公开(公告)号：US11773295B2

公开(公告)日：2023-10-03

申请号：US17833054

申请日：2022-06-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Thomas Q. Chastek ,  Xiao Gao ,  Kathleen S. Shafer ,  Sheng Ye

IPC: C09J5/00 ,  C09J163/00 ,  B32B17/10 ,  C08L71/00 ,  B32B7/12 ,  B32B37/12 ,  C09J131/04 ,  C09J167/00

CPC classification number: C09J5/00 ,  B32B7/12 ,  B32B17/10 ,  B32B17/10005 ,  B32B17/10293 ,  B32B37/12 ,  C08L71/00 ,  C09J131/04 ,  C09J163/00 ,  C09J167/00 ,  B32B2037/1253 ,  B32B2605/006 ,  C09J2301/416 ,  C09J2400/143 ,  C09J2431/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J163/00 ,  C08L71/00

Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

公开(公告)号：US20220298383A1

公开(公告)日：2022-09-22

申请号：US17833054

申请日：2022-06-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Thomas Q. Chastek ,  Xiao Gao ,  Kathleen S. Shafer ,  Sheng Ye

IPC: C09J5/00 ,  C09J163/00 ,  B32B17/10 ,  C08L71/00 ,  B32B7/12 ,  B32B37/12 ,  C09J131/04 ,  C09J167/00

Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

公开(公告)号：US11845885B2

公开(公告)日：2023-12-19

申请号：US16062295

申请日：2016-12-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Matthew J. Schmid ,  Cyrus A. Anderson ,  Kathleen S. Shafer ,  Xiao Gao ,  James M. Nelson

IPC: C09J163/00 ,  C09J4/00 ,  C09J5/00 ,  C08L33/08 ,  C09J7/38 ,  C08K5/03 ,  C08K5/06 ,  C08K5/5397 ,  C08L33/10 ,  C08L71/00

CPC classification number: C09J163/00 ,  C08L33/08 ,  C09J4/00 ,  C09J5/00 ,  C09J7/38 ,  C08K5/03 ,  C08K5/06 ,  C08K5/5397 ,  C08L33/10 ,  C08L71/00 ,  C09J2301/408 ,  C09J2301/416 ,  C09J163/00 ,  C08L33/08 ,  C09J4/00 ,  C08F220/1804

Abstract: Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradiated by a first actinic light source to polymerize the first curable resin without polymerizing the second curable resin to provide a partially cured adhesive. The partially cured adhesive is a pressure-sensitive adhesive that displays cold flow creep recovery under ambient conditions and is capable of being fully cured by irradiating the partially cured adhesive using a second actinic light source that is different from the first actinic light source to polymerize the second curable resin.

公开(公告)号：US11655403B2

公开(公告)日：2023-05-23

申请号：US16621276

申请日：2018-06-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kelly A. Volp ,  Kathleen S. Shafer ,  Ross E. Behling ,  Ann M. Gilman ,  Mark F. Ellis ,  Matthew R. D. Smith ,  Aaron T. Hedegaard ,  Xiaoming Jiang ,  Cyrus A. Anderson

IPC: C09J133/14 ,  C08L33/14 ,  C09J7/38

CPC classification number: C09J133/14 ,  C08L33/14 ,  C09J7/38 ,  C09J7/385 ,  B32B2405/00 ,  C09J2433/00

Abstract: A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.

公开(公告)号：US10927276B2

公开(公告)日：2021-02-23

申请号：US15576407

申请日：2016-06-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Thomas Q. Chastek ,  Xiao Gao ,  Kathleen S. Shafer ,  Sheng Ye

IPC: B32B17/10 ,  C09J5/00 ,  C09J163/00 ,  C08L71/00 ,  B32B7/12 ,  B32B37/12 ,  C09J131/04 ,  C09J167/00

Abstract: Methods of bonding hardware to glass and other substrates are provided that do not require use of primers, mixing, fixturing, or autoclaving. These methods include the steps of disposing an adhesive layer on a bonding surface of either the hardware or the vehicular glass, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing the hardware so as to be bonded to the vehicular glass by the adhesive layer; and allowing the adhesive layer to cure.

