical sheet includes a first and a second main surface. The first support portion(103a) is extended from the first main surface. The first support portion or an additional support structure supports the first optical sheet. A second optical sheet(104) is arranged in the second main surface. The second support portion(103b) is extended from the second main surface. The second support portion or other additional support structure supports the second optical sheet.
Abstract:
PURPOSE: A method for managing communication of a dual standby mobile terminal and a system thereof are provided to enable a user to check a list and information of a call connection request by another telecommunication network later while communicating by a telecommunication network. CONSTITUTION: When a communication traffic with one of communication networks(210,220), a mobile terminal(100) transmits a hold signal to the other communication networks. The other communication networks receive the hold signal. The other communication networks control communication connection to the mobile terminal.
Abstract:
PURPOSE: A coverage apparatus and method for testing a multithread environment are provided to schedule the execution sequence of threads including synchronization blocks, to execute a plurality of threads in order that the execution of synchronization block is collided, and to perform the coverage of a corresponding application. CONSTITUTION: A synchronization block searcher(110) searches synchronization blocks. A scheduling unit(120) compulsorily schedules the execution sequence of threads including the synchronization block and makes the execution of the synchronization block colliding. A coverage performing unit(130) performs the coverage of a corresponding application. A controller(140) decides whether to continue or terminate the performance of the coverage of the application with the analysis of a coverage performance result.
Abstract:
PURPOSE: An instrumentation executing device and method are provided to add wanted operation to an execution program and to enable the execution of an executive program using hardware. CONSTITUTION: A code converter(112) sets an instrumentation bit to an instruction to be execute the instrumentation and also sets the address of a branched memory for executing an instrumentation code. The instrumentation bit represents the instruction to be executed. A register(116) stores the address of the memory to be branched. A controller(114) fetches the instruction. If the instrumentation bit is set to the fetched instruction, the controller branches to the address of the memory to be executed and the instrumentation code is executed.
Abstract:
PURPOSE: A light emitting diode device, a light emitting apparatus and a manufacturing method of the light emitting diode device are provided to minimize the distribution of a light emitting diode by applying a wavelength converting unit according to a light emitting diode having various properties. CONSTITUTION: In a light emitting diode device, a light emitting apparatus and a manufacturing method of the light emitting diode device, a wavelength converter(102) changes the wave length of light emitted from a light emitting diode chip(101). The wavelength converter covers the first side and side of the light emitting diode chip. First and second electrical connection units(104a,104b) are connected to first and second electrodes(103a,103b). The first and second electrical connection unit comprise a plating layer respectively. The first and second electrical connection unit are exposed from the wavelength converter.
Abstract:
전류 소비를 최소화하기 위한 블루투스모듈을 구비한 휴대용 단말기와 블루투스 액세스 포인트 간의 통신 연결 방법이 개시된다. 블루투스모듈을 구비한 휴대용 단말기와 무선망과 유선 망 간에 통신인터페이스를 제공하는 블루투스 액세스 포인트 간의 통신 연결방법은, 상기 휴대용 단말기가 설정된 주기마다 상기 블루투스 액세스 포인트로 연결을 요청하는 과정과; 상기 연결요청 이후 설정된 대기시간 동안 상기 블루투스 액세스 포인트로부터 응답신호가 수신되지 않으면, 상기 휴대용 단말기는 블루투스모듈의 동작과 관련된 동작모듈을 저전력 상태로 전환하는 과정과;상기 휴대용 단말기가 설정된 주기마다 상기 블루투스 액세스 포인트로 연결을 요청하는 동안 임의의 키가 선택되면, 상기 설정된 주기와 상관없이 상기 블루투스 액세스 포인트로 연결을 요청하는 과정을 포함한다. 블루투스, 휴대용 단말기, 무선전화, 액세스 포인트, 연결 요청
Abstract:
A high power LED package and manufacturing method thereof are provided to smoothly releases the heat of the light emitting diode to outside and obtain a stable heat characteristic in the high temperature. The high power LED package comprises a radiant heater(110a), and an insulating layer(120) and an electrode unit. The radiant heater has a chip loading part(112) and a conductive via hole(131). One or more light emitting diode is settled in the chip mounting unit. The conductive via hole is arranged in the radiant heater. The insulating layer is covered with the constant thickness along the external side of the radiant heater. The light emitting diode and conductive via hole electrically are connected in the electrode unit.