-
公开(公告)号：KR1020160014197A
公开(公告)日：2016-02-11
申请号：KR1020140095950
申请日：2014-07-28
Applicant: 삼성전자주식회사
CPC classification number: H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48463 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: 본발명은리드프레임을갖는패키지본체; 및상기패키지본체에탑재되며상기리드프레임과와이어본딩에의해전기적으로접속되는발광다이오드칩을포함하며, 상기리드프레임은, 상기발광다이오드칩이실장되는면에배치된제1 반사층; 및상기제1 반사층상에배치되는제2 반사층을포함하며, 상기와이어는상기제2 반사층을관통하여상기제1 반사층과연결될수 있으므로, 리드프레임의변색이방지되어균일한광량을제공할수 있으며, 발광다이오드패키지의제조시간이감소되어제조비용이감소되는효과가있다.
Abstract translation: 本发明的发光二极管（LED）封装包括：具有引线框的封装体; 以及安装在封装主体上并通过引线接合电连接到引线框架的LED芯片。 引线框架包括：设置在其上设置有LED芯片的安装表面上的第一反射层; 以及设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过防止引线框架的变色来提供均匀的光量，并且LED封装的制造时间减少，导致制造成本的降低。
-
公开(公告)号：KR1020130079804A
公开(公告)日：2013-07-11
申请号：KR1020120000520
申请日：2012-01-03
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/504 , G02F1/133615
Abstract: PURPOSE: A white light emitting device, a display using the same, and a lighting device are provided to improve the transmittance of an LCD by reducing the peak intensity of a color mixing region. CONSTITUTION: A blue light emitting diode emits blue light with a peak wavelength between 430 and 460 nm. A first wavelength conversion material is excited by the blue light and emits green light. A second wavelength material is excited by the blue light and emits red light. White light includes a first peak wavelength in a wavelength band between 525 and 545 nm and a second peak wavelength in the wavelength band between 615 and 650 nm. The lowest relative intensity between the first peak wavelength and the second peak wavelength is 0.08 of the relative intensity of the blue light or less. [Reference numerals] (AA) Relative strength (a. u.); (BB) Wavelength (nm)
Abstract translation: 目的：提供白色发光装置，使用其的显示器和照明装置，以通过降低混色区域的峰值强度来提高LCD的透射率。 构成：蓝色发光二极管发射峰值波长在430和460nm之间的蓝色光。 第一波长转换材料被蓝光激发并发出绿光。 第二波长材料被蓝光激发并发出红光。 白光包括在525和545nm之间的波长带中的第一峰值波长和在615和650nm之间的波长带中的第二峰值波长。 第一峰值波长与第二峰值波长之间的最小相对强度为蓝色相对强度的0.08以下。 （附图标记）（AA）相对强度（a。u。）; （BB）波长（nm）
-
公开(公告)号：KR1020130079803A
公开(公告)日：2013-07-11
申请号：KR1020120000519
申请日：2012-01-03
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/508 , G02F1/133615 , H01L33/504
Abstract: PURPOSE: A white light emitting device, a display using the same, and a lighting device are provided to secure the stability of a temperature and high color reproduction properties by adopting a yellow phosphor that is La3Si6N11. CONSTITUTION: A blue light emitting diode emits blue light. A yellow phosphor is excited by the blue light and emits yellow light. The chromaticity variation of Plankian locus and color coordinates of white light is within ±0.01 in CIE 1931 color chromaticity diagrams. The color temperature of the white light is 3000 to 6000 K. The wavelength band of the blue light is 435 to 465 nm.
Abstract translation: 目的：提供白色发光装置，使用其的显示器和照明装置，以通过采用La 3 Si 6 N 11的黄色荧光体来确保温度的稳定性和高的色彩再现性能。 构成：蓝色发光二极管发出蓝光。 黄色荧光粉被蓝光激发，发出黄光。 在CIE 1931色度色度图中，Plankian轨迹的色度变化和白光的色坐标在±0.01以内。 白光的色温为3000〜6000K。蓝光的波段为435〜465nm。
-
公开(公告)号：KR1020110087359A
公开(公告)日：2011-08-03
申请号：KR1020100006728
申请日：2010-01-26
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L33/62 , H01L33/20 , H01L33/50 , H01L33/52 , H01L33/64 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package is provided to enhance the reliability of a product by minimizing the deterioration of an injected resin by the light emitted in a light emitting device and improve the emission performance of the heat generated in the emitting device. CONSTITUTION: A package body(102) has electrical insulating. A first and a second lead frame(103,104), whose lower parts are exposed to the outside, are respectively combined with the package body. The first and the second lead frame have a recess form, in which each one side is opened, and are arranged to face opened areas each other in the recess. An emitting device(101) is mounted in the bottom surface of one recess of the first and the second lead frame. A wire(W) electrically interlinks the light emitting device and the bottom surface of the recess in which the emitting device is not mounted.