公开(公告)号：US20180337631A1

公开(公告)日：2018-11-22

申请号：US15761454

申请日：2016-09-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Christopher J. Duda ,  Scott R. Meyer

IPC: H02S30/10 ,  F16M11/04

CPC classification number: H01L31/048 ,  H01L31/0481 ,  H02S30/10 ,  Y02E10/50

Abstract: The present disclosure relates to structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules. Another aspect of the present disclosure relates to methods of affixing an attachment bracket to a solar module during the lamination step used to manufacture the module.

公开(公告)号：US11352524B2

公开(公告)日：2022-06-07

申请号：US17154466

申请日：2021-01-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Thomas Q. Chastek ,  Xiao Gao ,  Kathleen S. Shafer ,  Sheng Ye

IPC: B32B7/12 ,  C09J5/00 ,  C09J163/00 ,  B32B17/10 ,  C08L71/00 ,  B32B37/12 ,  C09J131/04 ,  C09J167/00

Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

公开(公告)号：US20210139741A1

公开(公告)日：2021-05-13

申请号：US17154466

申请日：2021-01-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Cyrus A. Anderson ,  Thomas Q. Chastek ,  Xiao Gao ,  Kathleen S. Shafer ,  Sheng Ye

IPC: C09J5/00 ,  C09J163/00 ,  B32B17/10 ,  C08L71/00 ,  B32B7/12 ,  B32B37/12 ,  C09J131/04 ,  C09J167/00

Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

公开(公告)号：US20200071514A1

公开(公告)日：2020-03-05

申请号：US16467147

申请日：2017-12-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kathleen S. Shafer ,  Rebecca A. Putans ,  Ernest L. Thurber ,  Cyrus A. Anderson ,  Corinne E. Lipscomb ,  Thomas J. Nelson ,  Gregory P. Sorenson ,  Chainika Jangu

IPC: C08L33/14 ,  C08L31/04 ,  C08L63/04 ,  C08L71/02 ,  C08F220/18 ,  C08F220/28 ,  C08K5/00 ,  C08K5/132 ,  C08K5/36 ,  C08K3/013 ,  C08K3/26 ,  C08K3/14 ,  C08K3/38 ,  B24D3/28 ,  B24D11/00 ,  B24D11/02

Abstract: The disclosure relates to a curable composition comprising: a polymerizable epoxy-acrylate resin composition having a complex viscosity at 25° C. and 1 Hz frequency of at least about 4500 Pa-s and a probe tack peak force of at least about 300 kPa; and abrasive particles partially or fully embedded in the polymerizable epoxy-acrylate resin composition. The disclosure also relates to cured compositions formed from such curable compositions, wherein the abrasive particles are partially or fully embedded in the cured composition. In addition, the disclosure relates to abrasive articles made from such cured compositions as well as methods for making abrasive articles.

公开(公告)号：US20200070312A1

公开(公告)日：2020-03-05

申请号：US16467405

申请日：2017-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kathleen S. Shafer ,  Chainika Jangu ,  Ian R. Owen ,  Cyrus A. Anderson ,  Thomas A. Mahler

IPC: B24D3/28 ,  C08L33/08

Abstract: The disclosure relates to a curable composition comprising: a polymerizable epoxy-acrylate resin composition having a complex viscosity at 25° C. and 1 Hz frequency of at least about 4500 Pa-s; and abrasive particles partially or fully embedded in the polymerizable epoxy-acrylate resin component. The disclosure also relates to cured compositions formed from such curable compositions, wherein the abrasive particles are partially or fully embedded in the cured composition. In addition, the disclosure relates to abrasive articles made from such cured compositions as well as methods for making abrasive articles.