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公开(公告)号：US20150064937A1
公开(公告)日：2015-03-05
申请号：US14231372
申请日：2014-03-31
Applicant: Apple Inc.
Inventor： Gregory N. Stephens , Matthew D. Hill , Scott A. Myers
CPC classification number: H05K1/0215 , H01R4/64 , H01R12/57 , H01R2201/06 , H05K2201/10265 , Y10T29/4913
Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.
Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件，例如接地弹簧，以及为部件提供机械保护。 更具体地，公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中，接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。
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公开(公告)号：US12301744B2
公开(公告)日：2025-05-13
申请号：US17903963
申请日：2022-09-06
Applicant: Apple Inc.
Inventor： David A. Hurrell , Gregory N. Stephens , Isabel Yang , John J. Baker , Sherry Lee , Matthew D. Hill , Obinna Onyemepu , Douglas G. Fournier , Benjamin J. Pope , Michael W. Firka , Griffin L. Schmitt , Arun R. Varma , Robert Hrabchak
IPC: H05K7/20 , G06F1/20 , G06F3/01 , G06F3/0488 , G09G3/18 , H02K33/02 , H04M1/02 , H04N23/51 , H04N23/55 , H04N23/90
Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.
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公开(公告)号：US09743564B2
公开(公告)日：2017-08-22
申请号：US14830351
申请日：2015-08-19
Applicant: Apple Inc.
Inventor： Shayan Malek , David A. Pakula , Gregory N. Stephens , Jason Sloey
CPC classification number: H05K9/0032 , H05K1/0216 , H05K1/181 , H05K2201/10371 , Y02P70/611
Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.
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公开(公告)号：US20160073529A1
公开(公告)日：2016-03-10
申请号：US14552295
申请日：2014-11-24
Applicant: Apple Inc.
Inventor： Jared M. Kole , Shayan Malek , Matthew D. Hill , Michael Benjamin Wittenberg , Gregory N. Stephens
IPC: H05K5/02
CPC classification number: H04B1/3816 , H04M1/026
Abstract: Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.
Abstract translation: 公开了用于从电子设备弹出SIM托盘的几个实施例。 在一些实施例中，位于托盘后面的杠杆可被致动以弹出托盘。 在一些实施例中，可以致动枢转机构以弹出托盘。 在其他实施例中，可以致动齿轮机构以弹出托盘。 在其他实施例中，可以致动弹簧元件以弹出托盘。 在一些实施例中，电子设备可以包括键功能，其允许仅当使用具有与电子设备的关键特征的匹配键特征的工具时才能弹出托盘。
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公开(公告)号：US20160066481A1
公开(公告)日：2016-03-03
申请号：US14830351
申请日：2015-08-19
Applicant: Apple Inc.
Inventor： Shayan Malek , David A. Pakula , Gregory N. Stephens , Jason Sloey
CPC classification number: H05K9/0032 , H05K1/0216 , H05K1/181 , H05K2201/10371 , Y02P70/611
Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.
Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电磁屏蔽可以通过部件安装到印刷电路上，以抑制干扰。 屏蔽件可以具有覆盖有导电织物的金属框架。 导电织物可以覆盖框架顶部的开口。 可以在导电织物的下表面上形成绝缘层，以防止印刷电路上的部件和导电织物之间的短路。 还可以在每个部件上形成诸如弹性体聚合物盖的绝缘帽以提供部件和导电织物之间的电隔离。 可以通过将屏蔽罐耦合到设备中的订户身份模块屏蔽或其他金属结构来形成屏蔽。 可以移除中间壁结构以帮助提供额外的屏蔽体积。
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Patent Agency Ranking
公开(公告)号：US09192057B2
公开(公告)日：2015-11-17
申请号：US13726890
申请日：2012-12-26
Applicant: Apple Inc.
Inventor： Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg , Jared M. Kole , Warren Z. Jones
CPC classification number: H05K3/30 , H05K9/003 , H05K2201/09063 , H05K2201/10371 , H05K2201/10409 , Y10T29/49117 , Y10T29/4913
Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.