Abstract translation: 目的：提供一种发光器件封装，以通过使发光器件中发出的光最小化注入树脂的劣化来提高产品的可靠性，并提高发光器件中产生的热量的发射性能。 构成：包装体（102）具有电绝缘。 第一引线框架和第二引线框架（103,104）分别与封装体组合。 第一引线框架和第二引线框架具有凹部形状，其中每一侧都被打开，并且布置成在凹部中彼此面对开放的区域。 发光装置（101）安装在第一和第二引线框架的一个凹部的底表面中。 电线（W）将发光器件与未安装发光器件的凹部的底表面电连接。
-
公开(公告)号：KR1020090032211A
公开(公告)日：2009-04-01
申请号：KR1020070097224
申请日：2007-09-27
Applicant: 삼성전자주식회사
IPC: H01L33/00
Abstract: A vertically structured GaN type LED device is provided to improve the heat radiating property by forming a structural support layer with the carbon nanotube. An n-type bonding pad(110) is formed on the top part of the vertical structure gallium nitride-based LED element. An n-type electrode(120) is formed on the bottom part of the n-type bonding pad. An n-type nitride gallium film(130) is formed in the bottom part of n-type electrode. The n-type nitride gallium film is formed with the GaN layer or the GaN/AlGaN layer doped by the n-type impurity. An active layer(140) and a p-type nitride gallium film(150) are formed on the bottom part of the n-type nitride gallium film. A p-type electrode(160) is formed in the bottom part of the p-type nitride gallium film of the gallium nitride-based LED structure. A structural support layer(180) supporting the gallium nitride-based LED structure is formed on the bottom part of p-type electrode. The structural support layer is made of the carbon nanotube. A bonding layer(170) is formed between the p-type electrode and the structural support layer. The bonding layer has the first Ohmic layer(170a), a bonding layer(170b) and a laminating structure of the second Ohmic layer(170c).
Abstract translation: 提供垂直结构的GaN型LED器件，通过与碳纳米管形成结构支撑层来提高散热性能。 在垂直结构的氮化镓系LED元件的顶部形成有n型接合焊盘（110）。 n型电极（120）形成在n型接合焊盘的底部。 n型氮化镓膜（130）形成在n型电极的底部。 n型氮化镓膜形成有由n型杂质掺杂的GaN层或GaN / AlGaN层。 在n型氮化镓膜的底部形成有源层（140）和p型氮化镓膜（150）。 在氮化镓系LED结构的p型氮化镓膜的底部形成有p型电极（160）。 在p型电极的底部形成有支撑氮化镓系LED结构的结构支撑层（180）。 结构支撑层由碳纳米管制成。 在p型电极和结构支撑层之间形成结合层（170）。 接合层具有第一欧姆层（170a），接合层（170b）和第二欧姆层（170c）的层压结构。
-
Patent Agency Ranking
公开(公告)号：KR1020120068626A
公开(公告)日：2012-06-27
申请号：KR1020100130324
申请日：2010-12-17
Applicant: 삼성전자주식회사
IPC: G02F1/1335 , F21V8/00
CPC classification number: G02B6/0073 , G02B6/0068 , G02B6/0083 , G02F1/1336 , G02B6/0055 , G02B6/0078 , G02F1/133615
Abstract: PURPOSE: An LED(Light Emitting Diode) light source module and a display device with the same are provided to increase the number of LED packages which can be mounted on a circuit board of a fixed size, thereby increasing brightness. CONSTITUTION: A circuit board(111) has a first wire pattern and a second wire pattern. A plurality of rectangular parallelepiped LED packages(115) are mounted on the circuit board and connected to the first and second wire patterns respectively. The rectangular parallelepiped LED packages are arranged in parallel. The rectangular parallelepiped LED packages have light emitting windows. The light emitting window is located on a side opposite to a mounting side.
Abstract translation: 目的：提供LED（发光二极管）光源模块及其显示装置，以增加可以安装在固定尺寸的电路板上的LED封装的数量，从而增加亮度。 构成：电路板（111）具有第一线图案和第二线图案。 多个长方体LED封装（115）安装在电路板上并分别连接到第一和第二布线图案。 长方体LED封装平行布置。 长方体LED封装具有发光窗口。 发光窗位于与安装侧相反的一侧。
-
公开(公告)号：KR1020110058043A
公开(公告)日：2011-06-01
申请号：KR1020090114699
申请日：2009-11-25
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A light emitting diode lens molding apparatus is provided to treat a silicon resin easily by simplifying the system since internal temperature difference problem of the lens molding apparatus can be divided temporally. CONSTITUTION: The light emitting diode lens molding apparatus includes; a resin pouring tube in which the resin for forming the lens is inserted; a first mold(110) equipped with the lens molding part connected to the resin pouring tube; a second mold(120) equipped with the settling portion for the seating of the light emitting diode module, which is combined with the first mold; and a rapid heating member(140) buried at least according to the around lens molding part inserted inside the body of the combination of the first and the second mold. The rapid heating member comprises the radio frequency-induction coil. The light emitting diode lens molding apparatus includes more release film formed in the inner wall of resin pouring tube. The light emitting diode lens molding apparatus includes more cooling member which is neighbors with the rapid heating member and is buried.
