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公开(公告)号：US20180139855A1
公开(公告)日：2018-05-17
申请号：US15580078
申请日：2016-06-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew S. Stay , Shawn C. Dodds , Ann M. Gilman , Mikhail L. Pekurovsky , Daniel J. Theis , Matthew R. D. Smith
CPC classification number: H05K3/4679 , G06F3/041 , G06F2203/04102 , G06F2203/04103 , H05K1/0274 , H05K1/028 , H05K1/0283 , H05K1/0393 , H05K1/097 , H05K1/115 , H05K3/0091 , H05K3/0097 , H05K3/10 , H05K3/4038 , H05K3/4069 , H05K3/4644 , H05K3/4664 , H05K2201/026 , H05K2203/1173 , H05K2203/1545 , H05K2203/166
Abstract: A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
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公开(公告)号：US12224184B2
公开(公告)日：2025-02-11
申请号：US18652529
申请日：2024-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US12221239B2
公开(公告)日：2025-02-11
申请号：US18711210
申请日：2022-11-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Joseph B. Farley , Ronald P. Swanson , Matthew R. D. Smith , Matthew S. Stay , Shawn C. Dodds , Kara A. Meyers , Kayla C. Niccum , Mikhail L. Pekurovsky , Lyudmila A. Pekurovsky , Saagar A. Shah
Abstract: Methods and systems of using pocket roller (110, 130) to place objects on a continuously moving web (2) are provided. The objects are received in an array of pockets (124) on a major surface of a roller sleeve (120). The roller sleeve (120) engages with an adhesive surface (22) of the continuously moving web (2) to place the objects on the web (2).
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公开(公告)号：US12020951B2
公开(公告)日：2024-06-25
申请号：US17594346
申请日：2020-04-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC classification number: H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20210379887A1
公开(公告)日：2021-12-09
申请号：US17284535
申请日：2019-10-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew R. D. Smith , Shawn C. Dodds , Mikhail L. Pekurovsky , Thomas J. Metzler , Matthew S. Stay , Kara A. Meyers , Samad Javid
Abstract: A printing system is provided. The printing system (300) includes a printing roll (310) having a rigid printing pattern (312) on a surface thereof configured to receive an ink material (330); and an inking roll (320) positioned adjacent to the printing roll. The inking roll includes an elastically deformable surface and a number of cells (324) disposed on the elastically deformable surface. A method of printing is also provided. The method includes (a) inking at least a portion of a rigid printing pattern (312) on a surface of a printing roll (310) by contacting the rigid printing pattern with an inking roll (320); and (b) contacting the rigid printing pattern with a substrate (350), transferring the ink material from the rigid printing pattern to a surface of the substrate. Printing systems and methods can achieve higher printing feature resolutions than typically achievable via flexographic printing.
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Patent Agency Ranking
公开(公告)号：US10758931B2
公开(公告)日：2020-09-01
申请号：US15579980
申请日：2016-06-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Shawn C. Dodds , Mikhail L. Pekurovsky , James N. Dobbs , Graham M. Clarke , Michele A. Craton , Adam W. Kiefer , Matthew R. D. Smith , Brian E. Schreiber
Abstract: Methods and apparatuses for applying liquid coatings are provided. A first roll (14), a second roll (16), and a nip (146) formed between the first and second rolls are provided. A coating liquid (22) is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer (22a) of liquid coating which is transferred to a substrate (12). The second roll (16) includes a thin metal shell (40) and a resilient layer (30), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (14).
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公开(公告)号：US12145392B2
公开(公告)日：2024-11-19
申请号：US18258700
申请日：2021-12-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ann M. Gilman , Kevin T. Reddy , Shawn C. Dodds , Matthew R. D. Smith , Clinton J. Cook , Mikhail L. Pekurovsky , Matthew S. Stay
Abstract: Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate (2) has its major surface in contact with a first major surface (112) of a stencil shell (111) having apertures (116). A coating material is disposed onto the second major surface (114) of the stencil shell (111) to flow through the apertures (116) to contact the substrate (2), where the coating material is at least partially cured. The substrate (2) is separated (C) from the first major surface (112) of the stencil shell (111) after the curing (142) and a pattern (42) of the at-least-partially-cured coating material is formed on the substrate (2).
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18.发明授权公开(公告)号：US11971560B2
公开(公告)日：2024-04-30
申请号：US17261123
申请日：2019-07-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeremy O. Swanson , Matthew S. Stay , Matthew R. D. Smith
IPC: G02B5/08
CPC classification number: G02B5/0841
Abstract: Optical films are described. In particular, optical films including a broadband polymeric multilayer optical reflector and a discontinuous transparent coating disposed on the broadband multilayer optical reflector, where the discontinuous transparent coating includes an array of dots are described. Such films may provide reduced coefficients of friction while still having high specular reflectivity.
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公开(公告)号：US11655403B2
公开(公告)日：2023-05-23
申请号：US16621276
申请日：2018-06-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kelly A. Volp , Kathleen S. Shafer , Ross E. Behling , Ann M. Gilman , Mark F. Ellis , Matthew R. D. Smith , Aaron T. Hedegaard , Xiaoming Jiang , Cyrus A. Anderson
IPC: C09J133/14 , C08L33/14 , C09J7/38
CPC classification number: C09J133/14 , C08L33/14 , C09J7/38 , C09J7/385 , B32B2405/00 , C09J2433/00
Abstract: A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.
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公开(公告)号：US11284521B2
公开(公告)日：2022-03-22
申请号：US15580078
申请日：2016-06-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew S. Stay , Shawn C. Dodds , Ann M. Gilman , Mikhail L. Pekurovsky , Daniel J. Theis , Matthew R. D. Smith
IPC: H05K3/46 , G06F3/041 , H05K1/09 , H05K3/40 , H05K1/02 , H05K1/11 , H05K3/10 , H05K3/00 , H05K1/03
Abstract: A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
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