Abstract translation: 电气部件安装在电子设备壳体中的印刷电路上。 屏蔽罐结构可以包括具有导电垫片的金属板屏蔽罐层。 印刷电路可以具有开口。 螺丝穿过印刷电路中的开口和导电垫圈和金属板护罩罐层中的开口，以将屏蔽罐结构固定到壳体上。 当固定时，垫圈中的唇缘位于印刷电路基板和壳体之间。 垫圈可以由导电弹性体材料形成。 屏蔽罐盖和柔性印刷电路可以嵌入在导电弹性体材料内，其提供热传导路径以从盖下方的电气部件散发热量。 位于柔性印刷电路基板中的弯曲部的相对侧上的屏蔽罐构件可以通过导电弹性体桥接结构耦合。
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公开(公告)号：US09192046B2
公开(公告)日：2015-11-17
申请号：US13679939
申请日：2012-11-16
Applicant: Apple Inc.
Inventor： Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg
IPC: H05K1/02 , H05K1/11 , H04M1/02 , H05K1/18 , H05K3/36 , G06F1/16 , H04R11/02 , H05K1/14 , H05K3/32
CPC classification number: H05K1/118 , G06F1/1658 , H04M1/026 , H04R11/02 , H04R2499/11 , H05K1/0281 , H05K1/147 , H05K1/189 , H05K3/325 , H05K3/361 , H05K2201/10083 , H05K2201/10409 , H05K2201/2009
Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.
Abstract translation: 电子设备包含电气元件。 使用安装结构将电气部件安装到电子设备外壳。 安装结构包括具有金属接触垫的相对端的柔性印刷电路跳线。 柔性印刷电路跳线中的金属迹线在焊接掩模层的开口内形成接触迹线。 开口中的焊料可用于将金属接触焊盘连接到接触迹线。 金属支架可以拧入电子装置壳体中，以将电气部件安装到电子装置壳体上。 金属支架可以将跳线一端的金属接触垫压靠在电气部件上的匹配接触端子上，并且可以将跳线另一端上的金属触头压靠在附加印刷电路上的匹配接触垫上。
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公开(公告)号：US20140140021A1
公开(公告)日：2014-05-22
申请号：US13679939
申请日：2012-11-16
Applicant: APPLE INC.
Inventor： Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg
IPC: H05K1/02
CPC classification number: H05K1/118 , G06F1/1658 , H04M1/026 , H04R11/02 , H04R2499/11 , H05K1/0281 , H05K1/147 , H05K1/189 , H05K3/325 , H05K3/361 , H05K2201/10083 , H05K2201/10409 , H05K2201/2009
Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.
Abstract translation: 电子设备包含电气元件。 使用安装结构将电气部件安装到电子设备外壳。 安装结构包括具有金属接触垫的相对端的柔性印刷电路跳线。 柔性印刷电路跳线中的金属迹线在焊接掩模层的开口内形成接触迹线。 开口中的焊料可用于将金属接触焊盘连接到接触迹线。 金属支架可以拧入电子装置壳体中，以将电气部件安装到电子装置壳体上。 金属支架可以将跳线一端的金属接触垫压靠在电气部件上的匹配接触端子上，并且可以将跳线另一端上的金属触头压靠在附加印刷电路上的匹配接触垫上。
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公开(公告)号：US11662772B2
公开(公告)日：2023-05-30
申请号：US17220592
申请日：2021-04-01
Applicant: Apple Inc.
Inventor： David A. Pakula , Daniel W. Jarvis , Shimon Elkayam , Brandon R. Garbus , Christopher S. Graham , Karl Ruben F. Larsson , Ashley E. Fletcher , Jared M. Kole , Eric S. Jol , Aaron A. Oro , Michael D. Quinones , Gregory N. Stephens , Ian A. Spraggs , James A. Bertin , Simon C. Helmore , Melissa A. Wah , Matthew D. Hill , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H04N5/225 , H04M1/02 , H02J50/70 , G06V40/16 , G06F1/16 , H02J50/10 , G06F1/26 , H04N23/45 , H04N23/51
CPC classification number: G06F1/1626 , G06F1/1658 , G06F1/1686 , G06F1/26 , H02J50/10 , H02J50/70 , H04M1/0202 , H04N23/45 , H04N23/51 , G06V40/172 , H04M1/0264 , H04M1/0277
Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.
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公开(公告)号：US11073872B2
公开(公告)日：2021-07-27
申请号：US16818680
申请日：2020-03-13
Applicant: Apple Inc.
Inventor： Andrew U. Leopold , Owen D. Hale , Daniel W. Jarvis , David A. Pakula , James B. Smith , Ian A. Spraggs , Gregory N. Stephens
IPC: G06F1/16 , H05K7/02 , H01R12/52 , H05K9/00 , H05K1/18 , H02J50/10 , H04R1/02 , H04R3/00 , H02J7/02 , G08B7/06
Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.
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