Abstract translation: 目的：提供一种发光二极管透镜成型装置，通过简化系统来容易地处理硅树脂，因为透镜成型装置的内部温差问题可以在时间上分解。 发光二极管透镜成型装置包括： 树脂浇注管，其中插入用于形成透镜的树脂; 配备有连接到树脂浇注管的透镜成型部件的第一模具（110） 第二模具（120），其配备有与第一模具组合的用于安置发光二极管模块的沉降部分; 以及至少埋设在第一和第二模具的组合体的内部的透镜成型部周围的快速加热构件（140）。 快速加热构件包括射频感应线圈。 发光二极管透镜成型装置包括形成在树脂浇注管的内壁中的更多的脱模膜。 发光二极管透镜成型装置包括与快速加热构件相邻并被埋设的更多的冷却构件。
-
公开(公告)号：KR1020100005852A
公开(公告)日：2010-01-18
申请号：KR1020080065925
申请日：2008-07-08
Applicant: 삼성전자주식회사
IPC: H01L33/62
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2224/97 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve luminous efficiency by preventing optical absorption by a wall as a cup part is not formed on a substrate. CONSTITUTION: A light emitting device package comprises a metallic board(27) and an emitting device(30). A metal substrate comprises a first cut part(21a), a second cut part(22a), a first lead frame(21), and a second lead frame(22). The first cut part is inserted into a plane part(21b) and one side. In the first lead frame, an injection product is formed on the upper side and the lower side of a first cut part. The second cut part is press-fitted into one side and the injection product is formed on the upper side and the lower side of the second cut part. The second lead frame is separated by the injection product. A light emitting device is mounted on the plane part.
Abstract translation: 目的：提供发光器件封装及其制造方法，以通过防止由于在基板上未形成杯部的壁而防止壁的光吸收而提高发光效率。 构成：发光器件封装包括金属板（27）和发光器件（30）。 金属基板包括第一切割部分（21a），第二切割部分（22a），第一引线框架（21）和第二引线框架（22）。 第一切割部分插入平面部分（21b）和一侧。 在第一引线框架中，在第一切割部分的上侧和下侧形成注射产品。 第二切割部被压入一侧，并且注射产品形成在第二切割部分的上侧和下侧。 第二引线框由注射产品分开。 发光装置安装在平面部分上。
-
公开(公告)号：KR1020130119230A
公开(公告)日：2013-10-31
申请号：KR1020120042228
申请日：2012-04-23
Applicant: 삼성전자주식회사
CPC classification number: H01L33/504 , C09K11/06 , G02B6/0068 , G02B6/0073 , H01L33/52 , H05B33/12
Abstract: PURPOSE: A white light emitting device and a display apparatus are provided to improve color reproducibility by lowering the peak intensity of a color mixing region. CONSTITUTION: A blue light emitting diode emits blue light. A resin packing part encapsulates the blue light emitting diode. A first wavelength conversion material (24) emits green light. A second wavelength conversion material (25) emits red light. A complex (26) absorbs the light of the mixture region of the red light and the green light.
Abstract translation: 目的：提供白色发光装置和显示装置，以通过降低混色区域的峰值强度来提高颜色再现性。 构成：蓝色发光二极管发出蓝光。 树脂包装部分封装蓝色发光二极管。 第一波长转换材料（24）发射绿光。 第二波长转换材料（25）发射红光。 复合体（26）吸收红光和绿光的混合区域的光。
-
公开(公告)号：KR1020130057676A
公开(公告)日：2013-06-03
申请号：KR1020110123539
申请日：2011-11-24
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L33/505 , H01L33/56 , H01L33/62 , H01L33/641 , H01L2924/00014
Abstract: PURPOSE: A light emitting device is provided to improve heat dissipation efficiency by using a pair of lead frames and a heat conduction resin layer. CONSTITUTION: A main body includes a recess part. The main body exposes a lead frame(11). A light emitting device(31) is arranged on the lead frame. A heat conduction resin layer(41) encapsulates the light emitting device. A wavelength conversion member is separated from the main body.
Abstract translation: 目的：提供一种发光装置，通过使用一对引线框架和导热树脂层来提高散热效率。 构成：主体包括凹部。 主体暴露引线框架（11）。 发光装置（31）布置在引线框架上。 导热树脂层（41）封装发光器件。 波长转换构件与主体分离。
-
-
-
-
-
-
-
-
-
Search Results
26
records
(took 0.021 seconds)
