公开(公告)号：US20220289973A1

公开(公告)日：2022-09-15

申请号：US17632641

申请日：2020-09-02

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C08L79/04

Abstract: A curable resin composition having fast-curing properties, high heat resistance, and excellent infiltration properties. The composition contains: a cyanate ester resin, an epoxy resin, a latent curing agent, and an inorganic pigment containing at least one metal selected from titanium, iron, copper, chromium, zirconium, calcium, manganese, and zinc. The inorganic pigment preferably has a primary particle size of 5 to 150 nm. The inorganic pigment is preferably present in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the sum of the cyanate ester resin and the epoxy resin.

公开(公告)号：US20220282139A1

公开(公告)日：2022-09-08

申请号：US17687728

申请日：2022-03-07

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kazuma YAMAGUCHI ,  Takao IZUMI ,  Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C09J175/04 ,  C09J11/04 ,  C08G18/00

Abstract: There is provided a photocurable adhesive which is capable of reducing the amount of gas discharged from the cured product. A photocurable adhesive is formulated to be curable by laser light irradiation, The photocurable adhesive contains an epoxy adhesive component, and a light-absorbing component configured to generate heat by laser light irradiation. The epoxy adhesive component contains a cyanate ester resin (A), epoxy resin (B), latent amine curing agent (C), and ion scavenger (D)

公开(公告)号：US20180051167A1

公开(公告)日：2018-02-22

申请号：US15560773

申请日：2016-03-22

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Kozo MATSUMOTO ,  Ken-ichi TAMASO ,  Chihiro ASAKURA ,  Ryo OGAWA

IPC: C08L63/00 ,  C08J5/24 ,  C08K5/5399 ,  C08K5/00

CPC classification number: C08L63/00 ,  C08J5/24 ,  C08K5/0066 ,  C08K5/5399 ,  C08L2201/02

Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.

公开(公告)号：US20170145268A1

公开(公告)日：2017-05-25

申请号：US15312736

申请日：2015-05-22

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kenji KOGA ,  Daisuke TAKAMA ,  Ryo OGAWA ,  Shinsuke YAMADA ,  Takuya MATSUDA

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08G59/50 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2227 ,  C08L79/04

Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.

公开(公告)号：US20160200747A1

公开(公告)日：2016-07-14

申请号：US14915766

申请日：2014-11-10

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Kozo MATSUMOTO ,  Ken-ichi TAMASO ,  Ryo OGAWA

IPC: C07F9/24 ,  C08G59/40 ,  C08G59/44

CPC classification number: C07F9/242 ,  C07F9/224 ,  C07F9/2404 ,  C07F9/2458 ,  C08G59/1488 ,  C08G59/4071 ,  C08G59/446

Abstract: Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R1, R2, R3, and R4 are each hydrogen, alkyl, or aryl; R5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.

Abstract translation: 提供通式（I）表示的新型含磷化合物。 该化合物与缩水甘油基具有反应性，因此能够提供期待实现阻燃和降低介电常数的固化环氧树脂组合物。 其中m为1至10的数; R 1，R 2，R 3和R 4各自为氢，烷基或芳基; R5是烷基，烷二基，链烷三基，烷基乙基或芳基; X是氧或硫; Y是氧，硫或= NRR; 和R'是氢，烷基或芳基。

公开(公告)号：US20160152643A1

公开(公告)日：2016-06-02

申请号：US14900844

申请日：2014-08-21

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Kozo MATSUMOTO ,  Ken-ichi TAMASO ,  Ryo OGAWA

IPC: C07F9/32

CPC classification number: C07F9/3282 ,  C07F9/3264 ,  C07F9/36 ,  C08K5/5313 ,  C08L63/00 ,  C09K21/12 ,  C09K21/14

Abstract: The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; R1 and R2 independently represent a hydrogen atom, an alkyl group or an aryl group; R3 represents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or —NR4—; and R4 represents a hydrogen atom, an alkyl group or an aryl group.)

Abstract translation: 本发明的目的是提供一种与缩水甘油基具有反应性的含磷化合物，特别是由通式（I）表示的含磷化合物。 （式中，m表示1〜10的数值，R 1和R 2分别表示氢原子，烷基或芳基，R 3表示烷基，烷二基，烷三甲酰基，烷基四氟乙基， 芳基; X表示氧原子或硫原子; Y表示氧原子，硫原子或-NR4-，R4表示氢原子，烷基或芳基）。