中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

18 records (took 0.031 seconds)

    CURABLE COMPOSITIONS AND METHODS OF MAKING AND USING THE SAME
    11.
    发明申请
    CURABLE COMPOSITIONS AND METHODS OF MAKING AND USING THE SAME 有权

    公开(公告)号：US20220372290A1

    公开(公告)日：2022-11-24

    申请号：US17765744

    申请日：2020-11-06

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Li Yao ,  Erik M. Townsend ,  Susan E. DeMoss ,  Jonathan D. Zook

    IPC: C08L81/02 ,  C09J181/02

    Abstract: A two-part curable composition comprises: a Part A component comprising polythiol having a thiol group functionality of at least two, and tertiary amine accelerator; and a Part B component comprising polyene comprising at least two of non-aromatic C—C double bonds, C—C triple bonds, or a combination thereof and organic peroxide curative. At least one of the polythiol or the polyene comprises a respective reaction product of reaction components comprising: HSR1O(CH2CHR2O)aR1SH wherein each R1 independently represents an alkyl group having from 2 to 12 carbon atoms, each R2 independently represents H or CH3, and a represents an integer from 1 to 20; triallyl isocyanurate; H2═CHOR1O(CH2CHR2O)aR1OCH═CH2; and. A method of making a curable composition comprises combining the Part A and Part B components of the two-part curable composition. Methods of sealing a substrate and adhering two substrates, and articles made thereby are also disclosed. (Formula AA)

    CURABLE PRECURSOR OF A THERMALLY-CONDUCTIVE ADHESIVE COMPOSITION
    13.
    发明申请
    CURABLE PRECURSOR OF A THERMALLY-CONDUCTIVE ADHESIVE COMPOSITION 有权

    公开(公告)号：US20220243102A1

    公开(公告)日：2022-08-04

    申请号：US17607279

    申请日：2020-04-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Ahmad Shaaban ,  Adrian Jung ,  Manfred Ludsteck ,  Adrian Eckert ,  Li Yao ,  Simon Plugge ,  Lingjie Tong

    IPC: C09J133/08 ,  C09J133/10 ,  C08K3/22 ,  C08F220/18 ,  C08F220/06 ,  C08F220/28 ,  C08F222/10 ,  C08F230/02

    Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.

    CURABLE AND CURED COMPOSITIONS
    15.
    发明申请
    CURABLE AND CURED COMPOSITIONS 有权

    公开(公告)号：US20210122915A1

    公开(公告)日：2021-04-29

    申请号：US17250019

    申请日：2019-04-25

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Li Yao ,  Rajdeep S. Kalgutkar ,  Mario A. Perez ,  Wayne S. Mahoney

    IPC: C08L63/00 ,  C09J163/00

    Abstract: Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

Patent Agency Ranking