ELECTRONIC DEVICES WITH ANTENNAS AND OPTICAL COMPONENTS

    公开(公告)号:EP3901690A1

    公开(公告)日:2021-10-27

    申请号:EP21168392.5

    申请日:2021-04-14

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a frame with left and right openings that receive respective left and right optical modules that present images to a user's eyes. Each optical module may have a lens and display that presents an image through the lens. Camera support members may be coupled to respective left and right peripheral portions of the frame. Each camera support member may have openings configured to receive cameras. Antennas may be formed on a camera support member. The antennas may have metal traces on a surface of the camera support member, may have conductive structures embedded within the camera support member, and/or may have patterned metal traces on printed circuits attached to or embedded in the camera support member. The cameras may operate through portions of a display cover layer that covers an outwardly-facing display on the head-mounted housing.

    ELECTRONIC DEVICES WITH ANTENNAS AND OPTICAL COMPONENTS

    公开(公告)号:EP4332661A2

    公开(公告)日:2024-03-06

    申请号:EP24152439.6

    申请日:2021-04-14

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a frame with left and right openings that receive respective left and right optical modules that present images to a user's eyes. Each optical module may have a lens and display that presents an image through the lens. Camera support members may be coupled to respective left and right peripheral portions of the frame. Each camera support member may have openings configured to receive cameras. Antennas may be formed on a camera support member. The antennas may have metal traces on a surface of the camera support member, may have conductive structures embedded within the camera support member, and/or may have patterned metal traces on printed circuits attached to or embedded in the camera support member. The cameras may operate through portions of a display cover layer that covers an outwardly-facing display on the head-mounted housing.

    ELECTRONIC DEVICES WITH OPTICAL MODULES
    15.
    发明公开

    公开(公告)号:EP3910404A3

    公开(公告)日:2022-01-12

    申请号:EP21167915.4

    申请日:2021-04-12

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have left and right optical modules that present images to a user's eyes. Each optical module may have an optical module support structure and a lens and display coupled to the optical module support structure. The head-mounted device may have a head-mounted housing that supports the optical modules. A cover on a rear face of the head-mounted housing may have a pair of openings configured to receive the left and right optical modules. The cover may have a cover layer and left and right cover layer mounting rings respectively configured to engage with the optical module support structures of the left and right optical modules. Sets of magnets in the left and right optical modules may be configured to attract corresponding left and right vision correction lenses. Gaskets may surround the lenses in the optical modules and may prevent environmental contaminant intrusion.

    ELECTRONIC DEVICES WITH OPTICAL MODULES
    17.
    发明公开

    公开(公告)号:EP4332657A2

    公开(公告)日:2024-03-06

    申请号:EP24152609.4

    申请日:2021-04-12

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have left and right optical modules that present images to a user's eyes. Each optical module may have an optical module support structure and a lens and display coupled to the optical module support structure. The head-mounted device may have a head-mounted housing that supports the optical modules. A cover on a rear face of the head-mounted housing may have a pair of openings configured to receive the left and right optical modules. The cover may have a cover layer and left and right cover layer mounting rings respectively configured to engage with the optical module support structures of the left and right optical modules. Sets of magnets in the left and right optical modules may be configured to attract corresponding left and right vision correction lenses. Gaskets may surround the lenses in the optical modules and may prevent environmental contaminant intrusion.

    ELECTRONIC DEVICES WITH OPTICAL MODULES
    19.
    发明公开

    公开(公告)号:EP3910404A2

    公开(公告)日:2021-11-17

    申请号:EP21167915.4

    申请日:2021-04-12

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have left and right optical modules that present images to a user's eyes. Each optical module may have an optical module support structure and a lens and display coupled to the optical module support structure. The head-mounted device may have a head-mounted housing that supports the optical modules. A cover on a rear face of the head-mounted housing may have a pair of openings configured to receive the left and right optical modules. The cover may have a cover layer and left and right cover layer mounting rings respectively configured to engage with the optical module support structures of the left and right optical modules. Sets of magnets in the left and right optical modules may be configured to attract corresponding left and right vision correction lenses. Gaskets may surround the lenses in the optical modules and may prevent environmental contaminant intrusion.

    HEAD-MOUNTED ELECTRONIC DEVICE
    20.
    发明公开

    公开(公告)号:EP3901688A2

    公开(公告)日:2021-10-27

    申请号:EP21167896.6

    申请日:2021-04-12

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.

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